Cambria Global Asset Allocation ETF(GAA)_个股概要_股票价格_最新资讯_行情走势_历史数据 - 老虎社区

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GAA Cambria Global Asset Allocation ETF

已收盘 09-03 16:00:00 EDT

31.38

-0.01

-0.04%

盘后31.36

-0.02-0.06%

16:10 EDT

最高31.44	最低31.36	成交量2,793
今开31.39	昨收31.39	日振幅0.25%
总市值5,805万	流通市值5,805万	总股本185.00万
成交额8.77万	换手率0.15%	流通股本185.00万
市净率--	ROE--	每股收益0.00
52周最高31.76	52周最低26.80	市盈率--
股息1.23	股息收益率0.04	ROA--

北京优虎网络科技有限公司

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2600 的 Geekbench 6 单核跑分有望达到 2950，多核跑分有望达到 10200。至于搭载这颗芯片的手机产品，现有的爆料显示，三星 Galaxy S26 手机有可能会搭载 Exynos 2600 处理器，但不会在所有市场销售。综合来看，新一代的Exynos 2600 芯片正在推进之中，距离正式到来已经越来越近了。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20250726214028a464c22b&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, 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GAA晶圆。这也是最尖端逻辑制程从“三足鼎立”走向“四厂争霸”道路上的关键里程碑。Rapidus于2023年9月1日举行了其首座晶圆厂IIM-1的奠基仪式、2024年12月完成了洁净室准备，2025年4月1日实现了初始图案的曝光与显影，到2025年6月完成了由200多个制造单元构成的生产线。▲ IIM-1Rapidus正在开发与其2nm工艺兼容的PDK，计划2026年一季度结束前向客户交付。该企业2027年实现2nm量产的计划没有改变。","market":"hk","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://tech.ifeng.com/c/8l5bFD0oOe9","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"productRelease","news_rank":0,"length":0,"strategy_id":0,"source":"ifeng_tech","symbols":["GAA"],"gpt_icon":0},{"id":"2549314375","title":"消息称三星启动新战略，6个月内将2纳米GAA工艺良率提升至60%-70%","url":"https://stock-news.laohu8.com/highlight/detail?id=2549314375","media":"市场资讯","labels":["dataReport"],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/2549314375?lang=zh_cn&edition=full","pubTime":"2025-07-07 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纳米工艺的基本设计，并计划在未来两年内推出第三代技术，即“SF2P+”。报道称三星高管已为其各部门设定了六个月的期限，以实现上述目标。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://finance.sina.com.cn/stock/t/2025-07-07/doc-infesafa9555978.shtml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"dataReport","news_rank":0,"length":0,"strategy_id":0,"source":"sina","symbols":["GAA"],"gpt_icon":0},{"id":"2549312760","title":"1.4nm，再生变数！","url":"https://stock-news.laohu8.com/highlight/detail?id=2549312760","media":"半导体行业观察","labels":[],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/2549312760?lang=zh_cn&edition=full","pubTime":"2025-07-05 12:15","pubTimestamp":1751688946,"startTime":"0","endTime":"0","summary":"作为1.4nm赛道的三大玩家，台积电、英特尔与三星堪称大型的“三国志”，在性能与工艺的博弈中各自布局。原定今年第二季度动工的 1.4nm测试线建设也已暂缓，投资计划推迟至今年年底或明年上半年。台积电在1.4nm稳扎稳打作为行业龙头，台积电是最被寄予厚望的能在1.4nm先声夺人的企业。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN2025070512273595374033&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, 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2nm 工艺，1.4nm 工艺量产推迟至 2029 年","url":"https://stock-news.laohu8.com/highlight/detail?id=2548888734","media":"IT之家","labels":[],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/2548888734?lang=zh_cn&edition=full","pubTime":"2025-07-01 19:56","pubTimestamp":1751370980,"startTime":"0","endTime":"0","summary":"IT之家 7 月 1 日消息，在芯片市场竞争激烈的当下，三星代工似乎正在调整其战略方向。在此期间，三星将专注于 2 纳米及以上工艺的改进，以稳定良品率并使其适合行业采用。与此同时，台积电的 1.4 纳米工艺预计将于 2028 年问世，比三星提前一年。届时，三星可能仍将聚焦在 2 纳米及其衍生工艺上。","market":"hk","thumbnail":"https://k.sinaimg.cn/n/spider20250701/443/w728h515/20250701/445e-5b0b9f42f55c1344d284f633cf501c7e.jpg/w120h90l50t1e80.jpg","type":0,"news_type":0,"thumbnails":["https://k.sinaimg.cn/n/spider20250701/443/w728h515/20250701/445e-5b0b9f42f55c1344d284f633cf501c7e.jpg/w120h90l50t1e80.jpg"],"rights":{"source":"sina_tech","url":"https://tech.sina.cn/mobile/xp/2025-07-01/detail-infcypri5286120.d.html?vt=4","rn_cache_url":null,"customStyle":"body{padding-top:10px;}.art_tit_h1{#titleStyle#}a{#lv2TextColor#}.art_time, .art_cite{#sourceStyle#;} .art_cite{margin-left: 3px;}.weibo_user{#sourceStyle#; margin-bottom: 0; display: inline-block;}.weibo_time{#sourceStyle#};","selectors":".module-article, article","filters":"header, .voice2, .tags, #norm_qrcode_link_auto, .unfold-box, .action, .j_float_wbro, 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Pro技术进一步提高灵活性。不过首发的A14制程工艺不支持超级电轨架构，也就是背面供电技术，台积电会在2029年带来加入背面供电的版本，满足高性能客户端和数据中心应用的需求。","market":"hk","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://tech.ifeng.com/c/8ioLPT8DMct","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"productRelease","news_rank":0,"length":0,"strategy_id":0,"source":"fenghuang_stock","symbols":["LU2106854487.HKD","BK4505","LU0882747503.HKD","03145","LU2271345857.HKD","LU1974910355.USD","TSM","IE0004445239.USD","LU2087625088.SGD","LU2750360997.AUD","LU1868837722.USD","GAA","LU0082616367.USD","LU2023251221.USD","LU1989772923.USD","SGXZ81514606.USD","LU2237443978.SGD","LU0823414551.USD","LU1623119135.USD","LU2211815571.USD","LU2458330169.SGD","BK4548","LU2491049909.HKD","LU2663582299.SGD","IE00BQXX3F31.USD","LU0878005551.USD","LU2237443382.USD","LU0823421333.USD","LU1282649067.USD","LU0158827781.USD","BK4512","SG9999004220.SGD","LU0823421416.USD","LU0056508442.USD","LU0488056044.USD","LU0823414478.USD","LU0094547139.USD","LU0384037296.USD","BK4503","BK4554","LU0353189680.USD","LU1508157978.USD","LU0264606111.USD","BK4527","LU0719512351.SGD","IE00BHPRN162.USD","IE0004086264.USD","BK4526","LU2294711713.HKD","LU0316494557.USD"],"gpt_icon":1},{"id":"2505356580","title":"晶圆厂，大砍资本支出","url":"https://stock-news.laohu8.com/highlight/detail?id=2505356580","media":"虎嗅","labels":[],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/2505356580?lang=zh_cn&edition=full","pubTime":"2025-01-23 10:01","pubTimestamp":1737597660,"startTime":"0","endTime":"0","summary":"基于上述种种考虑，出现了前文所谈到的三星削减资本支出计划。韩媒指出，三星晶圆厂将2025年的设施投资预算设定为5万亿韩元左右，较2024年的10万亿韩元投资范围大幅下降。联电大砍37.93％资本支出作为行业领先的另一家晶圆代工厂，联电在2024年全年每股盈余为3.79元，相比2023年的4.93元减少，创近4年新低。展望未来，2025年资本支出预算规划18亿美元，低于去年的29亿美元，年减37.93％，联电预期本季毛利率将降至逾25％水准，同步下探4年新低。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20250123104237987000a9&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, 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Rapidus与IBM合作成功制造GAA晶体管原型晶圆","url":"https://stock-news.laohu8.com/highlight/detail?id=2505758108","media":"ZOL中关村在线","labels":["corporation"],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/2505758108?lang=zh_cn&edition=full","pubTime":"2025-01-21 15:21","pubTimestamp":1737444094,"startTime":"0","endTime":"0","summary":"1月21日，据外媒报道，日本先进半导体制造商Rapidus与IBM合作在美国纽约州奥尔巴尼的纳米技术综合体制造了2nm GAA（全环绕栅极）晶体管原型晶圆。此次展示表明Rapidus和IBM具备制备2nm先进工艺芯片的实力。然而，从技术验证成功到商业化量产还面临长期而困难的过程。值得一提的是，Rapidus于2024年12月18日接收了首台在日本本土使用的EUV光刻机ASML NXE:3800E。试生产将在今年4月开始，在其位于北海道千岁市的IIM-1晶圆厂进行。","market":"hk","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"sina_tech","url":"https://tech.sina.cn/mobile/xp/2025-01-22/detail-ineftrwv8523534.d.html?vt=4","rn_cache_url":null,"customStyle":"body{padding-top:10px;}.art_tit_h1{#titleStyle#}a{#lv2TextColor#}.art_time, .art_cite{#sourceStyle#;} .art_cite{margin-left: 3px;}.weibo_user{#sourceStyle#; margin-bottom: 0; display: 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GAA 原型晶圆亮相，在日试产 4 月启动","url":"https://stock-news.laohu8.com/highlight/detail?id=2505758173","media":"IT之家","labels":["corporation"],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/2505758173?lang=zh_cn&edition=full","pubTime":"2025-01-21 14:45","pubTimestamp":1737441936,"startTime":"0","endTime":"0","summary":"IT之家 1 月 21 日消息，据日媒 EE Times Japan 报道，日本先进半导体制造商 Rapidus在 2024 年 12 月 11~13 日举行的 SEMICON Japen 2024 上，展示了其与 IBM 合作在美国纽约州奥尔巴尼纳米技术综合体制造的 2nm GAA 晶体管原型晶圆。该晶圆的出现对外表明 Rapidus 与 IBM 这对技术伙伴的确具备制得 2nm 先进制程晶圆的实力，不过从制程技术验证成功到商业化量产尚需相当漫长而困难的一段爬坡之路。","market":"hk","thumbnail":"https://k.sinaimg.cn/n/spider20250121/732/w1920h1212/20250121/f8ff-0f01881f4d85a0c8390a5acf38385b91.jpg/w120h90l50t1475.jpg","type":0,"news_type":0,"thumbnails":["https://k.sinaimg.cn/n/spider20250121/732/w1920h1212/20250121/f8ff-0f01881f4d85a0c8390a5acf38385b91.jpg/w120h90l50t1475.jpg"],"rights":{"source":"sina_tech","url":"https://tech.sina.cn/mobile/xp/2025-01-22/detail-ineftmqz7996480.d.html?vt=4","rn_cache_url":null,"customStyle":"body{padding-top:10px;}.art_tit_h1{#titleStyle#}a{#lv2TextColor#}.art_time, .art_cite{#sourceStyle#;} .art_cite{margin-left: 3px;}.weibo_user{#sourceStyle#; margin-bottom: 0; display: inline-block;}.weibo_time{#sourceStyle#};","selectors":".module-article, article","filters":"header, .voice2, .tags, #norm_qrcode_link_auto, .unfold-box, .action, .j_float_wbro, 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