每日芯片行业动态汇总（2024-06-14） 1. 日本超50%芯片制造设备流向中国。 2. 英飞凌居林200mm碳化硅晶圆厂第一阶段建设完成。

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每日芯片行业动态汇总（2024-06-14） 1. 日本超50%芯片制造设备流向中国。 2. 英飞凌居林200mm碳化硅晶圆厂第一阶段建设完成。 3. 三星发布先进芯片工艺路线图：新版2纳米制程2027年量产研发生产时间缩短20%。 4. TrendForce：合约价上涨，推升DRAM第一季营收季增5.1%至183.5亿美元。 5. 紫光国微布局无锡高新区，高可靠性芯片封装测试项目产线通线。 6...

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