电子：云端之下，苹果端侧AI布局加速

投资快报05-09

苹果多层次布局AI产品，成果不断发布苹果在AI布局相对低调，但是近期随着相关成果的对外发布，表明了其对AI领域的高度重视。从相关布局看，苹果布局涵盖芯片硬件层、开发者框架和工具、各类针对端侧AI的优化策略以及最上层的大模型和入口，正在全方位多层次地进行AI布局。随着6月份WWDC及后续发布会的进行，相关产品有望面世。硬件：ARM和统一内存架构业内领先，Flash-LLM突围端侧AI内存瓶颈，AI...

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Lake最高支持120GB/s的带宽。随着AI负载的增加，苹果高内存和高带宽的优势将进一步扩大。同时我们看到统一内存架构并非苹果率先提出，苹果作为芯片设计商、操作系统开发商、PC品牌的多重角色，凭借对生态的强力把控，以M1芯片为硬件基础才得到了开发者的支持，实现了CPU、GPU协作的高效性，硬件优势壁垒极高。2023年12月苹果发布Flash-LLM方案，结合存储的硬件特性，创新性提出利用闪存解决大模型运行的内存瓶颈，通过该方案端侧设备能运行的模型参数量达到了原来的2倍。同时大模型在CPU上的推理速度提高了4-5倍，GPU上推理速度提高了20-25倍，合计可将1Token的I/O延迟从2130ms降低至87ms。软件和模型：端侧模型新思路，结合使用场景的模型路线除了30B参数的MM1模型外，苹果更多在端侧模型上进行布局。2024年以来陆续发布了ReALM、Ferret-UI以及开源模型OpenELM。ReALM从智能终端与用户交互中常见的指代消解问题出发，结合AI新技术和特征工程为该类任务提出了全新的研究范式，8000万参数模型性能与GPT-4.0相当，大幅提升端侧AI的可用性。Ferret-UI更是从“如何让AI更好地理解屏幕”这一问题出发研发模型，初级任务显著优于GPT-4V。同时高级任务上GPT-4V更好的表现也展示了云端AI的优势所在，混合AI将会是AI的未来。OpenELM模型提出了“分层缩放”策略，有效分配Transformer模型每一层参数从而提高准确率，并降低约50%训练数据量，从实验结果看苹果提出的架构非常有效，为后续苹果端侧AI模型的推出打下了坚实的基础。投资建议苹果在AI领域的相关成果展现了其在端侧AI领域强大的技术储备和领先性，后续有望落地到硬件产品。建议关注:苹果供应链：立讯精密、歌尔股份、鹏鼎控股、东山精密、长盈精密、国光电器、领益智造;端侧IC：恒玄科技、晶晨股份、乐鑫科技、中科蓝讯、瑞芯微、矩芯科技;其它整机品牌：传音控股、漫步者。","kind":null,"is_publish_news":null,"is_publish_highlight":null,"is_publish_live":null,"is_publish_wemedia":null,"editions":null,"symbols":[],"gpt_button":1},"commentList":[],"isCommentEnd":true,"newsSizeData":{"likeSize":0,"commentSize":0,"repostSize":0,"favoriteSize":0,"likeStatus":false,"favoriteStatus":false},"APP":{"userAgent":"Mozilla/5.0 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