佳能推晶圆测量机新品MS-001 比光刻机精度更高

快科技2023-02-21

半导体制造工艺日趋复杂，为了制造出高精度的半导体元器件，需要提高套刻的精度，因而曝光前要测量的对准测量点也越来越多。如果在半导体光刻机中对数量众多的测量点进行对准测量的话，测量本身会非常耗时，进而就会降低半导体光刻机的生产效率。为此，半导体制造领域引进了晶圆测量机，将半导体光刻机的对准测量功能分离出来，以此来确保生产的高精度和效率。2月21日消息，今天佳能宣布推出半导体制造用晶圆测量机“MS-...

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