据业界7月4日消息三星电子负责半导体业务的设备解决方案（DS）部门当天进行改组新设HBM研发组。三星电子副社长、高性能DRAM设计专家孙永洙（音译）担任该研发组组长带领团队集中研发HBM3、HBM3E和新一代HBM4技术。

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据业界7月4日消息三星电子负责半导体业务的设备解决方案（DS）部门当天进行改组新设HBM研发组。三星电子副社长、高性能DRAM设计专家孙永洙（音译）担任该研发组组长带领团队集中研发HBM3、HBM3E和新一代HBM4技术。此外三星电子还对先进封装（AVP）团队和设备技术实验所进行重组以提升整体技术竞争力。(界面)

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