苹果3nm芯片最快2023年问世：最高或集成40核CPU

雷锋网2021-11-08

作者：驭风在10月份MacBook Pro发布会释出M1 Pro及M1 Max这一手“王炸”之后，苹果并未准备停止在自研芯片上的前进步伐。据9to5Mac近日援引 The Information 的报道，苹果计划在未来几年内推出性能更强的第二代和第三代Apple Silicon芯片。其中，2022年推出的第二代Apple Silicon芯片将会采用改进版的5nm工艺，因此较当前的M1系列在...

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精彩评论

小妤1314
2021-11-08
小妤1314
看好半导体
- 神话者:
  [微笑]
T20211211017
2021-11-08
T20211211017
半导体产业有前景
- T20211211017:
  😄

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