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SSNLF 三星电子
休市中 11-22 16:00:00 EST 延时
资讯
新帖
简况
韩国Kospi指数上涨1.3% 三星电子领涨
环球市场播报 · 30分钟前
韩国Kospi指数上涨1.3% 三星电子领涨
三星的NAND，也被SK海力士超越了
半导体行业观察 · 09:32
三星的NAND，也被SK海力士超越了
韩媒：长鑫存储与三星电子在DRAM技术上的差距已缩小至1.5年以下
美港电讯 · 11-22
韩媒：长鑫存储与三星电子在DRAM技术上的差距已缩小至1.5年以下
韩媒：长鑫存储与三星电子在DRAM技术上的差距已缩小至1.5年以下
格隆汇 · 11-22
韩媒：长鑫存储与三星电子在DRAM技术上的差距已缩小至1.5年以下
消息称在三季度全球电视销售额中 三星电子占近30%
TechWeb · 11-21
消息称在三季度全球电视销售额中 三星电子占近30%
三星电子最大在韩工会成员否决加薪5.1%协议，谈判恐延至明年
IT之家 · 11-21
三星电子最大在韩工会成员否决加薪5.1%协议，谈判恐延至明年
三星加速HBM投资，扩大苏州厂封装产能
爱集微 · 11-21
三星加速HBM投资，扩大苏州厂封装产能
分析师King：在公司的点名时，英伟达(NVDA.O)再次提到了SK海力士和美光作为内存供应商，但重要的是，没有提到最大的内存芯片供应商三星电子。
美港电讯 · 11-21
分析师King：在公司的点名时，英伟达(NVDA.O)再次提到了SK海力士和美光作为内存供应商，但重要的是，没有提到最大的内存芯片供应商三星电子。
消息称三星电子在扩大芯片封装产能 包括苏州封装工厂
TechWeb.com.cn · 11-20
消息称三星电子在扩大芯片封装产能 包括苏州封装工厂
马斯克的AI宏图：消息称特斯拉已向SK海力士、三星表达采购意向
IT之家 · 11-20
马斯克的AI宏图：消息称特斯拉已向SK海力士、三星表达采购意向
三星电子NRD-K半导体研发综合体进机 将导入ASML High NA EUV光刻设备
美港电讯 · 11-20
三星电子NRD-K半导体研发综合体进机 将导入ASML High NA EUV光刻设备
三星电子18亿美元派息在即 韩元复苏势头或受阻
智通财经 · 11-19
三星电子18亿美元派息在即 韩元复苏势头或受阻
三星电子宣布涨薪！
半导体行业圈 · 11-18
三星电子宣布涨薪！
三星电子“市值管理”操作引发积极反响 股价两天劲升13%
媒体滚动 · 11-18
三星电子“市值管理”操作引发积极反响 股价两天劲升13%
三星电子器兴半导体研发基地已开始设备安装 计划到2030年投入20万亿韩元
TechWeb.com.cn · 11-18
三星电子器兴半导体研发基地已开始设备安装 计划到2030年投入20万亿韩元
突发！三星电子10万亿大回购！
市场资讯 · 11-18
突发！三星电子10万亿大回购！
【直击亚市】中国突传一则利好！三星电子“助攻”，黄金大反弹逼近2600
FX168 · 11-18
【直击亚市】中国突传一则利好！三星电子“助攻”，黄金大反弹逼近2600
出人意料的 70 亿美元回购计划，三星电子涨超6%，三星系跟随大涨
格隆汇 · 11-18
出人意料的 70 亿美元回购计划，三星电子涨超6%，三星系跟随大涨
三星电子因70亿美元股票回购计划上涨
格隆汇 · 11-18
三星电子因70亿美元股票回购计划上涨
存储芯片行业周度跟踪：群联称NAND原厂或将在12月减产 三星电子扩建HBM等半导体封装工厂
甬兴证券有限公司 · 11-18
存储芯片行业周度跟踪：群联称NAND原厂或将在12月减产 三星电子扩建HBM等半导体封装工厂
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公司概况
公司名称：
三星电子
所属市场：
PINK LIMITED
上市日期：
--
主营业务：
发行价格：
--
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09:24","pubTimestamp":1732238675,"startTime":"0","endTime":"0","summary":"格隆汇11月22日｜韩国《每日经济》称，中国半导体行业的崛起引人注目。10年前几乎没有值得关注的中国半导体企业，如今中芯国际、长江存储和长鑫存储等企业已成为行业重要参与者。市场研究机构Trend Force的数据显示，2023年第二季度全球晶圆代工市场中，中芯国际以5.7%的市场份额位列第三，逐步缩小与三星电子(11.5%)的差距。此外，在存储器领域，业界认为，长鑫存储与三星电子在DRAM技术上的差距已缩小至1.5年以下，而在nand芯片应用领域，长江存储与韩企的差距也缩小至一年以内。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20241122092440abd6025f&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, 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14:35","pubTimestamp":1732170900,"startTime":"0","endTime":"0","summary":"三星电子正在扩大其在国内外生产基地的投资，以加强其先进的半导体封装业务。据行业消息，三星电子在第三季度签署了一份设备采购合同，目的是扩大其在中国苏州工厂的生产设施。三星也在加速扩大韩国国内封装生产基地。该协议包括在从三星显示租赁的天安市的28万平方米土地上，建设用于HBM的先进封装设施，预计于2027年底完成。三星电子目前在天安市和温阳园区设有封装生产基地。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20241121145526abd3f887&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, 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