iPhone 12的A14芯片和高通X55订单由台积电通吃！明年量产

太平洋电脑网2019-12-30

[PConline资讯]12月30日消息，据外媒报道，苹果将于明年秋季推出的iPhone 12由台积电生产A14 BIONIC芯片，采用5nm制程。同时还会搭载高通SnapdragonX55调制解调器。来自供应链的消息称，高通X55采用7nm制程，晶圆代工订单由台积电通吃。据悉苹果A14芯片将在明年第二季开始量产。台积电2019年及2020年资本支出提升至140～150亿美元，用于增加5nm和...

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