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GAA Cambria Global Asset Allocation ETF
休市中 02-06 16:00:00 EST
34.35
+0.48
+1.42%
盘后
34.35
-0.01
-0.01%
16:10 EST
最高
34.41
最低
34.08
成交量
5,050
今开
34.18
昨收
33.87
日振幅
0.98%
总市值
6,612万
流通市值
6,612万
总股本
192.50万
成交额
17.31万
换手率
0.26%
流通股本
192.50万
市净率
--
ROE
--
每股收益
0.00
52周最高
--
52周最低
--
市盈率
--
股息
--
股息收益率
--
ROA
--
分时
五日
日K
周K
月K
数据加载中...
北京优虎网络科技有限公司
资讯
新帖
简况
2nm芯片,开打价格战
半导体产业纵横 · 2025-09-28
2nm芯片,开打价格战
中国设备企业,全球排名第七
半导体产业纵横 · 2025-09-18
中国设备企业,全球排名第七
晶圆厂,大砍资本支出
虎嗅 · 2025-01-23
晶圆厂,大砍资本支出
2nm工艺取得突破 Rapidus与IBM合作成功制造GAA晶体管原型晶圆
ZOL中关村在线 · 2025-01-21
2nm工艺取得突破 Rapidus与IBM合作成功制造GAA晶体管原型晶圆
Rapidus 与 IBM 合作在美制造 2nm GAA 原型晶圆亮相,在日试产 4 月启动
IT之家 · 2025-01-21
Rapidus 与 IBM 合作在美制造 2nm GAA 原型晶圆亮相,在日试产 4 月启动
2nm,要来了
Ofweek光电信息网 · 2025-01-20
2nm,要来了
晶圆代工释放新信号
全球半导体观察 · 2025-01-17
晶圆代工释放新信号
0.7nm工艺,最新分享
半导体行业观察 · 2024-12-25
0.7nm工艺,最新分享
半导体未来三大支柱:先进封装、晶体管和互连
赛迪网 · 2024-12-24
半导体未来三大支柱:先进封装、晶体管和互连
2nm,胜负已分?
华尔街见闻 · 2024-12-15
2nm,胜负已分?
中国芯片出口额,突破万亿
华尔街见闻 · 2024-12-10
中国芯片出口额,突破万亿
SRAM,还没死!
半导体行业观察 · 2024-11-02
SRAM,还没死!
三星陷入四面楚歌?
财华社 · 2024-10-09
三星陷入四面楚歌?
三星晶圆代工业务陷入困境,良率不稳定、客户流失
C114通信网 · 2024-10-09
三星晶圆代工业务陷入困境,良率不稳定、客户流失
前所未有,三星关闭平泽P2、P3晶圆厂30%的先进工艺生产线
集微网 · 2024-10-04
前所未有,三星关闭平泽P2、P3晶圆厂30%的先进工艺生产线
三星代工困境加剧:良率问题导致关键零部件外流
爱集微 · 2024-09-25
三星代工困境加剧:良率问题导致关键零部件外流
涉及中国,“美国正加紧对韩施压”
牛弹琴 · 2024-09-12
涉及中国,“美国正加紧对韩施压”
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公司概况
公司名称:
Cambria Global Asset Allocation ETF
所属市场:
CBOE
上市日期:
--
主营业务:
发行价格:
--
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制程晶圆价格定为每片约3万美元,并对所有客户实行统一价格。此外,台积电收到的2nm工艺流片数量是5nm工艺的四倍,显示出市场对2nm工艺的强烈需求。进入2nm工艺时代后,三星能否成为台积电强有力的对手仍需观望。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20250928175341a6a3d5b5&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, .wx-sou","directOrigin":true},"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20250928175341a6a3d5b5&s=b","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"-2","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"tencent","symbols":["LU2360107168.USD","BK4505","BK4592","TSM","LU1066053197.SGD","LU2471134879.HKD","IE00BK4W5M84.HKD","LU0345769128.USD","LU0158827781.USD","SGXZ99366536.SGD","IE00BQXX3F31.USD","BK4605","LU0289960550.SGD","IE00BQXX3C00.GBP","BK4574","LU1917777945.USD","LU0820562030.AUD","LU1861215975.USD","IE00BJLML261.HKD","IE00BQXX3D17.EUR","LU2063271972.USD","LU1861220033.SGD","LU2249611893.SGD","TSYW.SI","LU2860962120.EUR","LU2491049909.HKD","LU0689626769.HKD","LU2089284900.SGD","03145","IE00B5TLWC47.USD","SG9999015945.SGD","BK4591","LU2237443622.USD","LU0175139822.USD","LU2471134952.CNY","SOXX","LU0541501648.USD","LU1211504680.USD","LU2360032135.SGD","LU0348723411.USD","SMH","LU0572939691.SGD","LU0541502299.USD","GAA","LU0572940350.SGD","LU2290526834.HKD","LU2471134523.USD"],"gpt_icon":1},{"id":"2568828158","title":"中国设备企业,全球排名第七","url":"https://stock-news.laohu8.com/highlight/detail?id=2568828158","media":"半导体产业纵横","labels":[],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/2568828158?lang=zh_cn&edition=full","pubTime":"2025-09-18 17:47","pubTimestamp":1758188868,"startTime":"0","endTime":"0","summary":"北方华创作为Top10中唯一的中国半导体设备厂商,2023年首次进入全球Top10,2024年排名由第八上升至第六,1H'25营收约22亿美元,排名降至第七。2026年,后端设备领域扩张势头将继续,测试设备销售额预计增长5.0%,封装设备销售额预计增长15.0%,实现连续三年增长。中国大陆在预测期内将继续领跑所有地区,不过销售额预计将从2024年创纪录的495亿美元有所下降。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20250918194409979af612&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, .wx-sou","directOrigin":true},"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20250918194409979af612&s=b","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"tencent","symbols":["LU1974910355.USD","SOXX","LU2028103732.USD","03165","BK4147","GAA","LU1861214812.USD","LU2023250504.SGD","BK4518","IE0004445239.USD","LU0061474960.USD","LU0096364046.USD","LU0889566641.SGD","LU1861219969.SGD","IE00BZ199S13.USD","LU0823434740.USD","LU1989773731.SGD","SMH","LU0792757196.USD","TEL","LU0109392836.USD","IE00B19Z9P08.USD","LU2063271972.USD","LU1868837300.USD","LU2458330243.SGD","LU1815336760.USD","IE00BQXX3C00.GBP","LU0477156797.USD","ASML","BK4588","LU0823434583.USD","BK4519","LU0130518102.USD","LU2238339852.HKD","AMAT","LU0868494617.USD","IE0004086264.USD","IE00BD6J9T35.USD","LU2023251221.USD","LU1046421795.USD","LU0957808578.USD","LU0354030438.USD","LU0354030511.USD","LU2413666699.HKD","CMP","LU0124676726.USD","IE00BQXX3F31.USD","LU2458330169.SGD","HBM"],"gpt_icon":1},{"id":"2505356580","title":"晶圆厂,大砍资本支出","url":"https://stock-news.laohu8.com/highlight/detail?id=2505356580","media":"虎嗅","labels":[],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/2505356580?lang=zh_cn&edition=full","pubTime":"2025-01-23 10:01","pubTimestamp":1737597660,"startTime":"0","endTime":"0","summary":"基于上述种种考虑,出现了前文所谈到的三星削减资本支出计划。韩媒指出,三星晶圆厂将2025年的设施投资预算设定为5万亿韩元左右,较2024年的10万亿韩元投资范围大幅下降。联电大砍37.93%资本支出作为行业领先的另一家晶圆代工厂,联电在2024年全年每股盈余为3.79元,相比2023年的4.93元减少,创近4年新低。展望未来,2025年资本支出预算规划18亿美元,低于去年的29亿美元,年减37.93%,联电预期本季毛利率将降至逾25%水准,同步下探4年新低。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20250123104237987000a9&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, .wx-sou","directOrigin":true},"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20250123104237987000a9&s=b","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"-1","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"tencent","symbols":["BK4548","LU2360032135.SGD","BK4526","LU1989764664.SGD","LU2294711713.HKD","LU0109392836.USD","LU2237443549.SGD","LU0316494557.USD","LU2491050154.USD","EPS","LU1712237335.SGD","LU1211504680.USD","LU2458330169.SGD","LU2125154935.USD","LU2237443622.USD","LU2360106780.USD","LU0143863198.USD","BK4141","LU0264606111.USD","LU1868837722.USD","SG9999000418.SGD","LU0889566641.SGD","03145","IE00BQXX3F31.USD","LU0384037296.USD","LU0348723411.USD","LU0823414478.USD","LU1282649067.USD","BK4543","IE00BYQQ9H92.USD","LU1623119135.USD","LU0541502299.USD","UMC","LU0823414551.USD","GAA","IE00BQXX3C00.GBP","LU2458330243.SGD","LU0488056044.USD","LU0792757196.USD","LU2663582299.SGD","BK4512","LU0094547139.USD","LU0082616367.USD","TSM","LU0719512351.SGD","LU1989764748.USD","BK4532","LU0143863784.USD","LU2054465674.USD","LU2237443978.SGD"],"gpt_icon":1},{"id":"2505758108","title":"2nm工艺取得突破 Rapidus与IBM合作成功制造GAA晶体管原型晶圆","url":"https://stock-news.laohu8.com/highlight/detail?id=2505758108","media":"ZOL中关村在线","labels":["corporation"],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/2505758108?lang=zh_cn&edition=full","pubTime":"2025-01-21 15:21","pubTimestamp":1737444094,"startTime":"0","endTime":"0","summary":"1月21日,据外媒报道,日本先进半导体制造商Rapidus与IBM合作在美国纽约州奥尔巴尼的纳米技术综合体制造了2nm GAA(全环绕栅极)晶体管原型晶圆。此次展示表明Rapidus和IBM具备制备2nm先进工艺芯片的实力。然而,从技术验证成功到商业化量产还面临长期而困难的过程。值得一提的是,Rapidus于2024年12月18日接收了首台在日本本土使用的EUV光刻机ASML NXE:3800E。试生产将在今年4月开始,在其位于北海道千岁市的IIM-1晶圆厂进行。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"sina_tech","url":"https://tech.sina.cn/mobile/xp/2025-01-22/detail-ineftrwv8523534.d.html?vt=4","rn_cache_url":null,"customStyle":"body{padding-top:10px;}.art_tit_h1{#titleStyle#}a{#lv2TextColor#}.art_time, .art_cite{#sourceStyle#;} .art_cite{margin-left: 3px;}.weibo_user{#sourceStyle#; margin-bottom: 0; display: inline-block;}.weibo_time{#sourceStyle#};","selectors":".module-article, article","filters":"header, .voice2, .tags, #norm_qrcode_link_auto, .unfold-box, .action, .j_float_wbro, .j_article_wbreco","directOrigin":true},"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://tech.sina.cn/mobile/xp/2025-01-22/detail-ineftrwv8523534.d.html?vt=4","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"corporation","news_rank":0,"length":0,"strategy_id":0,"source":"sina_tech","symbols":["LU1674673691.USD","BK4543","BK4538","LU1778281490.HKD","LU1674673428.USD","BK4588","LU1585245621.USD","LU1883839398.USD","LU1880398554.USD","BK4579","BK4533","BK4534","LU0321505439.SGD","BK4602","LU1430594728.SGD","BK4585","IBM","BK4134","LU1880398471.USD","LU0868494617.USD","LU0321505868.SGD","GAA","BK4575"],"gpt_icon":0},{"id":"2505758173","title":"Rapidus 与 IBM 合作在美制造 2nm GAA 原型晶圆亮相,在日试产 4 月启动","url":"https://stock-news.laohu8.com/highlight/detail?id=2505758173","media":"IT之家","labels":["corporation"],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/2505758173?lang=zh_cn&edition=full","pubTime":"2025-01-21 14:45","pubTimestamp":1737441936,"startTime":"0","endTime":"0","summary":"IT之家 1 月 21 日消息,据日媒 EE Times Japan 报道,日本先进半导体制造商 Rapidus在 2024 年 12 月 11~13 日举行的 SEMICON Japen 2024 上,展示了其与 IBM 合作在美国纽约州奥尔巴尼纳米技术综合体制造的 2nm GAA 晶体管原型晶圆。该晶圆的出现对外表明 Rapidus 与 IBM 这对技术伙伴的确具备制得 2nm 先进制程晶圆的实力,不过从制程技术验证成功到商业化量产尚需相当漫长而困难的一段爬坡之路。","market":"us","thumbnail":"https://k.sinaimg.cn/n/spider20250121/732/w1920h1212/20250121/f8ff-0f01881f4d85a0c8390a5acf38385b91.jpg/w120h90l50t1475.jpg","type":0,"news_type":0,"thumbnails":["https://k.sinaimg.cn/n/spider20250121/732/w1920h1212/20250121/f8ff-0f01881f4d85a0c8390a5acf38385b91.jpg/w120h90l50t1475.jpg"],"rights":{"source":"sina_tech","url":"https://tech.sina.cn/mobile/xp/2025-01-22/detail-ineftmqz7996480.d.html?vt=4","rn_cache_url":null,"customStyle":"body{padding-top:10px;}.art_tit_h1{#titleStyle#}a{#lv2TextColor#}.art_time, .art_cite{#sourceStyle#;} .art_cite{margin-left: 3px;}.weibo_user{#sourceStyle#; margin-bottom: 0; display: inline-block;}.weibo_time{#sourceStyle#};","selectors":".module-article, article","filters":"header, .voice2, .tags, #norm_qrcode_link_auto, .unfold-box, .action, .j_float_wbro, 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09:00","pubTimestamp":1737334800,"startTime":"0","endTime":"0","summary":"N2 技术采用该公司第一代nm片晶体管技术,在性能和功耗方面实现了全节点跨越,预计今年实现量产。台积电强调,其 2nm 工艺的性能提高了 15%,功耗降低了 30%,显著提高了节点效率。目前台积电最大的客户苹果已在其工厂预留了 2nm 芯片生产,这让苹果相对于业内其他公司占据了优势。此外,三星正在与英伟达和高通等大型科技公司合作测试 2nm 工艺,这些公司正在多元化其代工合作伙伴,三星预计将于 2025 年第一季度开始试产 2nm 工艺。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20250120091452986c13c8&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, 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晶圆厂约30%的4nm、5nm和7nm生产线。然而,三星近30%的先进工艺设备闲置是前所未有的。三星平泽工厂旨在成为世界上最大的半导体工厂,旨在管理存储生产和代工服务。不过,三星在得克萨斯州泰勒的晶圆代工项目也面临重大障碍。三星代表回应称,无法透露有关设备操作的具体细节。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://tech.ifeng.com/c/8dOzjGfJkXw","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"-2","news_top_title":null,"news_tag":"dataReport","news_rank":0,"length":0,"strategy_id":0,"source":"fenghuang_stock","symbols":["BK4554","BK4529","BK4575","INTC","LU0081259029.USD","BK4527","BK4141","BK4579","BK4588","GAA","LU0321505439.SGD","BK4512","AVGO","BK4515","BK4585","AAPL","BK4535","LU0321505868.SGD","BK4550","BK4533","BK4534"],"gpt_icon":1},{"id":"2470355412","title":"三星代工困境加剧:良率问题导致关键零部件外流","url":"https://stock-news.laohu8.com/highlight/detail?id=2470355412","media":"爱集微","labels":["corporation"],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/2470355412?lang=zh_cn&edition=full","pubTime":"2024-09-25 17:14","pubTimestamp":1727255649,"startTime":"0","endTime":"0","summary":"据报道,由于良率低和质量问题持续存在,三星电子的代工部门难以吸引大客户。与2023年的情况类似,良率和质量是影响MX部门决策的关键因素。三星的第二代3nm工艺继续面临低良率的困境,导致MX部门为整个Galaxy S25系列配备高通的骁龙8 Gen 4 AP,而不是Exynos 2500芯片组。三星的代工问题不仅限于Exynos 2500,其他产品也不再进行内部芯片生产。这一转变凸显了三星代工部门在保持先进芯片制造竞争力方面面临的更大挑战。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN202409251715479f155b6b&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, 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