报道：台积电探索新AI芯片封装技术，允许单个晶圆放置更多组芯片

华尔街见闻06-20

据《日经亚洲》报道，台积电探索新型芯片封装方法，将采用矩形基板代替圆形晶圆，提高生产效率。行业预计未来封装尺寸将不断增大，半导体行业创新进程加速推进。据《日经亚洲》报道，近日，台积电正在探索一种全新的先进芯片封装方法，以应对人工智能带来的计算需求激增。知情人士透露，这一新方法的核心是使用510毫米乘515毫米的矩形基板，而不是当前使用的传统圆形晶圆。这种设计可以在每片基板上放置更多的芯片组，从而...

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里二外三
06-20
里二外三
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{"i18n":{"language":"zh_CN"},"isChannel":false,"data":{"share":"https://www.laohu8.com/m/news/2444607102?lang=zh_CN&edition=full","thumbnail":"https://static.tigerbbs.com/7d32e050201cd587cc51b44ec06a594c","is_english":false,"pubTime":"2024-06-20 17:36","share_image_url":"https://static.laohu8.com/e9f99090a1c2ed51c021029395664489","id":"2444607102","market":"hk","top_or_hot":-1,"title":"报道：台积电探索新AI芯片封装技术，允许单个晶圆放置更多组芯片","media":"华尔街见闻","content":"<div>\n<p>据《日经亚洲》报道，台积电探索新型芯片封装方法，将采用矩形基板代替圆形晶圆，提高生产效率。行业预计未来封装尺寸将不断增大，半导体行业创新进程加速推进。据《日经亚洲》报道，近日，台积电正在探索一种全新的先进芯片封装方法，以应对人工智能带来的计算需求激增。知情人士透露，这一新方法的核心是使用510毫米乘515毫米的矩形基板，而不是当前使用的传统圆形晶圆。这种设计可以在每片基板上放置更多的芯片组，从而...</p>\n\n<a href=\"https://wallstreetcn.com/articles/3717675\">网页链接</a>\n\n</div>\n","source":"wallstreetcn_hot_news","html":"<!DOCTYPE html>\n<html>\n<head>\n<meta http-equiv=\"Content-Type\" content=\"text/html; charset=utf-8\" />\n<meta name=\"viewport\" content=\"width=device-width,initial-scale=1.0,minimum-scale=1.0,maximum-scale=1.0,user-scalable=no\"/>\n<meta name=\"format-detection\" content=\"telephone=no,email=no,address=no\" />\n<title>报道：台积电探索新AI芯片封装技术，允许单个晶圆放置更多组芯片</title>\n<style type=\"text/css\">\na,abbr,acronym,address,applet,article,aside,audio,b,big,blockquote,body,canvas,caption,center,cite,code,dd,del,details,dfn,div,dl,dt,\nem,embed,fieldset,figcaption,figure,footer,form,h1,h2,h3,h4,h5,h6,header,hgroup,html,i,iframe,img,ins,kbd,label,legend,li,mark,menu,nav,\nobject,ol,output,p,pre,q,ruby,s,samp,section,small,span,strike,strong,sub,summary,sup,table,tbody,td,tfoot,th,thead,time,tr,tt,u,ul,var,video{ font:inherit;margin:0;padding:0;vertical-align:baseline;border:0 }\nbody{ font-size:16px; line-height:1.5; color:#999; background:transparent; }\n.wrapper{ overflow:hidden;word-break:break-all;padding:10px; }\nh1,h2{ font-weight:normal; line-height:1.35; margin-bottom:.6em; }\nh3,h4,h5,h6{ line-height:1.35; margin-bottom:1em; }\nh1{ font-size:24px; }\nh2{ font-size:20px; }\nh3{ font-size:18px; }\nh4{ font-size:16px; }\nh5{ font-size:14px; }\nh6{ font-size:12px; }\np,ul,ol,blockquote,dl,table{ margin:1.2em 0; }\nul,ol{ margin-left:2em; }\nul{ list-style:disc; }\nol{ list-style:decimal; }\nli,li p{ margin:10px 0;}\nimg{ max-width:100%;display:block;margin:0 auto 1em; }\nblockquote{ color:#B5B2B1; border-left:3px solid #aaa; padding:1em; }\nstrong,b{font-weight:bold;}\nem,i{font-style:italic;}\ntable{ width:100%;border-collapse:collapse;border-spacing:1px;margin:1em 0;font-size:.9em; }\nth,td{ padding:5px;text-align:left;border:1px solid #aaa; }\nth{ font-weight:bold;background:#5d5d5d; }\n.symbol-link{font-weight:bold;}\n/* header{ border-bottom:1px solid #494756; } */\n.title{ margin:0 0 8px;line-height:1.3;color:#ddd; }\n.meta {color:#5e5c6d;font-size:13px;margin:0 0 .5em; }\na{text-decoration:none; color:#2a4b87;}\n.meta .head { display: inline-block; overflow: hidden}\n.head .h-thumb { width: 30px; height: 30px; margin: 0; padding: 0; border-radius: 50%; float: left;}\n.head .h-content { margin: 0; padding: 0 0 0 9px; float: left;}\n.head .h-name {font-size: 13px; color: #eee; margin: 0;}\n.head .h-time {font-size: 11px; color: #7E829C; margin: 0;line-height: 11px;}\n.small {font-size: 12.5px; display: inline-block; transform: scale(0.9); -webkit-transform: scale(0.9); transform-origin: left; -webkit-transform-origin: left;}\n.smaller {font-size: 12.5px; display: inline-block; transform: scale(0.8); -webkit-transform: scale(0.8); transform-origin: left; -webkit-transform-origin: left;}\n.bt-text {font-size: 12px;margin: 1.5em 0 0 0}\n.bt-text p {margin: 0}\n</style>\n</head>\n<body>\n<div class=\"wrapper\">\n<header>\n<h2 class=\"title\">\n报道：台积电探索新AI芯片封装技术，允许单个晶圆放置更多组芯片\n</h2>\n\n<h4 class=\"meta\">\n\n\n2024-06-20 17:36 北京时间&nbsp;&nbsp;&nbsp;<a href=https://wallstreetcn.com/articles/3717675><strong>华尔街见闻</strong></a>\n\n\n</h4>\n\n</header>\n<article>\n<div>\n<p>据《日经亚洲》报道，台积电探索新型芯片封装方法，将采用矩形基板代替圆形晶圆，提高生产效率。行业预计未来封装尺寸将不断增大，半导体行业创新进程加速推进。据《日经亚洲》报道，近日，台积电正在探索一种全新的先进芯片封装方法，以应对人工智能带来的计算需求激增。知情人士透露，这一新方法的核心是使用510毫米乘515毫米的矩形基板，而不是当前使用的传统圆形晶圆。这种设计可以在每片基板上放置更多的芯片组，从而...</p>\n\n<a href=\"https://wallstreetcn.com/articles/3717675\">网页链接</a>\n\n</div>\n\n\n</article>\n</div>\n</body>\n</html>\n","isBrief":false,"type":0,"news_type":1,"symbol":"LU0572940350.SGD","symbol_name":"Janus Henderson Horizon Asian Dividend Income A3 SGD","start_time":0,"source_url":"https://wallstreetcn.com/articles/3717675","article_id":"2444607102","we_media_id":null,"thumbnails":["https://static.tigerbbs.com/7d32e050201cd587cc51b44ec06a594c"],"rights":{"source":"wallstreetcn_hot_news","url":"https://wallstreetcn.com/articles/3717675","rn_cache_url":null,"directOrigin":true},"url":"https://stock-news.laohu8.com/highlight/detail?id=2444607102","pubTimestamp":1718876173,"sourceInfo":{"source_id":"wallstreetcn_hot_news","name":"华尔街见闻"},"weMediaInfo":null,"summary":"据《日经亚洲》报道，台积电探索新型芯片封装方法，将采用矩形基板代替圆形晶圆，提高生产效率。行业预计未来封装尺寸将不断增大，半导体行业创新进程加速推进。","collect":0,"end_time":0,"defaultTopTitle":"wallstreetcn.com","property":[],"viewcount":null,"language":"zh","relate_stocks":{"LU0572940350.SGD":"Janus Henderson Horizon Asian Dividend Income A3 SGD","LU2491049909.HKD":"WELLINGTON SUSTAINABLE OUTCOMES \"A\" (HKD) ACC","BK4591":"室温超导概念","LU2491050071.SGD":"WELLINGTON SUSTAINABLE OUTCOMES \"A\" (SGDHDG) ACC","LU0792757196.USD":"TEMPLETON SHARIAH GLOBAL EQUITY FUND \"A\" (USD) ACC","LU0541502299.USD":"ALLSPRING  EMERGING MARKETS EQUITY \"I\" (USD) ACC","LU2237443382.USD":"Aberdeen Standard SICAV I - Global Dynamic Dividend A MIncA USD","BK4554":"元宇宙及AR概念","LU2491050154.USD":"WELLINGTON SUSTAINABLE OUTCOMES \"A\" (USD) ACC","LU2360032135.SGD":"ALLSPRING GLOBAL EQUITY ENHANCED INCOME \"A\" (SGDHDG) INC","LU0264606111.USD":"Janus Henderson Horizon Asian Dividend Income A2 USD","BK4532":"文艺复兴科技持仓","LU2237443549.SGD":"Aberdeen Standard SICAV I - Global Dynamic Dividend A MIncA SGD-H","LU1623119135.USD":"Natixis Mirova Global Sustainable Equity R-NPF/A USD","LU2125154778.USD":"ALLSPRING GLOBAL EQUITY ENHANCED INCOME \"A\" (USD) INC","BK4534":"瑞士信贷持仓","LU2237443622.USD":"Aberdeen Standard SICAV I - Global Dynamic Dividend A Acc USD","BK4585":"ETF&股票定投概念","LU1989764664.SGD":"CPR Invest - Global Disruptive Opportunities A2 Acc SGD-H","LU1712237335.SGD":"Natixis Mirova Global Sustainable Equity H-R-NPF/A SGD","LU2237443978.SGD":"Aberdeen Standard SICAV I - Global Dynamic Dividend A Acc SGD-H","BK4533":"AQR资本管理(全球第二大对冲基金)","LU1989764748.USD":"东方汇理环球颠覆性机遇A2 Acc","SG9999000418.SGD":"Aberdeen Standard Global Technology SGD","LU2125154935.USD":"ALLSPRING (LUX) WF GLOBAL EQUITY ENHANCED INCOME \"I\" (USD) INC","LU0572939691.SGD":"Janus Henderson Horizon Asian Dividend Income A2 SGD","LU1267930813.SGD":"FRANKLIN TEMPLETON SHARIAH GLOBAL EQUITY \"AS\" (SGD) ACC","LU0384037296.USD":"ALLIANZ ASIAN MULTI INCOME PLUS \"AT\" (USD) ACC","LU0488056044.USD":"Allianz Asian Multi Income Plus Cl AM DIS USD","LU1282649810.SGD":"Allianz Asian Multi Income Plus Cl AMg DIS H2-SGD","LU1282649067.USD":"ALLIANZ ASIAN MULTI INCOME PLUS \"AMG\" (USD) INC A","BK4527":"明星科技股","SG9999004220.SGD":"Nikko AM Shenton Asia Dividend Equity Fund  SGD","BK4550":"红杉资本持仓","LU0878005551.USD":"UBS (LUX) KEY SELEC ASIA ALLOCATION OPPORTUNITY (USD) \"P\" (USD) ACC","BK4526":"热门中概股","LU0541501648.USD":"ALLSPRING  EMERGING MARKETS EQUITY \"A\" (USD) ACC","BK4141":"半导体产品","BK4588":"碎股","BK4503":"景林资产持仓","IE00B3M56506.USD":"NEUBERGER BERMAN EMERGING MARKETS EQUITY \"A\" (USD) ACC","TSM":"台积电","BK4505":"高瓴资本持仓","LU1211504680.USD":"ALLIANZ HIGH DIVIDEND ASIA PACIFIC EQUITY \"AM\" (USD) INC","BK4581":"高盛持仓","BK4512":"苹果概念","LU2133065610.SGD":"JPMorgan Investment Funds - Global Dividend A (mth) SGD","BK4548":"巴美列捷福持仓","LU0348723411.USD":"ALLIANZ GLOBAL HI-TECH GROWTH \"A\" (USD) INC"},"translate_title":"Report: TSMC explores new AI chip packaging technology, allowing more sets of chips to be placed on a single wafer","themeId":"","isJumpTheme":false,"ttsUrl":"https://static.tigerbbs.com/d9726251c8e19fa1d5ed58be55655faf","symbols_score_info":{"TSM":1},"content_text":"据《日经亚洲》报道，台积电探索新型芯片封装方法，将采用矩形基板代替圆形晶圆，提高生产效率。行业预计未来封装尺寸将不断增大，半导体行业创新进程加速推进。据《日经亚洲》报道，近日，台积电正在探索一种全新的先进芯片封装方法，以应对人工智能带来的计算需求激增。知情人士透露，这一新方法的核心是使用510毫米乘515毫米的矩形基板，而不是当前使用的传统圆形晶圆。这种设计可以在每片基板上放置更多的芯片组，从而提高生产效率。矩形基板的有效面积比圆形晶圆大三倍多，边缘剩余的无效区域也更少。尽管这项研究仍处于早期阶段，但如果消息属实，它将标志着台积电在技术上的重要转变。此前，台积电认为使用矩形基板过于具有挑战性。为使这一新方法成功，台积电及其供应商必须投入大量时间和精力进行研发，同时需要升级或更换众多生产工具和材料。台积电目前的先进芯片堆叠和组装技术，如用于生产Nvidia、AMD、Amazon和Google的AI芯片，主要依赖于12英寸的硅晶圆，这已经是目前可用的最大尺寸。但随着芯片尺寸的不断增大和对更多内存的集成需求，当前行业标准的12英寸晶圆或在几年内就将不足以满足尖端芯片的封装需求。芯片行业的高管们表示，未来封装的尺寸只会越来越大，以便从用于AI数据中心计算的芯片中挤出更多的计算能力。然而，目前仍存在一些技术瓶颈，例如在新形状基板上涂覆光刻胶的难度。推动设备制造商改变设备设计需要像台积电这样财力雄厚的芯片制造商的支持。Bernstein Research的半导体分析师Mark Li认为，整体来看，这一技术变革可能需要五到十年的时间才能实现全面的设施升级，包括对机械臂和自动化材料处理系统的改造。除了台积电，英特尔和三星也在与供应商合作，探索面板级封装技术。随着芯片封装和测试服务提供商如力成科技，以及显示器制造商如京东方和台湾的群创光电也投入资源开发面板级芯片封装技术，半导体行业的创新和多样化进程正在加速推进。","kind":null,"is_publish_news":true,"is_publish_highlight":true,"is_publish_live":false,"is_publish_wemedia":null,"editions":null,"column":"","sentiment":"0","news_tag":"","news_rank":0,"symbols":[],"gpt_button":0},"commentList":[{"id":318937613287720,"gmtCreate":1718879203031,"gmtModify":1718879249212,"author":{"id":"3544518779726666","authorId":"3544518779726666","authorIdStr":"3544518779726666","name":"里二外三","avatar":"https://static.laohu8.com/default-avatar.jpg","vip":1,"crmLevel":1,"crmLevelSwitch":0},"htmlText":"越来越牛逼了","listText":"越来越牛逼了","text":"越来越牛逼了","images":[],"top":1,"highlighted":1,"essential":1,"paper":1,"likeSize":0,"commentSize":0,"repostSize":0,"link":"https://laohu8.com/post/318937613287720","repostId":2444607102,"repostType":2,"repost":{"id":"2444607102","pubTimestamp":1718876173,"share":"https://www.laohu8.com/m/news/2444607102?lang=&edition=full","pubTime":"2024-06-20 17:36","market":"hk","language":"zh","title":"报道：台积电探索新AI芯片封装技术，允许单个晶圆放置更多组芯片","url":"https://stock-news.laohu8.com/highlight/detail?id=2444607102","media":"华尔街见闻","summary":"据《日经亚洲》报道，台积电探索新型芯片封装方法，将采用矩形基板代替圆形晶圆，提高生产效率。行业预计未来封装尺寸将不断增大，半导体行业创新进程加速推进。","content":"<html><head></head><body><blockquote><p><strong>据《日经亚洲》报道，台积电探索新型芯片封装方法，将采用矩形基板代替圆形晶圆，提高生产效率。行业预计未来封装尺寸将不断增大，半导体行业创新进程加速推进。</strong></p></blockquote><p>据《日经亚洲》报道，近日，<a href=\"https://laohu8.com/S/TSM\">台积电</a>正在探索一种全新的先进芯片封装方法，以应对人工智能带来的计算需求激增。</p><p>知情人士透露，这一新方法的核心是使用510毫米乘515毫米的矩形基板，而不是当前使用的传统圆形晶圆。这种设计可以在每片基板上放置更多的芯片组，从而提高生产效率。矩形基板的有效面积比圆形晶圆大三倍多，边缘剩余的无效区域也更少。</p><p>尽管这项研究仍处于早期阶段，但如果消息属实，它将标志着台积电在技术上的重要转变。</p><p>此前，台积电认为使用矩形基板过于具有挑战性。为使这一新方法成功，台积电及其供应商必须投入大量时间和精力进行研发，同时需要升级或更换众多生产工具和材料。</p><p>台积电目前的先进芯片堆叠和组装技术，如用于生产Nvidia、AMD、Amazon和Google的AI芯片，主要依赖于12英寸的硅晶圆，这已经是目前可用的最大尺寸。</p><p>但随着芯片尺寸的不断增大和对更多内存的集成需求，当前行业标准的12英寸晶圆或在几年内就将不足以满足尖端芯片的封装需求。</p><p>芯片行业的高管们表示，未来封装的尺寸只会越来越大，以便从用于AI数据中心计算的芯片中挤出更多的计算能力。然而，目前仍存在一些技术瓶颈，例如在新形状基板上涂覆光刻胶的难度。推动设备制造商改变设备设计需要像台积电这样财力雄厚的芯片制造商的支持。</p><p>Bernstein Research的半导体分析师Mark Li认为，整体来看，这一技术变革可能需要五到十年的时间才能实现全面的设施升级，包括对机械臂和自动化材料处理系统的改造。</p><p>除了台积电，<a href=\"https://laohu8.com/S/INTC\">英特尔</a>和<a href=\"https://laohu8.com/S/SMSN.UK\">三星</a>也在与供应商合作，探索面板级封装技术。</p><p>随着芯片封装和测试服务提供商如力成科技，以及显示器制造商如京东方和台湾的群创光电也投入资源开发面板级芯片封装技术，半导体行业的创新和多样化进程正在加速推进。</p></body></html>","source":"wallstreetcn_hot_news","collect":0,"html":"<!DOCTYPE html>\n<html>\n<head>\n<meta http-equiv=\"Content-Type\" content=\"text/html; charset=utf-8\" />\n<meta name=\"viewport\" content=\"width=device-width,initial-scale=1.0,minimum-scale=1.0,maximum-scale=1.0,user-scalable=no\"/>\n<meta name=\"format-detection\" content=\"telephone=no,email=no,address=no\" />\n<title>报道：台积电探索新AI芯片封装技术，允许单个晶圆放置更多组芯片</title>\n<style type=\"text/css\">\na,abbr,acronym,address,applet,article,aside,audio,b,big,blockquote,body,canvas,caption,center,cite,code,dd,del,details,dfn,div,dl,dt,\nem,embed,fieldset,figcaption,figure,footer,form,h1,h2,h3,h4,h5,h6,header,hgroup,html,i,iframe,img,ins,kbd,label,legend,li,mark,menu,nav,\nobject,ol,output,p,pre,q,ruby,s,samp,section,small,span,strike,strong,sub,summary,sup,table,tbody,td,tfoot,th,thead,time,tr,tt,u,ul,var,video{ font:inherit;margin:0;padding:0;vertical-align:baseline;border:0 }\nbody{ font-size:16px; line-height:1.5; color:#999; background:transparent; }\n.wrapper{ overflow:hidden;word-break:break-all;padding:10px; }\nh1,h2{ font-weight:normal; line-height:1.35; margin-bottom:.6em; }\nh3,h4,h5,h6{ line-height:1.35; margin-bottom:1em; }\nh1{ font-size:24px; }\nh2{ font-size:20px; }\nh3{ font-size:18px; }\nh4{ font-size:16px; }\nh5{ font-size:14px; }\nh6{ font-size:12px; }\np,ul,ol,blockquote,dl,table{ margin:1.2em 0; }\nul,ol{ margin-left:2em; }\nul{ list-style:disc; }\nol{ list-style:decimal; }\nli,li p{ margin:10px 0;}\nimg{ max-width:100%;display:block;margin:0 auto 1em; }\nblockquote{ color:#B5B2B1; border-left:3px solid #aaa; padding:1em; }\nstrong,b{font-weight:bold;}\nem,i{font-style:italic;}\ntable{ width:100%;border-collapse:collapse;border-spacing:1px;margin:1em 0;font-size:.9em; }\nth,td{ padding:5px;text-align:left;border:1px solid #aaa; }\nth{ font-weight:bold;background:#5d5d5d; }\n.symbol-link{font-weight:bold;}\n/* header{ border-bottom:1px solid #494756; } */\n.title{ margin:0 0 8px;line-height:1.3;color:#ddd; }\n.meta {color:#5e5c6d;font-size:13px;margin:0 0 .5em; }\na{text-decoration:none; color:#2a4b87;}\n.meta .head { display: inline-block; overflow: hidden}\n.head .h-thumb { width: 30px; height: 30px; margin: 0; padding: 0; border-radius: 50%; float: left;}\n.head .h-content { margin: 0; padding: 0 0 0 9px; float: left;}\n.head .h-name {font-size: 13px; color: #eee; margin: 0;}\n.head .h-time {font-size: 11px; color: #7E829C; margin: 0;line-height: 11px;}\n.small {font-size: 12.5px; display: inline-block; transform: scale(0.9); -webkit-transform: scale(0.9); transform-origin: left; -webkit-transform-origin: left;}\n.smaller {font-size: 12.5px; display: inline-block; transform: scale(0.8); -webkit-transform: scale(0.8); transform-origin: left; -webkit-transform-origin: left;}\n.bt-text {font-size: 12px;margin: 1.5em 0 0 0}\n.bt-text p {margin: 0}\n</style>\n</head>\n<body>\n<div class=\"wrapper\">\n<header>\n<h2 class=\"title\">\n报道：台积电探索新AI芯片封装技术，允许单个晶圆放置更多组芯片\n</h2>\n\n<h4 class=\"meta\">\n\n\n2024-06-20 17:36 北京时间&nbsp;&nbsp;&nbsp;<a href=https://wallstreetcn.com/articles/3717675><strong>华尔街见闻</strong></a>\n\n\n</h4>\n\n</header>\n<article>\n<div>\n<p>据《日经亚洲》报道，台积电探索新型芯片封装方法，将采用矩形基板代替圆形晶圆，提高生产效率。行业预计未来封装尺寸将不断增大，半导体行业创新进程加速推进。据《日经亚洲》报道，近日，台积电正在探索一种全新的先进芯片封装方法，以应对人工智能带来的计算需求激增。知情人士透露，这一新方法的核心是使用510毫米乘515毫米的矩形基板，而不是当前使用的传统圆形晶圆。这种设计可以在每片基板上放置更多的芯片组，从而...</p>\n\n<a href=\"https://wallstreetcn.com/articles/3717675\">Web Link</a>\n\n</div>\n\n\n</article>\n</div>\n</body>\n</html>\n","type":0,"thumbnail":"https://static.tigerbbs.com/7d32e050201cd587cc51b44ec06a594c","relate_stocks":{"LU0572940350.SGD":"Janus Henderson Horizon Asian Dividend Income A3 SGD","LU2491049909.HKD":"WELLINGTON SUSTAINABLE OUTCOMES \"A\" (HKD) ACC","BK4591":"室温超导概念","LU2491050071.SGD":"WELLINGTON SUSTAINABLE OUTCOMES \"A\" (SGDHDG) ACC","LU0792757196.USD":"TEMPLETON SHARIAH GLOBAL EQUITY FUND \"A\" (USD) ACC","LU0541502299.USD":"ALLSPRING  EMERGING MARKETS EQUITY \"I\" (USD) ACC","LU2237443382.USD":"Aberdeen Standard SICAV I - Global Dynamic Dividend A MIncA USD","BK4554":"元宇宙及AR概念","LU2491050154.USD":"WELLINGTON SUSTAINABLE OUTCOMES \"A\" (USD) ACC","LU2360032135.SGD":"ALLSPRING GLOBAL EQUITY ENHANCED INCOME \"A\" (SGDHDG) INC","LU0264606111.USD":"Janus Henderson Horizon Asian Dividend Income A2 USD","BK4532":"文艺复兴科技持仓","LU2237443549.SGD":"Aberdeen Standard SICAV I - Global Dynamic Dividend A MIncA SGD-H","LU1623119135.USD":"Natixis Mirova Global Sustainable Equity R-NPF/A USD","LU2125154778.USD":"ALLSPRING GLOBAL EQUITY ENHANCED INCOME \"A\" (USD) INC","BK4534":"瑞士信贷持仓","LU2237443622.USD":"Aberdeen Standard SICAV I - Global Dynamic Dividend A Acc USD","BK4585":"ETF&股票定投概念","LU1989764664.SGD":"CPR Invest - Global Disruptive Opportunities A2 Acc SGD-H","LU1712237335.SGD":"Natixis Mirova Global Sustainable Equity H-R-NPF/A SGD","LU2237443978.SGD":"Aberdeen Standard SICAV I - Global Dynamic Dividend A Acc SGD-H","BK4533":"AQR资本管理(全球第二大对冲基金)","LU1989764748.USD":"东方汇理环球颠覆性机遇A2 Acc","SG9999000418.SGD":"Aberdeen Standard Global Technology SGD","LU2125154935.USD":"ALLSPRING (LUX) WF GLOBAL EQUITY ENHANCED INCOME \"I\" (USD) INC","LU0572939691.SGD":"Janus Henderson Horizon Asian Dividend Income A2 SGD","LU1267930813.SGD":"FRANKLIN TEMPLETON SHARIAH GLOBAL EQUITY \"AS\" (SGD) ACC","LU0384037296.USD":"ALLIANZ ASIAN MULTI INCOME PLUS \"AT\" (USD) ACC","LU0488056044.USD":"Allianz Asian Multi Income Plus Cl AM DIS USD","LU1282649810.SGD":"Allianz Asian Multi Income Plus Cl AMg DIS H2-SGD","LU1282649067.USD":"ALLIANZ ASIAN MULTI INCOME PLUS \"AMG\" (USD) INC A","BK4527":"明星科技股","SG9999004220.SGD":"Nikko AM Shenton Asia Dividend Equity Fund  SGD","BK4550":"红杉资本持仓","LU0878005551.USD":"UBS (LUX) KEY SELEC ASIA ALLOCATION OPPORTUNITY (USD) \"P\" (USD) ACC","BK4526":"热门中概股","LU0541501648.USD":"ALLSPRING  EMERGING MARKETS EQUITY \"A\" (USD) ACC","BK4141":"半导体产品","BK4588":"碎股","BK4503":"景林资产持仓","IE00B3M56506.USD":"NEUBERGER BERMAN EMERGING MARKETS EQUITY \"A\" (USD) ACC","TSM":"台积电","BK4505":"高瓴资本持仓","LU1211504680.USD":"ALLIANZ HIGH DIVIDEND ASIA PACIFIC EQUITY \"AM\" (USD) INC","BK4581":"高盛持仓","BK4512":"苹果概念","LU2133065610.SGD":"JPMorgan Investment Funds - Global Dividend A (mth) SGD","BK4548":"巴美列捷福持仓","LU0348723411.USD":"ALLIANZ GLOBAL HI-TECH GROWTH \"A\" (USD) INC"},"source_url":"https://wallstreetcn.com/articles/3717675","is_english":false,"share_image_url":"https://static.laohu8.com/e9f99090a1c2ed51c021029395664489","article_id":"2444607102","content_text":"据《日经亚洲》报道，台积电探索新型芯片封装方法，将采用矩形基板代替圆形晶圆，提高生产效率。行业预计未来封装尺寸将不断增大，半导体行业创新进程加速推进。据《日经亚洲》报道，近日，台积电正在探索一种全新的先进芯片封装方法，以应对人工智能带来的计算需求激增。知情人士透露，这一新方法的核心是使用510毫米乘515毫米的矩形基板，而不是当前使用的传统圆形晶圆。这种设计可以在每片基板上放置更多的芯片组，从而提高生产效率。矩形基板的有效面积比圆形晶圆大三倍多，边缘剩余的无效区域也更少。尽管这项研究仍处于早期阶段，但如果消息属实，它将标志着台积电在技术上的重要转变。此前，台积电认为使用矩形基板过于具有挑战性。为使这一新方法成功，台积电及其供应商必须投入大量时间和精力进行研发，同时需要升级或更换众多生产工具和材料。台积电目前的先进芯片堆叠和组装技术，如用于生产Nvidia、AMD、Amazon和Google的AI芯片，主要依赖于12英寸的硅晶圆，这已经是目前可用的最大尺寸。但随着芯片尺寸的不断增大和对更多内存的集成需求，当前行业标准的12英寸晶圆或在几年内就将不足以满足尖端芯片的封装需求。芯片行业的高管们表示，未来封装的尺寸只会越来越大，以便从用于AI数据中心计算的芯片中挤出更多的计算能力。然而，目前仍存在一些技术瓶颈，例如在新形状基板上涂覆光刻胶的难度。推动设备制造商改变设备设计需要像台积电这样财力雄厚的芯片制造商的支持。Bernstein Research的半导体分析师Mark Li认为，整体来看，这一技术变革可能需要五到十年的时间才能实现全面的设施升级，包括对机械臂和自动化材料处理系统的改造。除了台积电，英特尔和三星也在与供应商合作，探索面板级封装技术。随着芯片封装和测试服务提供商如力成科技，以及显示器制造商如京东方和台湾的群创光电也投入资源开发面板级芯片封装技术，半导体行业的创新和多样化进程正在加速推进。","news_type":1},"isVote":1,"likeStatus":false,"favoriteStatus":false,"reportStatus":false,"tweetType":1,"langContent":"CN"}],"isCommentEnd":false,"newsSizeData":{"likeSize":0,"commentSize":1,"repostSize":1,"favoriteSize":0,"likeStatus":false,"favoriteStatus":false},"APP":{"userAgent":"Mozilla/5.0 AppleWebKit/537.36 (KHTML, like Gecko; compatible; ClaudeBot/1.0; +claudebot@anthropic.com)","isDev":false,"isTTM":false,"deviceId":"web-server-community-laohu8-v3","version":"4.26.2","shortVersion":"4.26.2","platform":"web","vendor":"web","appName":"laohu8","isIOS":false,"isAndroid":false,"isTiger":false,"isTHS":false,"isWeiXin":false,"isWeiXinMini":false,"isWeiBo":false,"isQQ":false,"isBaiduSwan":false,"isBaiduBox":false,"isDingTalk":false,"isToutiao":false,"isOnePlus":false,"isHuaWei":false,"isXiaomi":false,"isXiaomiWebView":false,"isOppo":false,"isVivo":false,"isSamsung":false,"isMobile":false},"href":"/m/news/2444607102"}