AI芯片供不应求，消息称台积电今明两年先进封装产能已被英伟达、AMD包下

IT之家05-06

IT之家 5 月 6 日消息，台媒《经济日报》消息，英伟达、AMD 两家公司重视高性能计算（HPC）市场，包下台积电今明两年 CoWoS 与 SoIC 先进封装产能。台积电对 AI 相关应用的发展前景充满信心，总裁魏哲家在 4 月份的财报会议上调整了 AI 订单的预期和营收占比，订单预期从原先的 2027 年延长到 2028 年。台积电认为，今年 AI 服务器将会带来翻倍的营收增长。他们预测，未来...

网页链接

免责声明：本文观点仅代表作者个人观点，不构成本平台的投资建议，本平台不对文章信息准确性、完整性和及时性做出任何保证，亦不对因使用或信赖文章信息引发的任何损失承担责任。

精彩评论

我们需要你的真知灼见来填补这片空白

发表看法

{"i18n":{"language":"zh_CN"},"isChannel":false,"data":{"share":"https://www.laohu8.com/m/news/2433910764?lang=zh_CN&edition=full","thumbnail":"","is_english":false,"pubTime":"2024-05-06 12:18","share_image_url":"https://static.laohu8.com/e9f99090a1c2ed51c021029395664489","id":"2433910764","market":"us","top_or_hot":-1,"title":"AI芯片供不应求，消息称台积电今明两年先进封装产能已被英伟达、AMD包下","media":"IT之家","content":"<div>\n<p>IT之家 5 月 6 日消息，台媒《经济日报》消息，英伟达、AMD 两家公司重视高性能计算（HPC）市场，包下台积电今明两年 CoWoS 与 SoIC 先进封装产能。台积电对 AI 相关应用的发展前景充满信心，总裁魏哲家在 4 月份的财报会议上调整了 AI 订单的预期和营收占比，订单预期从原先的 2027 年延长到 2028 年。台积电认为，今年 AI 服务器将会带来翻倍的营收增长。他们预测，未来...</p>\n\n<a href=\"https://tech.ifeng.com/c/8ZMSds6Xgoz\">网页链接</a>\n\n</div>\n","source":"fenghuang_stock","html":"<!DOCTYPE html>\n<html>\n<head>\n<meta http-equiv=\"Content-Type\" content=\"text/html; charset=utf-8\" />\n<meta name=\"viewport\" content=\"width=device-width,initial-scale=1.0,minimum-scale=1.0,maximum-scale=1.0,user-scalable=no\"/>\n<meta name=\"format-detection\" content=\"telephone=no,email=no,address=no\" />\n<title>AI芯片供不应求，消息称台积电今明两年先进封装产能已被英伟达、AMD包下</title>\n<style type=\"text/css\">\na,abbr,acronym,address,applet,article,aside,audio,b,big,blockquote,body,canvas,caption,center,cite,code,dd,del,details,dfn,div,dl,dt,\nem,embed,fieldset,figcaption,figure,footer,form,h1,h2,h3,h4,h5,h6,header,hgroup,html,i,iframe,img,ins,kbd,label,legend,li,mark,menu,nav,\nobject,ol,output,p,pre,q,ruby,s,samp,section,small,span,strike,strong,sub,summary,sup,table,tbody,td,tfoot,th,thead,time,tr,tt,u,ul,var,video{ font:inherit;margin:0;padding:0;vertical-align:baseline;border:0 }\nbody{ font-size:16px; line-height:1.5; color:#999; background:transparent; }\n.wrapper{ overflow:hidden;word-break:break-all;padding:10px; }\nh1,h2{ font-weight:normal; line-height:1.35; margin-bottom:.6em; }\nh3,h4,h5,h6{ line-height:1.35; margin-bottom:1em; }\nh1{ font-size:24px; }\nh2{ font-size:20px; }\nh3{ font-size:18px; }\nh4{ font-size:16px; }\nh5{ font-size:14px; }\nh6{ font-size:12px; }\np,ul,ol,blockquote,dl,table{ margin:1.2em 0; }\nul,ol{ margin-left:2em; }\nul{ list-style:disc; }\nol{ list-style:decimal; }\nli,li p{ margin:10px 0;}\nimg{ max-width:100%;display:block;margin:0 auto 1em; }\nblockquote{ color:#B5B2B1; border-left:3px solid #aaa; padding:1em; }\nstrong,b{font-weight:bold;}\nem,i{font-style:italic;}\ntable{ width:100%;border-collapse:collapse;border-spacing:1px;margin:1em 0;font-size:.9em; }\nth,td{ padding:5px;text-align:left;border:1px solid #aaa; }\nth{ font-weight:bold;background:#5d5d5d; }\n.symbol-link{font-weight:bold;}\n/* header{ border-bottom:1px solid #494756; } */\n.title{ margin:0 0 8px;line-height:1.3;color:#ddd; }\n.meta {color:#5e5c6d;font-size:13px;margin:0 0 .5em; }\na{text-decoration:none; color:#2a4b87;}\n.meta .head { display: inline-block; overflow: hidden}\n.head .h-thumb { width: 30px; height: 30px; margin: 0; padding: 0; border-radius: 50%; float: left;}\n.head .h-content { margin: 0; padding: 0 0 0 9px; float: left;}\n.head .h-name {font-size: 13px; color: #eee; margin: 0;}\n.head .h-time {font-size: 11px; color: #7E829C; margin: 0;line-height: 11px;}\n.small {font-size: 12.5px; display: inline-block; transform: scale(0.9); -webkit-transform: scale(0.9); transform-origin: left; -webkit-transform-origin: left;}\n.smaller {font-size: 12.5px; display: inline-block; transform: scale(0.8); -webkit-transform: scale(0.8); transform-origin: left; -webkit-transform-origin: left;}\n.bt-text {font-size: 12px;margin: 1.5em 0 0 0}\n.bt-text p {margin: 0}\n</style>\n</head>\n<body>\n<div class=\"wrapper\">\n<header>\n<h2 class=\"title\">\nAI芯片供不应求，消息称台积电今明两年先进封装产能已被英伟达、AMD包下\n</h2>\n\n<h4 class=\"meta\">\n\n\n2024-05-06 12:18 北京时间&nbsp;&nbsp;&nbsp;<a href=https://tech.ifeng.com/c/8ZMSds6Xgoz><strong>IT之家</strong></a>\n\n\n</h4>\n\n</header>\n<article>\n<div>\n<p>IT之家 5 月 6 日消息，台媒《经济日报》消息，英伟达、AMD 两家公司重视高性能计算（HPC）市场，包下台积电今明两年 CoWoS 与 SoIC 先进封装产能。台积电对 AI 相关应用的发展前景充满信心，总裁魏哲家在 4 月份的财报会议上调整了 AI 订单的预期和营收占比，订单预期从原先的 2027 年延长到 2028 年。台积电认为，今年 AI 服务器将会带来翻倍的营收增长。他们预测，未来...</p>\n\n<a href=\"https://tech.ifeng.com/c/8ZMSds6Xgoz\">网页链接</a>\n\n</div>\n\n\n</article>\n</div>\n</body>\n</html>\n","isBrief":false,"type":0,"news_type":1,"symbol":"LU0061475181.USD","symbol_name":"THREADNEEDLE (LUX) AMERICAN \"AU\" (USD) ACC","start_time":0,"source_url":"https://tech.ifeng.com/c/8ZMSds6Xgoz","article_id":"2433910764","we_media_id":null,"thumbnails":[],"rights":null,"url":"https://stock-news.laohu8.com/highlight/detail?id=2433910764","pubTimestamp":1714969103,"sourceInfo":{"source_id":"fenghuang_stock","name":"凤凰网"},"weMediaInfo":null,"summary":"IT之家 5 月 6 日消息，台媒《经济日报》消息，英伟达、AMD 两家公司重视高性能计算 市场，包下台积电今明两年 CoWoS 与 SoIC 先进封装产能。台积电认为，今年 AI 服务器将会带来翻倍的营收增长。英伟达、AMD 的产品供不应求，他们全力向台积电下单，以应对云服务公司的大量订单需求。为应对客户的巨大需求，台积电正在积极扩充先进封装产能。","collect":0,"end_time":0,"defaultTopTitle":"ifeng.com","property":[],"viewcount":null,"language":"zh","relate_stocks":{"LU0061475181.USD":"THREADNEEDLE (LUX) AMERICAN \"AU\" (USD) ACC","LU0316494557.USD":"FRANKLIN GLOBAL FUNDAMENTAL STRATEGIES \"A\" ACC","LU0444971666.USD":"天利全球科技基金","BK4567":"ESG概念","IE00BFSS8Q28.SGD":"Janus Henderson Balanced A Inc SGD-H","BK4585":"ETF&股票定投概念","LU1064131342.USD":"Fullerton Lux Funds - Global Absolute Alpha A Acc USD","NVDA":"英伟达","GFS":"GLOBALFOUNDRIES Inc.","LU0127658192.USD":"EASTSPRING INVESTMENTS GLOBAL TECHNOLOGY \"A\" (USD) ACC","LU2133065610.SGD":"JPMorgan Investment Funds - Global Dividend A (mth) SGD","LU0466842654.USD":"HSBC ISLAMIC GLOBAL EQUITY INDEX \"A\" (USD) ACC","BK4566":"资本集团","IE00B7KXQ091.USD":"Janus Henderson Balanced A Inc USD","LU1303367103.USD":"摩根大通多经理另类基金 A (acc)","LU0541501648.USD":"ALLSPRING  EMERGING MARKETS EQUITY \"A\" (USD) ACC","LU2098885051.SGD":"JPMorgan Funds - Multi-Manager Alternatives A (acc) SGD","LU0234570918.USD":"高盛全球核心股票组合Acc Close","IE00B19Z9505.USD":"美盛-美国大盘成长股A Acc","BK4141":"半导体产品","03145":"华夏亚洲高息股","IE00BJJMRX11.SGD":"Janus Henderson Balanced A Acc SGD","LU0264606111.USD":"Janus Henderson Horizon Asian Dividend Income A2 USD","GB00BDT5M118.USD":"天利环球扩展Alpha基金A Acc","LU0056508442.USD":"贝莱德世界科技基金A2","LU1242518857.USD":"FULLERTON LUX FUNDS - ASIA ABSOLUTE ALPHA \"I\" (USD) ACC","BK4505":"高瓴资本持仓","LU2458330169.SGD":"FRANKLIN SHARIAH TECHNOLOGY \"A\" (SGD) ACC","LU0080751232.USD":"富达环球多元动力基金A","LU2237443622.USD":"Aberdeen Standard SICAV I - Global Dynamic Dividend A Acc USD","LU2458330243.SGD":"FRANKLIN SHARIAH TECHNOLOGY \"A-H1\" (SGDHDG) ACC","BK4592":"伊斯兰概念","LU2237443978.SGD":"Aberdeen Standard SICAV I - Global Dynamic Dividend A Acc SGD-H","BK4512":"苹果概念","LU2491050154.USD":"WELLINGTON SUSTAINABLE OUTCOMES \"A\" (USD) ACC","TSM":"台积电","LU0109392836.USD":"富兰克林科技股A","LU0353189763.USD":"ALLSPRING  US ALL CAP GROWTH FUND \"I\" (USD) ACC","LU1267930813.SGD":"FRANKLIN TEMPLETON SHARIAH GLOBAL EQUITY \"AS\" (SGD) ACC","LU2264538146.SGD":"Fullerton Lux Funds - Global Absolute Alpha A Acc SGD","IE0004445015.USD":"JANUS HENDERSON BALANCED \"A2\" (USD) ACC","LU1242518931.SGD":"Fullerton Lux Funds - Asia Absolute Alpha A Acc SGD","LU1282649810.SGD":"Allianz Asian Multi Income Plus Cl AMg DIS H2-SGD","BK4591":"室温超导概念","LU0061474705.USD":"THREADNEEDLE (LUX) GLOBAL DYNAMIC REAL RETURN \"AU\" (USD) ACC","LU0878005551.USD":"UBS (LUX) KEY SELEC ASIA ALLOCATION OPPORTUNITY (USD) \"P\" (USD) ACC","IE00BWXC8680.SGD":"PINEBRIDGE US LARGE CAP RESEARCH ENHANCED \"A5\" (SGD) ACC","LU0097036916.USD":"贝莱德美国增长A2 USD","AMD":"美国超微公司","LU1852331112.SGD":"Blackrock World Technology Fund A2 SGD-H"},"translate_title":"The supply of AI chips is in short supply. It is reported that TSMC's advanced packaging production capacity will be purchased by Nvidia and AMD this year and next","themeId":null,"isJumpTheme":false,"ttsUrl":null,"symbols_score_info":{"AMD":1,"TSM":1,"NVDA":1,"GFS":1,"03145":0.6},"content_text":"IT之家 5 月 6 日消息，台媒《经济日报》消息，英伟达、AMD 两家公司重视高性能计算（HPC）市场，包下台积电今明两年 CoWoS 与 SoIC 先进封装产能。台积电对 AI 相关应用的发展前景充满信心，总裁魏哲家在 4 月份的财报会议上调整了 AI 订单的预期和营收占比，订单预期从原先的 2027 年延长到 2028 年。台积电认为，今年 AI 服务器将会带来翻倍的营收增长。他们预测，未来五年 AI 服务器的年复合增长率将达到 50%，到 2028 年将占台积电营收的 20% 以上。全球云服务公司（IT之家注：如亚马逊 AWS、微软、谷歌、Meta）正在积极投入 AI 服务器军备竞赛。英伟达、AMD 的产品供不应求，他们全力向台积电下单，以应对云服务公司的大量订单需求。为应对客户的巨大需求，台积电正在积极扩充先进封装产能。今年底台积电的 CoWoS 月产能将达到 4.5 万至 5 万片，SoIC 预计今年底月产能可达五、六千片，并在 2025 年底冲上单月 1 万片规模。英伟达目前的主力产品 H100 芯片主要采用台积电 4 纳米制程，并采用 CoWoS 先进封装，与 SK 海力士的高带宽内存（HBM）以 2.5D 封装形式提供给客户。AMD 的 MI300 系列则采用台积电 5 纳米和 6 纳米制程生产，与英伟达不同的是，AMD 先采用台积电的 SoIC 将 CPU、GPU 芯片做垂直堆叠整合，再与 HBM 做 CoWoS 先进封装。","kind":null,"is_publish_news":null,"is_publish_highlight":null,"is_publish_live":null,"is_publish_wemedia":null,"editions":null,"symbols":[],"gpt_button":1},"commentList":[],"isCommentEnd":true,"newsSizeData":{"likeSize":1,"commentSize":0,"repostSize":0,"favoriteSize":0,"likeStatus":false,"favoriteStatus":false},"APP":{"userAgent":"Mozilla/5.0 AppleWebKit/537.36 (KHTML, like Gecko; compatible; ClaudeBot/1.0; +claudebot@anthropic.com)","isDev":false,"isTTM":false,"deviceId":"web-server-community-laohu8-v3","version":"4.22.4","shortVersion":"4.22.4","platform":"web","vendor":"web","appName":"laohu8","isIOS":false,"isAndroid":false,"isTiger":false,"isTHS":false,"isWeiXin":false,"isWeiXinMini":false,"isWeiBo":false,"isQQ":false,"isBaiduSwan":false,"isBaiduBox":false,"isDingTalk":false,"isToutiao":false,"isOnePlus":false,"isHuaWei":false,"isXiaomi":false,"isXiaomiWebView":false,"isOppo":false,"isVivo":false,"isSamsung":false,"isMobile":false},"href":"/m/news/2433910764"}