台积电系统级晶圆技术据悉将迎重大突破，有望于2027年准备就绪-36氪

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据报道，台积电系统级晶圆技术将迎来重大突破，公司表示，采用CoWoS技术的芯片堆叠版本，预计于2027年准备就绪，整合SoIC、HBM及其他零部件，打造一个强大且运算能力媲美资料中心服务器机架，或甚至整台服务器的晶圆级系统。（界面）

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