Broadcom宣布， 51.2T光学共封开关

半导体行业观察03-16

来源：内容由半导体行业观察（ID：icbank）编译自servethehome，谢谢。如果您希望可以时常见面，欢迎标星收藏哦~Broadcom Co 封装光学器件插入损耗与可插拔器件这太棒了。本周，博通宣布其 Bailly 联合封装光学开关不仅仅是一个工程原型。相反，51.2T Tomahawk 5 Bailly 开关现已向 OEM/ODM 提供样品。Broadcom 现已提供 51.2T 联合...

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联合封装光学开关样品一段时间以来，共封装光学器件一直是业界的热门话题。我们已经看到了关于如何做到这一点的多次迭代，但现在似乎有一个模型可以实现该解决方案，并且功耗节省是真实的。四年前，我们发布了第一个有关英特尔共封装光学和硅光子开关的实践。从那时起，博通就在这个领域占据了领先地位，速度得到了提高，实际的实施挑战也不断出现。快速浏览一下，博通对典型可插拔光学模块中使用的组件以及支持该模型的所有部件进行了细分。Broadcom Co 封装光学器件公告 2024 03 带可插拔光学器件的标准设备通过共同封装光学器件，高速且耗电的 PHY 无需将信号从开关芯片驱动至面板可插拔模块笼。业界使用的一个领域是交换机和可插拔模块之间的电缆连接。然而，几乎所有与我们交谈过的人都相信，共封装光学器件是 1.6T 时代及以后的未来。Broadcom 为何选择联合封装光学器件 2024 03光学器件的发展方式是对其进行简化，然后与开关硅一起封装。Broadcom Co 封装光学公告 2024 年 03 进展到今天一年前，我们报道了 所示的基于 Broadcom Tomahawk 5 的 51.2T Bailly 联合封装光学交换机。从那时起，它就从概念变成了现实。Broadcom Tomahawk 5 Bailly 51.2T 联合封装光学 CPO 开关具有共同封装光学器件的新型 Tomahawk 5 Bailly 开关使用与Tomahawk 5开关芯片共同封装的光学模块（此处显示的是其上有防尘罩）。从那里，机箱内部使用尾纤来帮助将光线照射到开关的前面板。Broadcom Tomahawk 5 Bailly Co 封装光学器件采样有趣的是，博通没有展示一些供应商正在使用的内部电缆选项，但该公司有一张关于使用传统可插拔模块的损耗来源的幻灯片。这里的另一个重要因素是，与 PCB 相比，ASIC 和基板上的光学器件之间的路径在驱动高速电信号方面的效率要高得多。一旦信号转为光纤，与典型的 2 公里 FR4 光纤传输距离相比，开关芯片和前面板之间的距离可以忽略不计。Broadcom Co 封装光学器件插入损耗与可插拔器件这里不存在的另一件事是 CPO 的光源是可插拔模块。光源是故障率较高的设备，因此它们被插入开关的外部。下面是一个Facebook Minipack式开关，前面带有 LC 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