消息称台积电正考虑在美国建造首家芯片封装工厂

新浪科技2021-06-11

北京时间6月11日晚间消息，据报道，台积电正考虑在美国再建一家先进半导体制造工厂。此举也旨在响应美国政府将更多科技供应链带入本土的愿望。报道称，该新工厂将进行芯片封装，使用先进技术将不同类型的半导体集成到晶片上。这将是台积电在本土市场以外的第一个此类设施。当前，台积电已经在亚利桑那州凤凰城建设其在美国的第一家芯片制造厂，预计投资120亿美元，于2024年投产。该工厂将生产5纳米芯片，也是目前最...

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精彩评论

狐假虎威85
2021-06-11
狐假虎威85
666
Choolin
2021-06-11
Choolin
还欠一个回复就完成任务，帮帮忙吧！
- JuXian:
  可以的话帮我把我的评论点击成精华评论吧哈哈
- Choolin:
  谢啦谢啦
- Choolin:
  就等一个回复，谢谢啦
- JuXian:
  什么任务呢

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哈哈","text":"可以的话帮我把我的评论点击成精华评论吧 哈哈","html":"可以的话帮我把我的评论点击成精华评论吧 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