每日芯片行业动态汇总（2024-06-28） 1. 荣耀CMO辟谣采用华为芯片。 2. 消息称三星寻求5万亿韩元贷款，用于芯片投资。

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每日芯片行业动态汇总（2024-06-28） 1. 荣耀CMO辟谣采用华为芯片。 2. 消息称三星寻求5万亿韩元贷款，用于芯片投资。 3. 消息称联发科打入三星旗舰机链，成Galaxy S25主芯片供应商之一。 4. 据悉三星、SK海力士已启动芯片浸没式液冷兼容测试。 5. 机构：AI芯片将在未来五年消耗全球1.5%以上的电力，产生11亿吨碳排放。 6. 安世半导体投资2亿美元对德国基地扩产。 7...

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