ASMPT与美光合作开发下一代键合机：HBM4生产将采用新技术，韩美半导体获226亿韩元订单

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快讯正文【ASMPT与美光合作开发下一代高带宽内存生产设备】韩国后端设备制造商ASMPT已向美光提供演示热压(TC)键合机，用于高带宽内存生产。目前，双方正联合开发用于HBM4生产的新一代键合机。美光同时从日本新川半导体和韩美半导体采购TC键合机，以支持其HBM3E的生产。由于新川半导体主要供应三星电子，未能及时满足美光的需求，美光因此选择韩美半导体作为第二供应商。今年4月，美光向韩美半导体下达了...

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