华为发力芯片设备：产线规模达224个足球场

畅谈科技06-27

市场消息，中国晶圆代工厂可能成功开发先进制程，但无法取得 ASML 最新 EUV 设备，必须依赖 DUV，华为技术将无法继续突破。最新报告指出，华为欲大力投资研发半导体设备，以能继续生产尖端芯片。Wccftech 报导，华为先进半导体设备产线建成后，占地约 224 个足球场大。因美国禁令让华为走上自给自足之路，但路上充满波折和障碍，更何况半导体业需极其庞大的资本。日本经济新闻报导，华为在上海附近...

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