太极实业：公司半导体业务是为 DRAM 和 NAND Flash 等集成电路产品提供封装、封装测试、模组装配和模组测试等后工序服务

和讯网06-21

同花顺（300033）金融研究中心06月21日讯，有投资者向太极实业（600667）提问，请问贵公司相关芯片产品是否能用于“车路云一体化”？公司回答表示，尊敬的投资者您好！公司半导体业务是为 DRAM 和 NAND Flash 等集成电路产品提供封装、封装测试、模组装配和模组测试等后工序服务。感谢您的关注与支持！（责任编辑：郭健东）

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