芯片法案最新受益者！美光(MU.US)获得61.4亿美元建造三座新晶圆厂

智通财经04-25

智通财经APP获悉，美国商务部已与美光(MU.US)达成初步协议，根据《芯片与科学法案》向后者提供高达61.4亿美元的直接资金。这笔拨款将支持在纽约州克莱(Clay)建设两家晶圆厂，在爱达荷州博伊西(Boise)建设一家晶圆厂，到2030年将释放约500亿美元的私人投资，这是美光未来20年在这两个州投资高达1250亿美元的第一步，以建立一个领先的内存制造生态系统。在纽约克莱，这笔资金将支持计划中的...

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