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CLS 天弘科技
未开盘 05-11 16:00:00 EDT
380.99
+5.44
+1.45%
盘后
381.00
+0.01
+0.00%
19:57 EDT
最高
391.40
最低
370.54
成交量
197.05万
今开
374.71
昨收
375.55
日振幅
5.55%
总市值
438.26亿
流通市值
436.04亿
总股本
1.15亿
成交额
7.54亿
换手率
1.72%
流通股本
1.14亿
市净率
--
ROE
--
每股收益
0.00
52周最高
--
52周最低
--
市盈率
--
股息
--
股息收益率
--
ROA
--
分时
五日
日K
周K
月K
数据加载中...
北京优虎网络科技有限公司
资讯
新帖
简况
异动解读 | 天弘科技盘中大涨6.35%,财报引发暴跌后延续技术性反弹
异动解读 · 04-30
异动解读 | 天弘科技盘中大涨6.35%,财报引发暴跌后延续技术性反弹
异动解读 | 财报引发暴跌后延续技术性反弹,天弘科技盘前大涨5.37%
异动解读 · 04-30
异动解读 | 财报引发暴跌后延续技术性反弹,天弘科技盘前大涨5.37%
异动解读 | 财报后技术性反弹,天弘科技夜盘大涨5.17%
异动解读 · 04-30
异动解读 | 财报后技术性反弹,天弘科技夜盘大涨5.17%
异动解读 | 财报后技术性反弹,天弘科技盘后大涨5.20%
异动解读 · 04-30
异动解读 | 财报后技术性反弹,天弘科技盘后大涨5.20%
ETF日报|2倍做空IREN ETF涨逾16%;三倍做空半导体ETF涨超11%
ETF追踪 · 04-29
ETF日报|2倍做空IREN ETF涨逾16%;三倍做空半导体ETF涨超11%
异动解读 | 财报指引不及市场高预期,天弘科技盘中暴跌16.51%
异动解读 · 04-29
异动解读 | 财报指引不及市场高预期,天弘科技盘中暴跌16.51%
异动解读 | 财报指引不及市场高预期,天弘科技盘前大跌16.5%
异动解读 · 04-28
异动解读 | 财报指引不及市场高预期,天弘科技盘前大跌16.5%
异动解读 | 财报预期强劲叠加AI算力热潮,天弘科技盘中大涨5.10%
异动解读 · 04-24
异动解读 | 财报预期强劲叠加AI算力热潮,天弘科技盘中大涨5.10%
财报前瞻|天弘科技本季度营收预计增56.25%,机构看多占比88%
财报Agent · 04-20
财报前瞻|天弘科技本季度营收预计增56.25%,机构看多占比88%
异动解读 | 天弘科技盘中大涨5.07%,AI合作与上调营收指引提振市场信心
异动解读 · 04-14
异动解读 | 天弘科技盘中大涨5.07%,AI合作与上调营收指引提振市场信心
异动解读 | 天弘科技(CLS)盘中大涨7.92%,分析师乐观预期与AI合作推动股价上扬
异动解读 · 04-10
异动解读 | 天弘科技(CLS)盘中大涨7.92%,分析师乐观预期与AI合作推动股价上扬
天弘科技与美国超微公司携手推出"Helios"机架级AI平台,共拓人工智能新纪元
美股速递 · 03-16
天弘科技与美国超微公司携手推出"Helios"机架级AI平台,共拓人工智能新纪元
天弘科技将负责AMD“Helios”机架级AI架构中扩展网络交换机的研发、设计与制造
美股速递 · 03-16
天弘科技将负责AMD“Helios”机架级AI架构中扩展网络交换机的研发、设计与制造
天弘科技(CLS)盘前升近3% 将与AMD合作推出 “Helios” 机柜级AI平台
金吾财讯 · 03-16
天弘科技(CLS)盘前升近3% 将与AMD合作推出 “Helios” 机柜级AI平台
Dell'Oro:以太网规模超InfiniBand两倍,成AI网络首选架构
讯石光通讯网 · 03-11
Dell'Oro:以太网规模超InfiniBand两倍,成AI网络首选架构
天弘科技盘中异动 股价大跌5.18%
市场透视 · 02-26
天弘科技盘中异动 股价大跌5.18%
Celestica高管Yann L Etienvre减持84,554股
老虎公告助手 · 02-04
Celestica高管Yann L Etienvre减持84,554股
Form 4 | CELESTICA INC 总裁 Todd C Cooper 出售87,767股
老虎公告助手 · 02-04
Form 4 | CELESTICA INC 总裁 Todd C Cooper 出售87,767股
Form 144 | Celestica高管 Todd Cooper拟减持90544股,总价约$25.17百万
老虎公告助手 · 02-03
Form 144 | Celestica高管 Todd Cooper拟减持90544股,总价约$25.17百万
Form 144 | Celestica高管Etienvre Yann L拟减持86,226股,总价约24,228,643.74美元
老虎公告助手 · 02-03
Form 144 | Celestica高管Etienvre Yann L拟减持86,226股,总价约24,228,643.74美元
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公司概况
公司名称:
天弘科技
所属市场:
NYSE
上市日期:
--
主营业务:
Celestica Inc.于1996年9月27日在加拿大安大略省注册成立。该公司是一家技术领先企业,提供设计、工程、制造、供应链和平台解决方案,主要服务于数据中心基础设施市场和其他高增长领域。它通过两个部门运营:连接和云解决方案,其中包括用于云和人工智能应用的服务器、网络和存储,以及服务于航空航天、国防、工业和健康技术市场的先进技术解决方案。
发行价格:
--
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ETF涨逾16%;三倍做空半导体ETF涨超11%","url":"https://stock-news.laohu8.com/highlight/detail?id=1161399044","media":"ETF追踪","labels":[],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/1161399044?lang=zh_cn&edition=full","pubTime":"2026-04-29 09:09","pubTimestamp":1777424989,"startTime":"0","endTime":"0","summary":"美股ETF涨幅Top5$2倍做多CNC ETF-Leverage Shares$上涨26.67%。$Tradr 2X Short IREN Daily ETF$上涨16.28%。$Tradr 2X Short LITE Daily ETF$上涨15.23%。$2倍做多NVTS ETF-Tradr$下跌34.59%。大盘指数ETF涨幅Top 5$罗素2000指数三倍做空ETF$上涨3.59%。该产品两倍做空罗素2000指数,小盘股回调推动涨幅。该产品两倍做空纳斯达克100指数,指数下行推升其表现。大宗商品ETF涨幅Top 5$二倍做空黄金矿业指数ETF-Direxion$上涨8.63%。行业指数ETF涨幅Top 5$三倍做空半导体ETF-Direxion Daily$上涨11.12%。债券ETF涨幅Top 5$SPDR Portfolio Long Term Corporate Bond ETF$上涨0.18%。","market":"us","thumbnail":"https://static.tigerbbs.com/8fd5271ba4885dabd7633b23dfb3304b","type":0,"news_type":0,"thumbnails":["https://static.tigerbbs.com/8fd5271ba4885dabd7633b23dfb3304b"],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":"434b43564bfcfa3e94718ca1b3eb6522","theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"","is_publish_highlight":true,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":null,"symbols":["CRML","BK4595","SOXS","IRE","IREN","CRMU","IREZ","CNC","TZA","BK4585","DUST","SQQQ","BK4516","VCLT","QID","LITX","SPOG","GLL","OKLO","URE","IREX","SPOT","CNCG","TWM","USIG","NVTS","CRMX","SRLN","ZSL","DIG","SMN","BK4550","LITE","BK4600","OKLL","BK4588","ERX","NVTX","BK4023","DRN","TLT","CLS","SPLB","IREG","YANG","BAIG","OKLS","USO","BBAI"],"isVideo":false,"video":null,"gpt_icon":1},{"id":"1188065093","title":"异动解读 | 财报指引不及市场高预期,天弘科技盘中暴跌16.51%","url":"https://stock-news.laohu8.com/highlight/detail?id=1188065093","media":"异动解读","labels":["movement"],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/1188065093?lang=zh_cn&edition=full","pubTime":"2026-04-29 00:57","pubTimestamp":1777395447,"startTime":"0","endTime":"0","summary":"天弘科技今日盘中股价大幅下挫,跌幅达16.51%,引起了市场的广泛关注。消息面上,此次股价大跌主要源于公司最新披露的全年业绩指引不及市场此前的高预期。公司此前受AI集群扩容与交换设备结构性放量驱动,市场对其财报抱有极高期望。然而,公司仅小幅上调了全年业绩指引,预计全年净销售额为135-140亿美元,这与市场对AI算力爆发式增长的乐观预期形成了明显落差,从而引发了获利盘的集中抛售。该股自前一交易日盘后便开始持续走弱,跌幅在今日盘中交易时段进一步扩大。市场分析认为,业绩指引的温和上调未能满足投资者基于行业趋势的激进增长预期,是导致本次股价重挫的核心因素。","market":"us","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":"","theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"-2","news_top_title":null,"news_tag":"movement","news_rank":0,"length":0,"strategy_id":0,"source":"ai_movement_cn","symbols":["CLS"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"1175104383","title":"异动解读 | 财报指引不及市场高预期,天弘科技盘前大跌16.5%","url":"https://stock-news.laohu8.com/highlight/detail?id=1175104383","media":"异动解读","labels":["movement"],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/1175104383?lang=zh_cn&edition=full","pubTime":"2026-04-28 22:30","pubTimestamp":1777386615,"startTime":"0","endTime":"0","summary":"天弘科技(CLS)今日盘前股价大跌16.5%,引起了市场的广泛关注。消息面上,此次股价大幅下挫主要源于公司最新披露的全年业绩指引不及市场此前的高预期。公司此前受AI集群扩容与交换设备结构性放量驱动,市场对其财报抱有极高期望。然而,公司仅小幅上调了全年业绩指引,预计全年净销售额为135-140亿美元,这与市场对AI算力爆发式增长的乐观预期形成了明显落差,从而引发了获利盘的集中抛售。该股自前一交易日盘后便开始持续走弱,跌幅在今日盘前交易时段进一步扩大。","market":"sg","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":"","theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"-2","news_top_title":null,"news_tag":"movement","news_rank":0,"length":0,"strategy_id":0,"source":"ai_movement_cn","symbols":["CLS"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"1187492699","title":"异动解读 | 财报预期强劲叠加AI算力热潮,天弘科技盘中大涨5.10%","url":"https://stock-news.laohu8.com/highlight/detail?id=1187492699","media":"异动解读","labels":["movement"],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/1187492699?lang=zh_cn&edition=full","pubTime":"2026-04-24 23:06","pubTimestamp":1777043208,"startTime":"0","endTime":"0","summary":"天弘科技今日盘中大涨5.10%,引起了市场的广泛关注。消息面上,公司即将发布新季度财报,市场一致预期本季度营收与调整后每股收益均将实现大幅同比增长,机构看多情绪浓厚。市场分析认为,营收高增长的内生驱动力主要来自AI集群扩容与交换设备的结构性放量。与此同时,全球算力涨价潮与AI算力产业链龙头业绩兑现形成共振,进一步提振了市场情绪。行业层面,电子制造服务板块整体走强,也为天弘科技的股价表现提供了支撑。","market":"sg","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":"","theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"movement","news_rank":0,"length":0,"strategy_id":0,"source":"ai_movement_cn","symbols":["CLS"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"1129048357","title":"财报前瞻|天弘科技本季度营收预计增56.25%,机构看多占比88%","url":"https://stock-news.laohu8.com/highlight/detail?id=1129048357","media":"财报Agent","labels":["earningPreview"],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/1129048357?lang=zh_cn&edition=full","pubTime":"2026-04-20 08:22","pubTimestamp":1776644526,"startTime":"0","endTime":"0","summary":"天弘科技将于2026年04月27日美股盘后发布新季度财报,市场关注AI相关订单兑现及盈利弹性。市场一致预期本季度公司营收为39.95亿美元,同比增加56.25%;调整后每股收益为2.08美元,同比增加86.08%,公司在上一季度财报中未披露明确季度指引。本季度一致预期显示营收同比增速达56.25%,其内生驱动力主要来自AI集群的扩容与交换设备的结构性放量。","market":"sh","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":"","theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":"财报前瞻|天弘科技本季度营收预计增56.25%,机构看多占比88%","news_tag":"earningPreview","news_rank":0,"length":0,"strategy_id":0,"source":null,"symbols":["CLS"],"isVideo":false,"video":null,"gpt_icon":1},{"id":"1160138324","title":"异动解读 | 天弘科技盘中大涨5.07%,AI合作与上调营收指引提振市场信心","url":"https://stock-news.laohu8.com/highlight/detail?id=1160138324","media":"异动解读","labels":["movement"],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/1160138324?lang=zh_cn&edition=full","pubTime":"2026-04-14 22:44","pubTimestamp":1776177884,"startTime":"0","endTime":"0","summary":"天弘科技今日盘中大涨5.07%,引起了市场的广泛关注。消息面上,天弘科技近期利好因素持续发酵。公司与AMD在“Helios”AI机架平台上达成战略合作,显著拓展了其在人工智能基础设施领域的布局,有望推动营收来源多样化并增强市场地位。同时,公司上调了全年营收指引,反映出AI基础设施市场的强劲需求预期。此外,公司在新能源能效治理领域亦取得进展,AI边缘计算传感器已应用于风机及储能电芯侧,国际市场认可度持续提升。多重积极因素叠加科技板块整体看涨情绪,共同推动了股价的上涨。","market":"hk","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":"","theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"movement","news_rank":0,"length":0,"strategy_id":0,"source":"ai_movement_cn","symbols":["CLS"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"1198111994","title":"异动解读 | 天弘科技(CLS)盘中大涨7.92%,分析师乐观预期与AI合作推动股价上扬","url":"https://stock-news.laohu8.com/highlight/detail?id=1198111994","media":"异动解读","labels":["movement"],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/1198111994?lang=zh_cn&edition=full","pubTime":"2026-04-10 23:23","pubTimestamp":1775834592,"startTime":"0","endTime":"0","summary":"天弘科技今日盘中大涨7.92%,引起了市场的广泛关注。消息面上,该股上涨可归因于多个积极因素。其次,天弘科技通过战略合作伙伴关系显著扩大了其在人工智能领域的参与,尤其是与AMD在“Helios”AI机架平台上的合作,预计这将使营收来源多样化并增强其市场地位。此外,该公司更新后的2026年财务目标,包括上调的营收指引,预示着AI基础设施市场的强劲需求。同时,科技股整体市场的看涨情绪也助推了该股的上涨势头。","market":"sg","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":"","theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"movement","news_rank":0,"length":0,"strategy_id":0,"source":"ai_movement_cn","symbols":["CLS"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"1186400260","title":"天弘科技与美国超微公司携手推出\"Helios\"机架级AI平台,共拓人工智能新纪元","url":"https://stock-news.laohu8.com/highlight/detail?id=1186400260","media":"美股速递","labels":["corporation"],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/1186400260?lang=zh_cn&edition=full","pubTime":"2026-03-16 20:36","pubTimestamp":1773664601,"startTime":"0","endTime":"0","summary":"全球领先的技术解决方案供应商天弘科技与高性能计算巨头美国超微公司正式宣布达成战略合作,双方将共同推进人工智能技术的创新发展。此次合作的核心成果是联合推出名为\"Helios\"的机架级人工智能平台,该平台旨在为下一代AI应用提供强大的计算支持。两家公司表示,此次合作标志着人工智能基础设施建设迈入新阶段。通过强强联合,双方将共同推动AI技术在各行各业的规模化应用,助力客户应对日益复杂的计算挑战,开启智能计算的新篇章。","market":"us","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":"f6574e1382e251d40c42e6a229c109f8","theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"corporation","news_rank":0,"length":0,"strategy_id":0,"source":null,"symbols":["BK4573","LU1923623000.USD","LU1303367103.USD","LU1989764664.SGD","LU0274383776.USD","LU0642271901.SGD","LU2089985449.USD","AMDL","BK4532","IE00BMPRXR70.SGD","LU2360106780.USD","BK4529","LU2931357623.SGD","LU1852331112.SGD","LU2458330169.SGD","AMDG","LU2458330243.SGD","AMYY","LU0056508442.USD","BK4614","LU2264538146.SGD","LU0082616367.USD","LU1803068979.SGD","LU1861559042.SGD","LU0823434740.USD","BK4141","AMDW","AMUU","IE0004445239.USD","LU0823421333.USD","CLS","AMD","LU0390134368.USD","LU1951198990.SGD","BK4543","BK4554","BK4612","LU1880398554.USD","LU0979878070.USD","LU1064131342.USD","IE0009356076.USD","LU0823434583.USD","LU2355687059.USD","BK4588","LU0823421416.USD","LU0198837287.USD","LU1242518931.SGD","BK4605","LU0127658192.USD","AMDU","BK4575","LU0719512351.SGD","LU1242518857.USD","LU1951200564.SGD","IE00B5949003.HKD","LU2098885051.SGD","BK4585","LU1316542783.SGD","BK4512","LU0081259029.USD","LU1988902786.USD","BK4534","BK4566","LU1861558580.USD","AMDD","AMDY","IE00BMPRXN33.USD","LU2054465674.USD","LU2250418816.HKD","LU0109392836.USD","DAMD","LU1880398471.USD","LU0889565833.HKD"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"1184830402","title":"天弘科技将负责AMD“Helios”机架级AI架构中扩展网络交换机的研发、设计与制造","url":"https://stock-news.laohu8.com/highlight/detail?id=1184830402","media":"美股速递","labels":[],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/1184830402?lang=zh_cn&edition=full","pubTime":"2026-03-16 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将与AMD合作推出 “Helios” 机柜级AI平台","url":"https://stock-news.laohu8.com/highlight/detail?id=2619463652","media":"金吾财讯","labels":["corporation"],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/2619463652?lang=zh_cn&edition=full","pubTime":"2026-03-16 20:33","pubTimestamp":1773664392,"startTime":"0","endTime":"0","summary":"金吾财讯 | 天弘科技(CLS)盘前股价上扬,暂升2.86%,报271美元。消息面上,公司与AMD今日联合宣布,双方达成战略合作,将推出基于开放标准的全新 “Helios” 机柜级人工智能平台。此次合作将 AMD 在高性能计算与人工智能计算领域的领先优势,与 Celestica 在高端网络交换技术领域的专业实力深度融合。","market":"fut","thumbnail":"https://static.szfiu.com/news/20210810/MGE2ZWRkM2ExNzliODFiMWYxODE0Mjk1MTc3MTQ2.jpg","type":0,"news_type":0,"thumbnails":["https://static.szfiu.com/news/20210810/MGE2ZWRkM2ExNzliODFiMWYxODE0Mjk1MTc3MTQ2.jpg"],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":"f6574e1382e251d40c42e6a229c109f8","theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"298051","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"corporation","news_rank":0,"length":0,"strategy_id":0,"source":null,"symbols":["LU1064131342.USD","IE00BMPRXQ63.HKD","LU1861220033.SGD","LU0109392836.USD","LU0082616367.USD","LU2931357623.SGD","LU1989764664.SGD","IE00B5949003.HKD","BK4612","LU0390134368.USD","LU1861559042.SGD","AMD","BK4554","AMDL","LU2360106780.USD","LU1880398554.USD","IE0004445239.USD","LU1861215975.USD","LU2360107168.USD","LU0198837287.USD","LU2458330169.SGD","BK4145","LU0274383776.USD","AMDY","BK4585","LU2250418816.HKD","LU0056508442.USD","LU0823421416.USD","LU2098885051.SGD","IE00BMPRXN33.USD","LU2045819591.USD","LU1242518931.SGD","BK4512","LU1951200564.SGD","BK4614","LU2264538146.SGD","LU0823421333.USD","LU2355687059.USD","IE00BMPRXR70.SGD","LU0081259029.USD","LU2290526834.HKD","LU1861558580.USD","BK4605","BK4588","LU1951198990.SGD","LU2458330243.SGD","LU0823434583.USD","BK4141","CLS","AMUU","LU1316542783.SGD","LU1923623000.USD","BK4532","LU2089985449.USD","AMDU","LU2543165471.USD","LU0127658192.USD","LU1242518857.USD","BK4529","LU2054465674.USD","BK4573","LU1988902786.USD","BK4543","AMDD","DAMD","BK4534","BK4566","LU1803068979.SGD","BK4575","LU0642271901.SGD","LU1852331112.SGD","LU1880398471.USD","LU2125910500.SGD","LU1303367103.USD","LU0823434740.USD","LU0719512351.SGD","IE0009356076.USD","AMDW","LU0979878070.USD","AMYY","LU0889565833.HKD","AMDG"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2618993274","title":"Dell'Oro:以太网规模超InfiniBand两倍,成AI网络首选架构","url":"https://stock-news.laohu8.com/highlight/detail?id=2618993274","media":"讯石光通讯网","labels":[],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/2618993274?lang=zh_cn&edition=full","pubTime":"2026-03-11 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Etienvre减持84,554股","url":"https://stock-news.laohu8.com/highlight/detail?id=1107409388","media":"老虎公告助手","labels":["insiderTrades"],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/1107409388?lang=zh_cn&edition=full","pubTime":"2026-02-04 05:25","pubTimestamp":1770153939,"startTime":"0","endTime":"0","summary":"Celestica公司的首席运营官Yann L Etienvre于2026年2月2日进行了多次交易。他行使了160,126股性能股票单位,价格为0美元;出售了77,421股股票,价格为287.45美元;再次行使了6,829股限制性股票单位,价格为0美元;出售了3,305股股票,价格为287.45美元。其减持行为表明高管可能认为公司当前股价被高估,投资者需保持警惕。","market":"us","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":"","theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"-1","news_top_title":null,"news_tag":"insiderTrades","news_rank":0,"length":0,"strategy_id":0,"source":null,"symbols":["CLS"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"1100652692","title":"Form 4 | CELESTICA INC 总裁 Todd C Cooper 出售87,767股","url":"https://stock-news.laohu8.com/highlight/detail?id=1100652692","media":"老虎公告助手","labels":["insiderTrades"],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/1100652692?lang=zh_cn&edition=full","pubTime":"2026-02-04 05:25","pubTimestamp":1770153917,"startTime":"0","endTime":"0","summary":"CELESTICA INC的总裁Todd C Cooper于2026年2月2日进行了多次交易,总共出售了87,767股普通股。这些交易包括160,126股的获得,以及两次分别为74,203股和3,561股的出售。高管的大量出售股份可能表明其对公司未来股价的信心下降,投资者应密切关注公司的后续表现。","market":"us","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":"","theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"-1","news_top_title":"Form 4 | CELESTICA INC 总裁 Todd C Cooper 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Cooper拟出售90544股普通股票,总市值约$25,174,958.56,计划于2026年2月2日和2026年2月4日在纽交所进行交易。","market":"us","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":"","theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"-1","news_top_title":null,"news_tag":"insiderTrades","news_rank":0,"length":0,"strategy_id":0,"source":null,"symbols":["CLS"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"1118050079","title":"Form 144 | Celestica高管Etienvre Yann L拟减持86,226股,总价约24,228,643.74美元","url":"https://stock-news.laohu8.com/highlight/detail?id=1118050079","media":"老虎公告助手","labels":["insiderTrades"],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/1118050079?lang=zh_cn&edition=full","pubTime":"2026-02-03 05:20","pubTimestamp":1770067211,"startTime":"0","endTime":"0","summary":"Celestica高管Etienvre Yann L拟于2026年2月2日减持86,226股普通股,总市值约24,228,643.74美元,交易将在NYSE进行。","market":"us","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":"","theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"-1","news_top_title":"Form 144 | Celestica高管Etienvre Yann 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