恩智浦(NXPI.US)与台积电(TSM.US)附属公司将投资78亿美元在新加坡建设芯片晶圆厂

智通财经网06-05

智通财经APP获悉，恩智浦(NXPI.US)正与台积电(TSM.US)部分控股的一家公司合作，在新加坡建造一座价值78亿美元的芯片晶圆厂，这标志着这个岛国的科技雄心得到提振。台积电支持的世界先进积体电路股份有限公司(Vanguard International Semiconductor Corp.)和恩智浦周三在一份声明中表示，这两家公司将于今年下半年开始建设该工厂，并于2027年投产。总部...

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Sievers在声明中表示：“恩智浦将继续采取积极行动，确保其拥有具有竞争力的成本、供应控制和地理弹性的制造基地，以支持我们的长期增长目标。”得益于相对较低的劳动力成本、充足的技术人才以及邻近亚洲主要消费市场，东南亚正在成为科技制造业的一股力量。亚马逊(AMZN.US)、微软(MSFT.US)和英伟达(NVDA.US)等公司在这个拥有近7亿人口的地区投入了数十亿美元。新工厂将生产直径为12英寸的硅片，比世界先进在新加坡现有工厂生产的8英寸硅片更先进。全球大多数新芯片厂都使用12英寸晶圆，因为这可以提高每片晶圆的芯片产量。新工厂的晶圆将构成相对成熟的130纳米至40纳米芯片的基础，这些芯片将用于汽车、工业、消费品和移动产品的电源控制等功能。世界先进将向合资企业注入24亿美元，恩智浦将注入16亿美元，并且，两家公司已同意随后再出资19亿美元。其余资金包括第三方向合资企业提供的贷款。该工厂将由世界先进运营，将在新加坡创造1500个就业岗位。对新加坡新上任的总理黄循财而言，这也是一个潜在的利好消息。新加坡这个虽小但富裕的国家正在应对各种挑战，包括日益激烈的地区竞争。从越南到泰国的东南亚国家正在吸引更多的科技投资，邻国马来西亚上周承诺提供50多亿美元的财政支持，以吸引芯片制造商进入该国。此前，联电(UMC.US)等公司已表示将扩张在新加坡业务。在中国台湾仅次于台积电的最大芯片制造商联电正在该国建造一座价值50亿美元的晶圆制造厂。世界先进于2019年从格芯(GFS.US)手中收购了其现有的新加坡工厂。恩智浦还通过与台积电建立了名为Systems on Silicon  manufacturing  Co.的制造合作伙伴关系，在新加坡站稳了脚跟。其他在新加坡设有业务的其他芯片制造商包括格芯、美光科技(MU.US)和英飞凌科技(IFNNY.US)。","kind":null,"is_publish_news":true,"is_publish_highlight":false,"is_publish_live":null,"is_publish_wemedia":null,"editions":null,"column":"","sentiment":"0","news_tag":"","news_rank":0,"symbols":[],"gpt_button":1},"commentList":[],"isCommentEnd":true,"newsSizeData":{"likeSize":0,"commentSize":0,"repostSize":0,"favoriteSize":0,"likeStatus":false,"favoriteStatus":false},"APP":{"userAgent":"Mozilla/5.0 AppleWebKit/537.36 (KHTML, like Gecko; compatible; ClaudeBot/1.0; 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