气派科技取得集成电路封装结构及其加工方法专利，提高了集成电路封装结构的可靠性

金融界06-21

金融界2024年6月21日消息，天眼查知识产权信息显示，气派科技股份有限公司取得一项名为“一种集成电路封装结构及其加工方法“，授权公告号CN108364928B，申请日期为2018年4月。专利摘要显示，本发明公开了一种集成电路封装结构及其加工方法，该封装结构包括基岛、芯片和封装材料，所述基岛的正面形成有银环，所述银环内沿围合形成用于安置所述芯片的安置区，所述银环的外沿与所述基岛边沿之间形成隔离区。...

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