Cambria Global Asset Allocation ETF(GAA)_个股概要_股票价格_最新资讯_行情走势_历史数据 - 老虎社区

应交易所要求，美/港股行情延时15分钟展示，下载APP即可免费查看实时行情。

关闭

GAA Cambria Global Asset Allocation ETF

交易中 02-09 10:30:21 EST

34.48

+0.13

+0.38%

最高34.60	最低34.33	成交量2,569
今开34.34	昨收34.35	日振幅0.79%
总市值6,637万	流通市值6,637万	总股本192.50万
成交额8.86万	换手率0.13%	流通股本192.50万
市净率--	ROE--	每股收益0.00
52周最高--	52周最低--	市盈率--
股息--	股息收益率--	ROA--

数据加载中...

北京优虎网络科技有限公司

{"stockData":{"symbol":"GAA","market":"US","secType":"STK","nameCN":"Cambria Global Asset Allocation ETF","latestPrice":34.48,"timestamp":1770650945996,"preClose":34.35,"halted":0,"volume":2569,"delay":0,"changeRate":0.0037845705967975386,"floatShares":1925001,"shares":1925001,"eps":0,"marketStatus":"交易中","change":0.13,"latestTime":"02-09 10:30:21 EST","open":34.335,"high":34.6,"low":34.33,"amount":88594.40555000001,"amplitude":0.00786,"askPrice":34.78,"askSize":1000,"bidPrice":34.07,"bidSize":100,"shortable":3,"etf":1,"ttmEps":0,"tradingStatus":2,"nextMarketStatus":{"tag":"盘后交易","tradingStatus":3,"beginTime":1770670800000},"marketStatusCode":2,"adr":0,"adrRate":0,"exchange":"CBOE","adjPreClose":34.35,"sharesOutstanding":1925001,"nav":33.78,"aum":65026533.78,"dividendRate":0.039948,"bidAskSpread":0.002844,"postHourTrading":{"tag":"盘后","latestPrice":34.345,"preClose":34.35,"latestTime":"16:10 EST","volume":7,"amount":240.45,"timestamp":1770412204332,"change":-0.005,"changeRate":-0.000146,"amplitude":0},"volumeRatio":1.973987},"requestUrl":"/m/hq/s/GAA","defaultTab":"news","newsList":[{"id":"2570846488","title":"2nm芯片，开打价格战","url":"https://stock-news.laohu8.com/highlight/detail?id=2570846488","media":"半导体产业纵横","labels":[],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/2570846488?lang=zh_cn&edition=full","pubTime":"2025-09-28 17:51","pubTimestamp":1759053080,"startTime":"0","endTime":"0","summary":"根据DigiTimes报道，为了与台积电2nm 制程竞争，三星已经将其2nm制程晶圆的代工报价下调至20000美元。据报道，台积电已将 2nm 制程晶圆价格定为每片约3万美元，并对所有客户实行统一价格。此外，台积电收到的2nm工艺流片数量是5nm工艺的四倍，显示出市场对2nm工艺的强烈需求。进入2nm工艺时代后，三星能否成为台积电强有力的对手仍需观望。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20250928175341a6a3d5b5&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, .wx-sou","directOrigin":true},"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20250928175341a6a3d5b5&s=b","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"-2","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"tencent","symbols":["LU2360032135.SGD","BK4574","SOXX","GAA","IE00BJLML261.HKD","SGXZ99366536.SGD","LU0541502299.USD","LU0175139822.USD","LU0345769128.USD","SG9999015945.SGD","SMH","LU0289960550.SGD","BK4505","LU2063271972.USD","BK4591","LU1211504680.USD","LU0541501648.USD","IE00BQXX3C00.GBP","BK4592","LU1917777945.USD","IE00BQXX3D17.EUR","LU0348723411.USD","LU2471134952.CNY","TSM","LU0158827781.USD","LU0689626769.HKD","LU2360107168.USD","LU1861220033.SGD","LU2491049909.HKD","LU0820562030.AUD","03145","LU0572940350.SGD","LU1861215975.USD","TSYW.SI","LU2471134523.USD","BK4605","LU2249611893.SGD","LU2471134879.HKD","LU2290526834.HKD","IE00BK4W5M84.HKD","LU0572939691.SGD","LU2860962120.EUR","IE00BQXX3F31.USD","IE00B5TLWC47.USD","LU2237443622.USD","LU2089284900.SGD","LU1066053197.SGD"],"gpt_icon":1},{"id":"2568828158","title":"中国设备企业，全球排名第七","url":"https://stock-news.laohu8.com/highlight/detail?id=2568828158","media":"半导体产业纵横","labels":[],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/2568828158?lang=zh_cn&edition=full","pubTime":"2025-09-18 17:47","pubTimestamp":1758188868,"startTime":"0","endTime":"0","summary":"北方华创作为Top10中唯一的中国半导体设备厂商，2023年首次进入全球Top10，2024年排名由第八上升至第六，1H'25营收约22亿美元，排名降至第七。2026年，后端设备领域扩张势头将继续，测试设备销售额预计增长5.0%，封装设备销售额预计增长15.0%，实现连续三年增长。中国大陆在预测期内将继续领跑所有地区，不过销售额预计将从2024年创纪录的495亿美元有所下降。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20250918194409979af612&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, .wx-sou","directOrigin":true},"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20250918194409979af612&s=b","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"tencent","symbols":["LU0124676726.USD","LU2458330169.SGD","LU2028103732.USD","LU0354030438.USD","LU2413666699.HKD","IE00BQXX3F31.USD","LU0792757196.USD","LU0354030511.USD","LU1046421795.USD","IE00BQXX3C00.GBP","BK4588","IE00BZ199S13.USD","LU1974910355.USD","BK4147","IE0004086264.USD","BK4518","AMAT","CMP","LU0109392836.USD","03165","IE0004445239.USD","LU0823434583.USD","ASML","LU2023250504.SGD","LU0823434740.USD","LU2063271972.USD","IE00B19Z9P08.USD","LU2023251221.USD","BK4519","LU0130518102.USD","HBM","LU1989773731.SGD","LU1868837300.USD","LU1861219969.SGD","SOXX","LU0096364046.USD","LU0061474960.USD","LU0957808578.USD","LU1861214812.USD","LU2238339852.HKD","LU2458330243.SGD","SMH","LU0868494617.USD","LU0477156797.USD","GAA","TEL","LU0889566641.SGD","LU1815336760.USD","IE00BD6J9T35.USD"],"gpt_icon":1},{"id":"2505356580","title":"晶圆厂，大砍资本支出","url":"https://stock-news.laohu8.com/highlight/detail?id=2505356580","media":"虎嗅","labels":[],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/2505356580?lang=zh_cn&edition=full","pubTime":"2025-01-23 10:01","pubTimestamp":1737597660,"startTime":"0","endTime":"0","summary":"基于上述种种考虑，出现了前文所谈到的三星削减资本支出计划。韩媒指出，三星晶圆厂将2025年的设施投资预算设定为5万亿韩元左右，较2024年的10万亿韩元投资范围大幅下降。联电大砍37.93％资本支出作为行业领先的另一家晶圆代工厂，联电在2024年全年每股盈余为3.79元，相比2023年的4.93元减少，创近4年新低。展望未来，2025年资本支出预算规划18亿美元，低于去年的29亿美元，年减37.93％，联电预期本季毛利率将降至逾25％水准，同步下探4年新低。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20250123104237987000a9&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, .wx-sou","directOrigin":true},"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20250123104237987000a9&s=b","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"-1","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"tencent","symbols":["BK4532","LU0384037296.USD","LU2458330243.SGD","BK4141","BK4543","LU2054465674.USD","LU0823414478.USD","UMC","LU0889566641.SGD","LU1623119135.USD","LU1868837722.USD","GAA","LU1989764748.USD","IE00BQXX3C00.GBP","LU2360106780.USD","IE00BQXX3F31.USD","LU0488056044.USD","LU2663582299.SGD","LU0143863784.USD","LU0109392836.USD","03145","LU0823414551.USD","LU2360032135.SGD","LU2491050154.USD","LU0094547139.USD","LU2294711713.HKD","SG9999000418.SGD","LU0792757196.USD","TSM","LU1989764664.SGD","BK4548","LU0143863198.USD","LU0541502299.USD","LU0264606111.USD","LU0316494557.USD","LU2237443622.USD","LU2237443549.SGD","LU2458330169.SGD","LU1712237335.SGD","LU2125154935.USD","LU2237443978.SGD","LU0082616367.USD","BK4526","LU0348723411.USD","EPS","LU1282649067.USD","IE00BYQQ9H92.USD","LU1211504680.USD","BK4512","LU0719512351.SGD"],"gpt_icon":1},{"id":"2505758108","title":"2nm工艺取得突破 Rapidus与IBM合作成功制造GAA晶体管原型晶圆","url":"https://stock-news.laohu8.com/highlight/detail?id=2505758108","media":"ZOL中关村在线","labels":["corporation"],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/2505758108?lang=zh_cn&edition=full","pubTime":"2025-01-21 15:21","pubTimestamp":1737444094,"startTime":"0","endTime":"0","summary":"1月21日，据外媒报道，日本先进半导体制造商Rapidus与IBM合作在美国纽约州奥尔巴尼的纳米技术综合体制造了2nm GAA（全环绕栅极）晶体管原型晶圆。此次展示表明Rapidus和IBM具备制备2nm先进工艺芯片的实力。然而，从技术验证成功到商业化量产还面临长期而困难的过程。值得一提的是，Rapidus于2024年12月18日接收了首台在日本本土使用的EUV光刻机ASML NXE:3800E。试生产将在今年4月开始，在其位于北海道千岁市的IIM-1晶圆厂进行。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"sina_tech","url":"https://tech.sina.cn/mobile/xp/2025-01-22/detail-ineftrwv8523534.d.html?vt=4","rn_cache_url":null,"customStyle":"body{padding-top:10px;}.art_tit_h1{#titleStyle#}a{#lv2TextColor#}.art_time, .art_cite{#sourceStyle#;} .art_cite{margin-left: 3px;}.weibo_user{#sourceStyle#; margin-bottom: 0; display: inline-block;}.weibo_time{#sourceStyle#};","selectors":".module-article, article","filters":"header, .voice2, .tags, #norm_qrcode_link_auto, .unfold-box, .action, .j_float_wbro, .j_article_wbreco","directOrigin":true},"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://tech.sina.cn/mobile/xp/2025-01-22/detail-ineftrwv8523534.d.html?vt=4","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"corporation","news_rank":0,"length":0,"strategy_id":0,"source":"sina_tech","symbols":["BK4602","LU0321505868.SGD","LU1430594728.SGD","LU0321505439.SGD","BK4585","IBM","GAA","BK4134","LU1880398471.USD","BK4534","BK4575","BK4533","LU1674673428.USD","BK4543","BK4588","LU1674673691.USD","LU1880398554.USD","LU1778281490.HKD","LU1585245621.USD","BK4579","LU0868494617.USD","LU1883839398.USD","BK4538"],"gpt_icon":0},{"id":"2505758173","title":"Rapidus 与 IBM 合作在美制造 2nm GAA 原型晶圆亮相，在日试产 4 月启动","url":"https://stock-news.laohu8.com/highlight/detail?id=2505758173","media":"IT之家","labels":["corporation"],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/2505758173?lang=zh_cn&edition=full","pubTime":"2025-01-21 14:45","pubTimestamp":1737441936,"startTime":"0","endTime":"0","summary":"IT之家 1 月 21 日消息，据日媒 EE Times Japan 报道，日本先进半导体制造商 Rapidus在 2024 年 12 月 11~13 日举行的 SEMICON Japen 2024 上，展示了其与 IBM 合作在美国纽约州奥尔巴尼纳米技术综合体制造的 2nm GAA 晶体管原型晶圆。该晶圆的出现对外表明 Rapidus 与 IBM 这对技术伙伴的确具备制得 2nm 先进制程晶圆的实力，不过从制程技术验证成功到商业化量产尚需相当漫长而困难的一段爬坡之路。","market":"hk","thumbnail":"https://k.sinaimg.cn/n/spider20250121/732/w1920h1212/20250121/f8ff-0f01881f4d85a0c8390a5acf38385b91.jpg/w120h90l50t1475.jpg","type":0,"news_type":0,"thumbnails":["https://k.sinaimg.cn/n/spider20250121/732/w1920h1212/20250121/f8ff-0f01881f4d85a0c8390a5acf38385b91.jpg/w120h90l50t1475.jpg"],"rights":{"source":"sina_tech","url":"https://tech.sina.cn/mobile/xp/2025-01-22/detail-ineftmqz7996480.d.html?vt=4","rn_cache_url":null,"customStyle":"body{padding-top:10px;}.art_tit_h1{#titleStyle#}a{#lv2TextColor#}.art_time, .art_cite{#sourceStyle#;} .art_cite{margin-left: 3px;}.weibo_user{#sourceStyle#; margin-bottom: 0; display: inline-block;}.weibo_time{#sourceStyle#};","selectors":".module-article, article","filters":"header, .voice2, .tags, #norm_qrcode_link_auto, .unfold-box, .action, .j_float_wbro, .j_article_wbreco","directOrigin":true},"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://tech.sina.cn/mobile/xp/2025-01-22/detail-ineftmqz7996480.d.html?vt=4","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"corporation","news_rank":0,"length":0,"strategy_id":0,"source":"sina_tech","symbols":["LU0868494617.USD","BK4534","BK4588","BK4134","LU1883839398.USD","LU1585245621.USD","BK4575","LU1674673691.USD","LU1778281490.HKD","BK4538","BK4533","BK4585","LU1880398471.USD","LU1674673428.USD","LU1880398554.USD","GAA","BK4602","LU1430594728.SGD","LU0321505868.SGD","LU0321505439.SGD","BK4543","BK4579","IBM"],"gpt_icon":0},{"id":"2504412837","title":"2nm，要来了","url":"https://stock-news.laohu8.com/highlight/detail?id=2504412837","media":"Ofweek光电信息网","labels":[],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/2504412837?lang=zh_cn&edition=full","pubTime":"2025-01-20 09:00","pubTimestamp":1737334800,"startTime":"0","endTime":"0","summary":"N2 技术采用该公司第一代nm片晶体管技术，在性能和功耗方面实现了全节点跨越，预计今年实现量产。台积电强调，其 2nm 工艺的性能提高了 15%，功耗降低了 30%，显著提高了节点效率。目前台积电最大的客户苹果已在其工厂预留了 2nm 芯片生产，这让苹果相对于业内其他公司占据了优势。此外，三星正在与英伟达和高通等大型科技公司合作测试 2nm 工艺，这些公司正在多元化其代工合作伙伴，三星预计将于 2025 年第一季度开始试产 2nm 工艺。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20250120091452986c13c8&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, .wx-sou","directOrigin":true},"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20250120091452986c13c8&s=b","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"tencent","symbols":["LU1582986359.USD","LU2602419157.SGD","INTC","LU0949170426.SGD","SG9999015978.USD","IE00B775H168.HKD","LU2413666426.HKD","NVD3.UK","NVIW.SI","TSM","IE00BHPRN162.USD","LU2023250843.SGD","NVD2.UK","LU1145028129.USD","LU0069063385.USD","NVD","IE00BMPRXQ63.HKD","NVDY","NVDS.UK","SGXZ81514606.USD","AAPL","SNVD.UK","LU0488056044.USD","NVDA","LU0175139822.USD","LU0861579265.USD","GAA","3NVD.UK","LU0965509010.AUD","NVDU","BK4512","LU1868837565.USD","LU2054465674.USD","2NVD.UK","LU1852331112.SGD","NVDX","MACW.SI","NVDS","BK4581","LU2462157665.USD","LU2063271972.USD","LU1069344957.HKD","03145","PFN","QCOM","LU1244550221.USD","IE00B4YYXB79.USD","LU2023250504.SGD","NVDD"],"gpt_icon":1},{"id":"2504187873","title":"晶圆代工释放新信号","url":"https://stock-news.laohu8.com/highlight/detail?id=2504187873","media":"全球半导体观察","labels":[],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/2504187873?lang=zh_cn&edition=full","pubTime":"2025-01-17 15:57","pubTimestamp":1737100631,"startTime":"0","endTime":"0","summary":"全球晶圆代工龙头台积电最新财报亮眼。晶圆代工大厂，再出新招全球市场研究机构TrendForce集邦咨询数据显示，在2024年第三季度的全球晶圆代工领域，台积电以64.9%的市占率一骑绝尘，稳居榜首；三星则以9.3%的份额紧随其后，位列第二；中芯国际、联电、格芯等企业也在竞争格局中占据一席之地。近期，晶圆代工行业的两大巨头——三星和台积电，均有新动态传出。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20250117155913a2254ca8&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, .wx-sou","directOrigin":true},"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20250117155913a2254ca8&s=b","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"tencent","symbols":["BK4548","LU2360032135.SGD","LU2087625088.SGD","LU0353189680.USD","LU2294711713.HKD","LU0109392836.USD","LU2237443549.SGD","LU2491050154.USD","BK4527","LU1803068979.SGD","BK4505","LU1868837565.USD","IE00B5TLWC47.USD","LU2237443622.USD","BK4554","BK4591","LU0889566641.SGD","IE00BQXX3D17.EUR","03145","IE00BQXX3F31.USD","LU0056508442.USD","LU1282649810.SGD","LU0541501648.USD","LU2357125470.USD","LU0889565833.HKD","LU0823414478.USD","BK4543","IE00BYQQ9H92.USD","IE00B3M56506.USD","LU0541502299.USD","LU0572939691.SGD","LU0823421333.USD","GAA","LU2133065610.SGD","IE00BQXX3C00.GBP","LU2458330243.SGD","BK4550","LU0488056044.USD","LU2250418816.HKD","IE00BD6J9T35.USD","LU1508157978.USD","LU1852331112.SGD","LU2249611893.SGD","LU0823421416.USD","LU0719512351.SGD","TSM","BK4532","LU0143863784.USD","LU2237443978.SGD","IE0004445239.USD"],"gpt_icon":1},{"id":"2494090579","title":"0.7nm工艺，最新分享","url":"https://stock-news.laohu8.com/highlight/detail?id=2494090579","media":"半导体行业观察","labels":[],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/2494090579?lang=zh_cn&edition=full","pubTime":"2024-12-25 14:04","pubTimestamp":1735106697,"startTime":"0","endTime":"0","summary":"要将 CFET 晶体管移至传导通道长度低于 10nm 的 A2 晶体管技术节点，Si 沟道的厚度也应缩小到 10nm 以下。在这些半导体中，原子排列在层状晶体中，单层厚度仅为 ~0.7nm，从而允许非常薄的沟道。同时，需要提高可靠性并大大降低可变性。为了减少引入 2D 材料的工作量和预期成本，imec选择将它们分阶段引入不太先进的节点和性能较低的设备中。imec开始将模块开发和 300 毫米晶圆工艺开发重点放在平面 2D 设备上。imec 研究人员的模拟表明，具有 MX2","market":"hk","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://tech.ifeng.com/c/8fb0Q11RGqd","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"fenghuang_stock","symbols":["GAA","ALD"],"gpt_icon":0},{"id":"2493071742","title":"半导体未来三大支柱：先进封装、晶体管和互连","url":"https://stock-news.laohu8.com/highlight/detail?id=2493071742","media":"赛迪网","labels":[],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/2493071742?lang=zh_cn&edition=full","pubTime":"2024-12-24 09:33","pubTimestamp":1735003983,"startTime":"0","endTime":"0","summary":"在这些前沿技术中，三个核心领域尤为值得关注：面向AI发展的先进封装、晶体管微缩技术和互连微缩技术。因此，未来需要的是新型晶体管。互连缩放的突破：钌线路随着晶体管和封装技术的持续微缩，互连已成为半导体体系中的第三个关键要素。这些互连导线负责连接数以万亿计的晶体管。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20241224101726a2064170&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, .wx-sou","directOrigin":true},"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20241224101726a2064170&s=b","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"tencent","symbols":["LU0321505439.SGD","BK4579","BK4534","BK4515","BK4527","BK4529","BK4602","LU0081259029.USD","BK4550","BK4121","BK4512","BK4575","GAA","BK4554","INTC","LU0321505868.SGD","BK4533","BK4585","BK4535","BK4141","BK4588"],"gpt_icon":1},{"id":"2491541942","title":"2nm，胜负已分？","url":"https://stock-news.laohu8.com/highlight/detail?id=2491541942","media":"华尔街见闻","labels":[],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/2491541942?lang=zh_cn&edition=full","pubTime":"2024-12-15 13:30","pubTimestamp":1734240628,"startTime":"0","endTime":"0","summary":"但是，从现状看来，这场围绕着2nm的“大战”胜负已分，台积电有望成为唯一的赢家。台积电，打响头炮最近，有关台积电2nm的消息频发。其次，在本日前，有消息透露，台积电2nm 工艺试产成功，良率达60%。早前有报道指出，台积电每片2nm晶圆的成本高达30000美金。相关报道指出，苹果和AMD有望成为台积电2nm的首批客户。从上述可以看到，这些知名Fabless大多都会选择台积电作为他们的首选，这也正是我们认为“2nm，胜负已分”的原因。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20241215133109ab792cd5&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, .wx-sou","directOrigin":true},"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20241215133109ab792cd5&s=b","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"tencent","symbols":["BK4141","PFN","IE0004086264.USD","IFS","LU0823421333.USD","LU1803068979.SGD","LU2264538146.SGD","LU1303367103.USD","IE0009356076.USD","03145","LU2237443978.SGD","BK4526","LU0198837287.USD","IE00B5TLWC47.USD","BK4527","LU1868837565.USD","LU1064131342.USD","BK4585","LU2360106780.USD","BK4503","LU1923623000.USD","GAA","IE00BQXX3C00.GBP","BK4588","LU0082616367.USD"],"gpt_icon":1},{"id":"2490958010","title":"中国芯片出口额，突破万亿","url":"https://stock-news.laohu8.com/highlight/detail?id=2490958010","media":"华尔街见闻","labels":["economic"],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/2490958010?lang=zh_cn&edition=full","pubTime":"2024-12-10 18:55","pubTimestamp":1733828153,"startTime":"0","endTime":"0","summary":"前11个月，我国自动数据处理设备及其零部件、集成电路和汽车出口呈两位数增长。集成电路出口额首次突破万亿元大关。","market":"us","thumbnail":"https://wpimg-wscn.awtmt.com/9e2d8f4a-b42b-42ce-a71f-50c4e76d0273.png","type":0,"news_type":0,"thumbnails":["https://wpimg-wscn.awtmt.com/9e2d8f4a-b42b-42ce-a71f-50c4e76d0273.png"],"rights":{"source":"wallstreetcn_hot_news","url":"https://wallstreetcn.com/articles/3736602","rn_cache_url":null,"directOrigin":true},"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://wallstreetcn.com/articles/3736602","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"economic","news_rank":0,"length":0,"strategy_id":0,"source":"wallstreetcn_hot_news","symbols":["GAA","SEMI"],"gpt_icon":0},{"id":"2480881582","title":"SRAM，还没死！","url":"https://stock-news.laohu8.com/highlight/detail?id=2480881582","media":"半导体行业观察","labels":["productRelease"],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/2480881582?lang=zh_cn&edition=full","pubTime":"2024-11-02 12:07","pubTimestamp":1730520440,"startTime":"0","endTime":"0","summary":"借助 N2，台积电终于成功缩小了 HD SRAM 位单元大小，从而提高了 SRAM 密度。台积电的 GAA 纳米片晶体管似乎是缩小 HD SRAM 位单元尺寸的主要推动因素。展望未来，对缓存和 SRAM 的需求将继续增长，因此台积电在 SRAM 单元尺寸方面的成就具有非常重要的意义。截至 2024 年 3 月，256 Mb SRAM 的平均良率已达到约 70%，较 2023 年 4 月的约 35% 大幅上升。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20241102120952ab96d552&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, .wx-sou","directOrigin":true},"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20241102120952ab96d552&s=b","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"productRelease","news_rank":0,"length":0,"strategy_id":0,"source":"tencent","symbols":["IE00BQXX3C00.GBP","LU0348723411.USD","LU0878005551.USD","BK4581","BK4591","LU2237443978.SGD","LU0384037296.USD","BK4534","LU2360032135.SGD","LU1989764748.USD","LU1623119135.USD","BK4527","LU0143863198.USD","IE00B5TLWC47.USD","LU1282649067.USD","BK4548","LU1868837722.USD","BK4550","TSM","BK4526","LU1868838027.USD","LU2054465674.USD","IE0004091025.USD","LU1989764664.SGD","LU0541501648.USD","LU0572940350.SGD","LU1803068979.SGD","GAA","LU0488056044.USD","03145","BK4554","BK4532","LU0889566641.SGD","IE00BQXX3D17.EUR","LU0823421333.USD","IE00B3M56506.USD","IE0004086264.USD","LU0264606111.USD","LU2357125470.USD","IE00BQXX3F31.USD","PPA","LU1712237335.SGD","LU1211504680.USD","LU2125154935.USD","BK4503","BK4585","LU2249611893.SGD","LU1267930813.SGD","BK4141","BK4588"],"gpt_icon":1},{"id":"2474629142","title":"三星陷入四面楚歌？","url":"https://stock-news.laohu8.com/highlight/detail?id=2474629142","media":"财华社","labels":[],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/2474629142?lang=zh_cn&edition=full","pubTime":"2024-10-09 15:15","pubTimestamp":1728458100,"startTime":"0","endTime":"0","summary":"英伟达（NVDA.US）在人工智能峰会上展示了其Blackwell平台的优越性，而且给出了相当乐观的预期，带动英伟达等一众AI芯片股大涨，英伟达于10月8日大涨4%，市值再度超越微软（MSFT.US），其主要的晶圆供应商台积电（TSM.US）涨0.83%。","market":"hk","thumbnail":"https://images.finet.hk/photoLib/title/202410_1/c7ab03c3-c65d-4959-8ffd-ba219e440315.png","type":0,"news_type":0,"thumbnails":["https://images.finet.hk/photoLib/title/202410_1/c7ab03c3-c65d-4959-8ffd-ba219e440315.png"],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://www.finet.hk/newscenter/news_content/67062d7453243c06e31e717f","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"-1","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"finet_stock","symbols":["LU2237443549.SGD","IE00B19Z8X17.USD","LU1712237335.SGD","SOC","LU2237443978.SGD","IE0034235295.USD","IE0004445239.USD","HBM","BK4503","IE00B3M56506.USD","IE00BJJMRY28.SGD","GAA","BK4168","LU0143863198.USD","LU0264606111.USD","LU0878005551.USD","LU2237443382.USD","LU0541501648.USD","LU1623119135.USD","3NVD.UK","IE00B4JS1V06.HKD","LU1989764748.USD","IE00BJJMRX11.SGD","LU2249611893.SGD","LU2133065610.SGD","LU1282649067.USD","BK4505","LU0572939691.SGD","03145","L","TSM","HK0000306685.HKD","LU2237443622.USD","2NVD.UK","IE00B775H168.HKD","IE0034235188.USD","IE00B1XK9C88.USD","BK4512","LU0143863784.USD","IE00BDCRKT87.USD","LU0061474960.USD","IE0004445015.USD","IE00BYXW3230.USD","NVDA","LU1989764664.SGD","LU0056508442.USD","HK0000306701.USD","IE0005OL40V9.USD","LU1282649810.SGD","LU0572940350.SGD"],"gpt_icon":1},{"id":"2474155253","title":"三星晶圆代工业务陷入困境，良率不稳定、客户流失","url":"https://stock-news.laohu8.com/highlight/detail?id=2474155253","media":"C114通信网","labels":["dataReport"],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/2474155253?lang=zh_cn&edition=full","pubTime":"2024-10-09 09:40","pubTimestamp":1728438000,"startTime":"0","endTime":"0","summary":"三星电子的代工业务正面临着连续亏损和战略不确定性的挑战。这一提议是在三星代工业务遭遇一系列挫折之际提出的。然而，由于良率不稳定，该工艺未能俘获客户的心。10月24日，三星电子将举办在线代工论坛，这一不同寻常的举动反映了其代工业务的艰难处境。他们进一步建议三星电子“分拆代工业务并在美国上市如何？”","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN202410090943079f3351f9&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, .wx-sou","directOrigin":true},"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN202410090943079f3351f9&s=b","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"-1","news_top_title":null,"news_tag":"dataReport","news_rank":0,"length":0,"strategy_id":0,"source":"tencent","symbols":["BK4141","BK4503","LU0541502299.USD","TSM","SSNLF","LU2125154778.USD","LU0792757196.USD","BK4550","03145","IE00BQXX3D17.EUR","LU0264606111.USD","LU0541501648.USD","BK4512","BK4526","LU0384037296.USD","LU1282649067.USD","LU0488056044.USD","AAPL","LU0823421416.USD","NVDA","LU1868837565.USD","IE00BFXG0V08.USD","BK4548","LU0109392836.USD","LU0823414478.USD","LU1868838027.USD","LU2237443549.SGD","IE00B5TLWC47.USD","BK4527","IE00BQXX3F31.USD","LU1803068979.SGD","LU1989764664.SGD","GAA","BK4505","LU0143863784.USD","BK4591","LU2237443382.USD","LU1211504680.USD","LU0348723411.USD","LU2237443978.SGD","LU0889566641.SGD","LU1989764748.USD","IE00BYQQ9H92.USD","IE0004091025.USD","LU0823414551.USD","LU1712237335.SGD","LU1868837722.USD","LU2357125470.USD","LU2249611893.SGD","LU0143863198.USD","BK4585","IE00B3M56506.USD"],"gpt_icon":1},{"id":"2472609693","title":"前所未有，三星关闭平泽P2、P3晶圆厂30%的先进工艺生产线","url":"https://stock-news.laohu8.com/highlight/detail?id=2472609693","media":"集微网","labels":["dataReport"],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/2472609693?lang=zh_cn&edition=full","pubTime":"2024-10-04 11:09","pubTimestamp":1728011361,"startTime":"0","endTime":"0","summary":"据报道，三星已关闭平泽二期 和三期 晶圆厂约30%的4nm、5nm和7nm生产线。然而，三星近30%的先进工艺设备闲置是前所未有的。三星平泽工厂旨在成为世界上最大的半导体工厂，旨在管理存储生产和代工服务。不过，三星在得克萨斯州泰勒的晶圆代工项目也面临重大障碍。三星代表回应称，无法透露有关设备操作的具体细节。","market":"hk","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://tech.ifeng.com/c/8dOzjGfJkXw","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"-2","news_top_title":null,"news_tag":"dataReport","news_rank":0,"length":0,"strategy_id":0,"source":"fenghuang_stock","symbols":["LU0081259029.USD","BK4527","BK4588","BK4512","BK4529","BK4534","BK4141","LU0321505868.SGD","BK4585","LU0321505439.SGD","BK4579","BK4515","AVGO","AAPL","INTC","BK4554","BK4535","BK4550","GAA","BK4533","BK4575"],"gpt_icon":1},{"id":"2470355412","title":"三星代工困境加剧：良率问题导致关键零部件外流","url":"https://stock-news.laohu8.com/highlight/detail?id=2470355412","media":"爱集微","labels":["corporation"],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/2470355412?lang=zh_cn&edition=full","pubTime":"2024-09-25 17:14","pubTimestamp":1727255649,"startTime":"0","endTime":"0","summary":"据报道，由于良率低和质量问题持续存在，三星电子的代工部门难以吸引大客户。与2023年的情况类似，良率和质量是影响MX部门决策的关键因素。三星的第二代3nm工艺继续面临低良率的困境，导致MX部门为整个Galaxy S25系列配备高通的骁龙8 Gen 4 AP，而不是Exynos 2500芯片组。三星的代工问题不仅限于Exynos 2500，其他产品也不再进行内部芯片生产。这一转变凸显了三星代工部门在保持先进芯片制造竞争力方面面临的更大挑战。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN202409251715479f155b6b&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, .wx-sou","directOrigin":true},"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN202409251715479f155b6b&s=b","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"-1","news_top_title":null,"news_tag":"corporation","news_rank":0,"length":0,"strategy_id":0,"source":"tencent","symbols":["IE00BQXX3C00.GBP","BK4006","LU0488056044.USD","03145","LU2237443382.USD","QCOM","LU1282649810.SGD","LU1868838027.USD","TSM","IE00B3M56506.USD","LU1623119135.USD","LU2294711713.HKD","LU0823421416.USD","BK4505","LU0348723411.USD","LU2054465674.USD","LU0823414478.USD","LU1868837565.USD","BK4141","LU2237443622.USD","LU2125154935.USD","IE00B5TLWC47.USD","LU1989764748.USD","LU2357125470.USD","IE0004086264.USD","BK4503","LU0264606111.USD","LU1803068979.SGD","LU0541501648.USD","LU2133065610.SGD","LU0143863784.USD","IE00BQXX3D17.EUR","BK4512","GAA","LU1282649067.USD","IE0004091025.USD","LU1989764664.SGD","IE00BYQQ9H92.USD","MX","LU0823421333.USD","BK4526","AP","LU0572940350.SGD","LU0792757196.USD","BK4581","IE00BFXG0V08.USD","BK4550","LU1267930813.SGD","LU2237443549.SGD","BK4518","LU0878005551.USD"],"gpt_icon":1},{"id":"2466295782","title":"涉及中国，“美国正加紧对韩施压”","url":"https://stock-news.laohu8.com/highlight/detail?id=2466295782","media":"牛弹琴","labels":[],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/2466295782?lang=zh_cn&edition=full","pubTime":"2024-09-12 07:21","pubTimestamp":1726096860,"startTime":"0","endTime":"0","summary":"中方此前多次就美国对华芯片出口管制表明立场，坚决反对美方胁迫其他国家搞对华出口限制。据韩联社此前报道，自2022年10月美国针对中国加强半导体出口管制以来，美国一直在向盟友施压，要求实施类似的出口管制。据消息人士透露，起初，半导体技术水平较高的荷兰和日本是美国的施压对象，但从去年下半年开始，美方对韩方施压力度愈发增强，甚至点名韩国的特定企业，将韩国对华半导体设备出口当成问题。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"http://mp.weixin.qq.com/s?__biz=MzA5OTk4NDYwMw==&mid=2651558752&idx=6&sn=2e9864da248e1e57092dc8338acea291&chksm=8a01912c3806e8ed6f244c8704a3a52fb5f480aee5276753a58ef15319916cee4001fcf40937&scene=0#rd","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"weixin_highlight","symbols":["BK4168","GAA","HBM"],"gpt_icon":0}],"profile":{"websiteUrl":"http://www.cambriafunds.com/gaa.aspx","stockEarnings":[{"period":"1week","weight":0.0096},{"period":"1month","weight":0.0511},{"period":"3month","weight":0.0771},{"period":"6month","weight":0.1156},{"period":"1year","weight":0.1762},{"period":"ytd","weight":0.0566}],"compareEarnings":[{"period":"1week","weight":-0.002},{"period":"1month","weight":0.0015},{"period":"3month","weight":0.0293},{"period":"6month","weight":0.0839},{"period":"1year","weight":0.139},{"period":"ytd","weight":0.0128}],"compareStock":{"symbol":"SPY","name":"标普500ETF"},"yearOnYearQuotes":[{"month":1,"riseRate":0.666667,"avgChangeRate":0.012734},{"month":2,"riseRate":0.666667,"avgChangeRate":0.000725},{"month":3,"riseRate":0.545455,"avgChangeRate":-0.008033},{"month":4,"riseRate":0.6,"avgChangeRate":0.007702},{"month":5,"riseRate":0.6,"avgChangeRate":0.009098},{"month":6,"riseRate":0.454545,"avgChangeRate":-0.0009},{"month":7,"riseRate":0.818182,"avgChangeRate":0.012873},{"month":8,"riseRate":0.545455,"avgChangeRate":-0.000968},{"month":9,"riseRate":0.454545,"avgChangeRate":-0.015553},{"month":10,"riseRate":0.545455,"avgChangeRate":0.003479},{"month":11,"riseRate":0.636364,"avgChangeRate":0.014061},{"month":12,"riseRate":0.636364,"avgChangeRate":-0.000159}],"exchange":"CBOE","name":"Cambria Global Asset Allocation ETF","nameEN":"Cambria Global Asset Allocation ETF"},"APP":{"userAgent":"Mozilla/5.0 AppleWebKit/537.36 (KHTML, like Gecko; compatible; ClaudeBot/1.0; +claudebot@anthropic.com)","isDev":false,"isTTM":false,"tenantId":"TBCN","deviceId":"web-server-community-laohu8-v3","version":"4.36.2","shortVersion":"4.36.2","platform":"web","vendor":"web","appName":"laohu8","isIOS":false,"isAndroid":false,"isTiger":false,"isTHS":false,"isWeiXin":false,"isWeiXinMini":false,"isWeiBo":false,"isQQ":false,"isBaiduSwan":false,"isBaiduBox":false,"isDingTalk":false,"isToutiao":false,"isOnePlus":false,"isHuaWei":false,"isXiaomi":false,"isXiaomiWebView":false,"isOppo":false,"isVivo":false,"isSamsung":false,"isMobile":false},"pagemeta":{"title":"Cambria Global Asset Allocation ETF(GAA)_个股概要_股票价格_最新资讯_行情走势_历史数据","description":"美港股上老虎。老虎社区提供Cambria Global Asset Allocation ETF(GAA)今日价格,行情走势,历史数据,股票概要及实时的新闻资讯,近期大事等重要参考决策数据。","keywords":"Cambria Global Asset Allocation ETF,GAA,Cambria Global Asset Allocation ETF股票,Cambria Global Asset Allocation ETF股票老虎,Cambria Global Asset Allocation ETF股票老虎国际,Cambria Global Asset Allocation ETF行情,Cambria Global Asset Allocation ETF股票行情,Cambria Global Asset Allocation ETF股价,Cambria Global Asset Allocation ETF股市,Cambria Global Asset Allocation ETF股票价格,Cambria Global Asset Allocation ETF股票交易,Cambria Global Asset Allocation ETF股票购买,Cambria Global Asset Allocation ETF股票实时行情,购买美股,购买港股,港股开户,美股开户,美股交易,港股交易,开通美港股账户,老虎国际行情","social":{"og_title":"Cambria Global Asset Allocation ETF(GAA)_个股概要_股票价格_最新资讯_行情走势_历史数据","og_description":"美港股上老虎。老虎社区提供Cambria Global Asset Allocation ETF(GAA)今日价格,行情走势,历史数据,股票概要及实时的新闻资讯,近期大事等重要参考决策数据。","og_image":"https://static.tigerbbs.com/a0b84b8debbbce3b4440f7fdd5eed2e7"}}}