集邦咨询：2023年第四季全球前十大晶圆代工业者营收季增7.9%达304.9亿美元

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智通财经APP获悉，TrendForce集邦咨询研究显示，2023年第四季全球前十大晶圆代工业者营收季增7.9%，达304.9亿美元，主要受惠于智能手机零部件拉货动能延续，包含中低端Smartphone AP与周边PMIC，以及Apple(AAPL.US)新机出货旺季，带动A17主芯片、周边IC如OLED DDI、CIS、PMIC等零部件。其中，台积电(TSM.US)3nm高价制程贡献营收比重...

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href=http://www.zhitongcaijing.com/content/detail/1085135.html><strong>智通财经网</strong></a>\n\n\n</h4>\n\n</header>\n<article>\n<div>\n<p>智通财经APP获悉，TrendForce集邦咨询研究显示，2023年第四季全球前十大晶圆代工业者营收季增7.9%，达304.9亿美元，主要受惠于智能手机零部件拉货动能延续，包含中低端Smartphone  AP与周边PMIC，以及Apple(AAPL.US)新机出货旺季，带动A17主芯片、周边IC如OLED  DDI、CIS、PMIC等零部件。其中，台积电(TSM.US)3nm高价制程贡献营收比重...</p>\n\n<a 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IoT）等主要应用领域出货量均下跌，使得总体营收大致与前季持平，来到约18.5亿美元。联电（UMC）偶有智能手机、PC等领域急单拉动，但受限于全球经济疲弱，客户投片态度保守及车用客户进入库存修正，第四季晶圆出货下滑，影响营收季减4.1%，约17.3亿美元。在消费性终端季节性备货红利加持下，中芯国际（SMIC）第四季营收季增3.6%，约16.8亿美元，主要是智能手机、笔电/PC等相关急单贡献，网通、一般消费性电子及车用/工控等则反之。力积电、合肥晶合集成排名上升，IFS掉出前十大第六至第十名最大变动有三，第一，力积电（PSMC）受惠于specialty  DRAM投片复苏、智能手机零部件急单等贡献营收，上升至第八名；第二，合肥晶合集成（Nexchip）获TDDI急单，以及CIS新品放量，重返前十大排行榜，位居第九名；第三，世界先进（VIS）受电视相关备货放缓，车用/工控客户启动库存修正影响，其中又以来自电源管理平台（Power  Management）的营收下滑最多，反映出以欧美日IDM为主的车用/工控需求趋于平缓，故下跌至第十名。此外，于第三季首次进榜的IFS（Intel Foundry  Service），则因CPU正处新旧产品世代交替之际、Intel备货动能不彰等因素，遭PSMC及Nexchip挤下前十大排行。其余业者如华虹集团（HuaHong  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