据报道英特尔(INTC.US)将与14家日本公司合作开发技术以实现封装等“后端”芯片制造流程的自动化。合作企业包括电子制造商欧姆龙、雅马哈汽车、材料供应商Resonac等合作将由英特尔日本区负责人Kunimasa Suzuk领导。

智通财经05-07

据报道英特尔(INTC.US)将与14家日本公司合作开发技术以实现封装等“后端”芯片制造流程的自动化。合作企业包括电子制造商欧姆龙、雅马哈汽车、材料供应商Resonac等合作将由英特尔日本区负责人Kunimasa Suzuk领导。该集团预计将投资数百亿日元目标是在2028年实现可工作的技术。集团将在未来几年内在日本试建一条后端生产线目标是实现全自动化。集团还将寻求后端技术的标准化使制造、检测和处理...

网页链接

免责声明：本文观点仅代表作者个人观点，不构成本平台的投资建议，本平台不对文章信息准确性、完整性和及时性做出任何保证，亦不对因使用或信赖文章信息引发的任何损失承担责任。

精彩评论

我们需要你的真知灼见来填补这片空白

发表看法

{"i18n":{"language":"zh_CN"},"isChannel":false,"data":{"share":"https://www.laohu8.com/m/news/2433044324?lang=zh_CN&edition=full","thumbnail":"","is_english":false,"pubTime":"2024-05-07 00:29","share_image_url":"https://static.laohu8.com/6ca2dcdccfa2217fb20a0351f4efe814","id":"2433044324","market":"us","top_or_hot":-1,"title":"据报道英特尔(INTC.US)将与14家日本公司合作开发技术以实现封装等“后端”芯片制造流程的自动化。合作企业包括电子制造商欧姆龙、雅马哈汽车、材料供应商Resonac等合作将由英特尔日本区负责人Kunimasa Suzuk领导。","media":"智通财经","content":"<div>\n<p>据报道英特尔(INTC.US)将与14家日本公司合作开发技术以实现封装等“后端”芯片制造流程的自动化。合作企业包括电子制造商欧姆龙、雅马哈汽车、材料供应商Resonac等合作将由英特尔日本区负责人Kunimasa Suzuk领导。该集团预计将投资数百亿日元目标是在2028年实现可工作的技术。集团将在未来几年内在日本试建一条后端生产线目标是实现全自动化。集团还将寻求后端技术的标准化使制造、检测和处理...</p>\n\n<a href=\"https://www.zhitongcaijing.com/immediately.html?type=usstock\">网页链接</a>\n\n</div>\n","source":"live_zhitongcaijing","html":"<!DOCTYPE html>\n<html>\n<head>\n<meta http-equiv=\"Content-Type\" content=\"text/html; charset=utf-8\" />\n<meta name=\"viewport\" content=\"width=device-width,initial-scale=1.0,minimum-scale=1.0,maximum-scale=1.0,user-scalable=no\"/>\n<meta name=\"format-detection\" content=\"telephone=no,email=no,address=no\" />\n<title>7x24快讯</title>\n<style type=\"text/css\">\na,abbr,acronym,address,applet,article,aside,audio,b,big,blockquote,body,canvas,caption,center,cite,code,dd,del,details,dfn,div,dl,dt,\nem,embed,fieldset,figcaption,figure,footer,form,h1,h2,h3,h4,h5,h6,header,hgroup,html,i,iframe,img,ins,kbd,label,legend,li,mark,menu,nav,\nobject,ol,output,p,pre,q,ruby,s,samp,section,small,span,strike,strong,sub,summary,sup,table,tbody,td,tfoot,th,thead,time,tr,tt,u,ul,var,video{ font:inherit;margin:0;padding:0;vertical-align:baseline;border:0 }\nbody{ font-size:16px; line-height:1.5; color:#999; background:transparent; }\n.wrapper{ overflow:hidden;word-break:break-all;padding:10px; }\nh1,h2{ font-weight:normal; line-height:1.35; margin-bottom:.6em; }\nh3,h4,h5,h6{ line-height:1.35; margin-bottom:1em; }\nh1{ font-size:24px; }\nh2{ font-size:20px; }\nh3{ font-size:18px; }\nh4{ font-size:16px; }\nh5{ font-size:14px; }\nh6{ font-size:12px; }\np,ul,ol,blockquote,dl,table{ margin:1.2em 0; }\nul,ol{ margin-left:2em; }\nul{ list-style:disc; }\nol{ list-style:decimal; }\nli,li p{ margin:10px 0;}\nimg{ max-width:100%;display:block;margin:0 auto 1em; }\nblockquote{ color:#B5B2B1; border-left:3px solid #aaa; padding:1em; }\nstrong,b{font-weight:bold;}\nem,i{font-style:italic;}\ntable{ width:100%;border-collapse:collapse;border-spacing:1px;margin:1em 0;font-size:.9em; }\nth,td{ padding:5px;text-align:left;border:1px solid #aaa; }\nth{ font-weight:bold;background:#5d5d5d; }\n.symbol-link{font-weight:bold;}\n/* header{ border-bottom:1px solid #494756; } */\n.title{ margin:0 0 8px;line-height:1.3;color:#ddd; }\n.meta {color:#5e5c6d;font-size:13px;margin:0 0 .5em; }\na{text-decoration:none; color:#2a4b87;}\n.meta .head { display: inline-block; overflow: hidden}\n.head .h-thumb { width: 30px; height: 30px; margin: 0; padding: 0; border-radius: 50%; float: left;}\n.head .h-content { margin: 0; padding: 0 0 0 9px; float: left;}\n.head .h-name {font-size: 13px; color: #eee; margin: 0;}\n.head .h-time {font-size: 11px; color: #7E829C; margin: 0;line-height: 11px;}\n.small {font-size: 12.5px; display: inline-block; transform: scale(0.9); -webkit-transform: scale(0.9); transform-origin: left; -webkit-transform-origin: left;}\n.smaller {font-size: 12.5px; display: inline-block; transform: scale(0.8); -webkit-transform: scale(0.8); transform-origin: left; -webkit-transform-origin: left;}\n.bt-text {font-size: 12px;margin: 1.5em 0 0 0}\n.bt-text p {margin: 0}\n</style>\n</head>\n<body>\n<div class=\"wrapper\">\n<header>\n<h2 class=\"title\">\n7x24快讯\n</h2>\n\n<h4 class=\"meta\">\n\n\n2024-05-07 00:29 北京时间&nbsp;&nbsp;&nbsp;<a href=https://www.zhitongcaijing.com/immediately.html?type=usstock><strong>智通财经</strong></a>\n\n\n</h4>\n\n</header>\n<article>\n<div>\n<p>据报道英特尔(INTC.US)将与14家日本公司合作开发技术以实现封装等“后端”芯片制造流程的自动化。合作企业包括电子制造商欧姆龙、雅马哈汽车、材料供应商Resonac等合作将由英特尔日本区负责人Kunimasa Suzuk领导。该集团预计将投资数百亿日元目标是在2028年实现可工作的技术。集团将在未来几年内在日本试建一条后端生产线目标是实现全自动化。集团还将寻求后端技术的标准化使制造、检测和处理...</p>\n\n<a href=\"https://www.zhitongcaijing.com/immediately.html?type=usstock\">网页链接</a>\n\n</div>\n\n\n</article>\n</div>\n</body>\n</html>\n","isBrief":false,"type":0,"news_type":1,"symbol":"LU0264606111.USD","symbol_name":"Janus Henderson Horizon Asian Dividend Income A2 USD","start_time":0,"source_url":"https://www.zhitongcaijing.com/immediately.html?type=usstock","article_id":"2433044324","we_media_id":null,"thumbnails":[],"rights":null,"url":"https://stock-news.laohu8.com/highlight/detail?id=2433044324","pubTimestamp":1715012964,"sourceInfo":{"source_id":"live_zhitongcaijing","name":"智通财经网"},"weMediaInfo":null,"summary":"据报道英特尔(INTC.US)将与14家日本公司合作开发技术以实现封装等“后端”芯片制造流程的自动化。合作企业包括电子制造商欧姆龙、雅马哈汽车、材料供应商Resonac等合作将由英特尔日本区负责人Ku","collect":0,"end_time":0,"defaultTopTitle":"zhitongcaijing.com","property":[],"viewcount":null,"language":"zh","relate_stocks":{"159813":"芯片","LU0264606111.USD":"Janus Henderson Horizon Asian Dividend Income A2 USD","LU2237443382.USD":"Aberdeen Standard SICAV I - Global Dynamic Dividend A MIncA USD","LU2360032135.SGD":"ALLSPRING GLOBAL EQUITY ENHANCED INCOME \"A\" (SGDHDG) INC","LU2491050154.USD":"WELLINGTON SUSTAINABLE OUTCOMES \"A\" (USD) ACC","SMSD.UK":"三星电子","LU2237443549.SGD":"Aberdeen Standard SICAV I - Global Dynamic Dividend A MIncA SGD-H","BK4116":"互联网服务与基础架构","LU2125154778.USD":"ALLSPRING GLOBAL EQUITY ENHANCED INCOME \"A\" (USD) INC","BK4550":"红杉资本持仓","LU1623119135.USD":"Natixis Mirova Global Sustainable Equity R-NPF/A USD","EWT":"台湾ETF-iShares MSCI","BK4141":"半导体产品","LU2237443622.USD":"Aberdeen Standard SICAV I - Global Dynamic Dividend A Acc USD","LU1712237335.SGD":"Natixis Mirova Global Sustainable Equity H-R-NPF/A SGD","TSM":"台积电","LU2237443978.SGD":"Aberdeen Standard SICAV I - Global Dynamic Dividend A Acc SGD-H","SG9999000418.SGD":"Aberdeen Standard Global Technology SGD","LU0572939691.SGD":"Janus Henderson Horizon Asian Dividend Income A2 SGD","BK5113":"电脑硬件、储存设备及电脑周边","BK4512":"苹果概念","LU1282649067.USD":"ALLIANZ ASIAN MULTI INCOME PLUS \"AMG\" (USD) INC A","INTC":"英特尔","SG9999004220.SGD":"Nikko AM Shenton Asia Dividend Equity Fund  SGD","FXY":"日元ETF-CurrencyShares","LU1282649810.SGD":"Allianz Asian Multi Income Plus Cl AMg DIS H2-SGD","SSNLF":"三星电子","LU0878005551.USD":"UBS (LUX) KEY SELEC ASIA ALLOCATION OPPORTUNITY (USD) \"P\" (USD) ACC","BK4548":"巴美列捷福持仓","BK4529":"IDC概念","IE00B3M56506.USD":"NEUBERGER BERMAN EMERGING MARKETS EQUITY \"A\" (USD) ACC","03145":"华夏亚洲高息股","BK4585":"ETF&股票定投概念","BK4554":"元宇宙及AR概念","BK4532":"文艺复兴科技持仓","BK4515":"5G概念","LU2133065610.SGD":"JPMorgan Investment Funds - Global Dividend A (mth) SGD","BK4534":"瑞士信贷持仓","LU0572940350.SGD":"Janus Henderson Horizon Asian Dividend Income A3 SGD","LU0541501648.USD":"ALLSPRING  EMERGING MARKETS EQUITY \"A\" (USD) ACC","LU2491049909.HKD":"WELLINGTON SUSTAINABLE OUTCOMES \"A\" (HKD) ACC","BK4533":"AQR资本管理(全球第二大对冲基金)","LU0889566641.SGD":"FTSF - Templeton Shariah Global Equity A Acc SGD","SBAY":"数百亿","LU2491050071.SGD":"WELLINGTON SUSTAINABLE OUTCOMES \"A\" (SGDHDG) ACC","YCS":"日元ETF-ProShares两倍做空","BK4535":"淡马锡持仓"},"translate_title":"Intel (INTC.US) will reportedly cooperate with 14 Japanese companies to develop technology to automate \"back-end\" chip manufacturing processes such as packaging. Cooperative companies include electronics manufacturer Omron, Yamaha Motor, materials supplier Resonac, etc. The cooperation will be led by Kunimasa Suzuk, head of Intel Japan.","themeId":null,"isJumpTheme":false,"ttsUrl":null,"symbols_score_info":{"159813":1,"JPYmain":1,"TWmain":1,"INTC":1,"SBAY":1,"SMSD.UK":1,"SSNLF":1,"TSM":1,"USDJPY.FOREX":1,"YCS":0.6,"03145":0.6,"EWT":0.6,"FXY":0.6},"content_text":"据报道英特尔(INTC.US)将与14家日本公司合作开发技术以实现封装等“后端”芯片制造流程的自动化。合作企业包括电子制造商欧姆龙、雅马哈汽车、材料供应商Resonac等合作将由英特尔日本区负责人Kunimasa Suzuk领导。该集团预计将投资数百亿日元目标是在2028年实现可工作的技术。集团将在未来几年内在日本试建一条后端生产线目标是实现全自动化。集团还将寻求后端技术的标准化使制造、检测和处理设备由单一系统管理和控制。除英特尔项目外台积电和三星电子也已经或计划在日本建立后端生产研究中心。市场研究公司TechInsights预计后端市场今年将增长13%达到125亿美元。","kind":null,"is_publish_news":false,"is_publish_highlight":false,"is_publish_live":true,"is_publish_wemedia":null,"editions":null,"column":"","sentiment":"0","news_tag":"","news_rank":0,"symbols":[],"gpt_button":0},"commentList":[],"isCommentEnd":true,"newsSizeData":{"likeSize":0,"commentSize":0,"repostSize":0,"favoriteSize":0,"likeStatus":false,"favoriteStatus":false},"APP":{"userAgent":"Mozilla/5.0 AppleWebKit/537.36 (KHTML, like Gecko; compatible; ClaudeBot/1.0; +claudebot@anthropic.com)","isDev":false,"isTTM":false,"deviceId":"web-server-community-laohu8-v3","version":"4.26.2","shortVersion":"4.26.2","platform":"web","vendor":"web","appName":"laohu8","isIOS":false,"isAndroid":false,"isTiger":false,"isTHS":false,"isWeiXin":false,"isWeiXinMini":false,"isWeiBo":false,"isQQ":false,"isBaiduSwan":false,"isBaiduBox":false,"isDingTalk":false,"isToutiao":false,"isOnePlus":false,"isHuaWei":false,"isXiaomi":false,"isXiaomiWebView":false,"isOppo":false,"isVivo":false,"isSamsung":false,"isMobile":false},"href":"/m/news/2433044324"}