天弘科技(CLS)_个股概要_股票价格_最新资讯_行情走势_历史数据 - 老虎社区

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CLS 天弘科技

交易中 04-28 13:05:32 EDT

354.34

-67.87

-16.07%

最高392.70	最低350.01	成交量388.77万
今开356.51	昨收422.21	日振幅10.11%
总市值407.61亿	流通市值405.54亿	总股本1.15亿
成交额14.28亿	换手率3.40%	流通股本1.14亿
市净率--	ROE--	每股收益0.00
52周最高--	52周最低--	市盈率--
股息--	股息收益率--	ROA--

数据加载中...

北京优虎网络科技有限公司

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00:57","pubTimestamp":1777395447,"startTime":"0","endTime":"0","summary":"天弘科技今日盘中股价大幅下挫，跌幅达16.51%，引起了市场的广泛关注。消息面上，此次股价大跌主要源于公司最新披露的全年业绩指引不及市场此前的高预期。公司此前受AI集群扩容与交换设备结构性放量驱动，市场对其财报抱有极高期望。然而，公司仅小幅上调了全年业绩指引，预计全年净销售额为135-140亿美元，这与市场对AI算力爆发式增长的乐观预期形成了明显落差，从而引发了获利盘的集中抛售。该股自前一交易日盘后便开始持续走弱，跌幅在今日盘中交易时段进一步扩大。市场分析认为，业绩指引的温和上调未能满足投资者基于行业趋势的激进增长预期，是导致本次股价重挫的核心因素。","market":"nz","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":"","theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"-2","news_top_title":null,"news_tag":"movement","news_rank":0,"length":0,"strategy_id":0,"source":"ai_movement_cn","symbols":["CLS"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"1175104383","title":"异动解读 | 财报指引不及市场高预期，天弘科技盘前大跌16.5%","url":"https://stock-news.laohu8.com/highlight/detail?id=1175104383","media":"异动解读","labels":["movement"],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/1175104383?lang=zh_cn&edition=full","pubTime":"2026-04-28 22:30","pubTimestamp":1777386615,"startTime":"0","endTime":"0","summary":"天弘科技(CLS)今日盘前股价大跌16.5%，引起了市场的广泛关注。消息面上，此次股价大幅下挫主要源于公司最新披露的全年业绩指引不及市场此前的高预期。公司此前受AI集群扩容与交换设备结构性放量驱动，市场对其财报抱有极高期望。然而，公司仅小幅上调了全年业绩指引，预计全年净销售额为135-140亿美元，这与市场对AI算力爆发式增长的乐观预期形成了明显落差，从而引发了获利盘的集中抛售。该股自前一交易日盘后便开始持续走弱，跌幅在今日盘前交易时段进一步扩大。","market":"us","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":"","theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"-2","news_top_title":null,"news_tag":"movement","news_rank":0,"length":0,"strategy_id":0,"source":"ai_movement_cn","symbols":["CLS"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"1187492699","title":"异动解读 | 财报预期强劲叠加AI算力热潮，天弘科技盘中大涨5.10%","url":"https://stock-news.laohu8.com/highlight/detail?id=1187492699","media":"异动解读","labels":["movement"],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/1187492699?lang=zh_cn&edition=full","pubTime":"2026-04-24 23:06","pubTimestamp":1777043208,"startTime":"0","endTime":"0","summary":"天弘科技今日盘中大涨5.10%，引起了市场的广泛关注。消息面上，公司即将发布新季度财报，市场一致预期本季度营收与调整后每股收益均将实现大幅同比增长，机构看多情绪浓厚。市场分析认为，营收高增长的内生驱动力主要来自AI集群扩容与交换设备的结构性放量。与此同时，全球算力涨价潮与AI算力产业链龙头业绩兑现形成共振，进一步提振了市场情绪。行业层面，电子制造服务板块整体走强，也为天弘科技的股价表现提供了支撑。","market":"hk","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":"","theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"movement","news_rank":0,"length":0,"strategy_id":0,"source":"ai_movement_cn","symbols":["CLS"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"1129048357","title":"财报前瞻｜天弘科技本季度营收预计增56.25%，机构看多占比88%","url":"https://stock-news.laohu8.com/highlight/detail?id=1129048357","media":"财报Agent","labels":["earningPreview"],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/1129048357?lang=zh_cn&edition=full","pubTime":"2026-04-20 08:22","pubTimestamp":1776644526,"startTime":"0","endTime":"0","summary":"天弘科技将于2026年04月27日美股盘后发布新季度财报，市场关注AI相关订单兑现及盈利弹性。市场一致预期本季度公司营收为39.95亿美元，同比增加56.25%；调整后每股收益为2.08美元，同比增加86.08%，公司在上一季度财报中未披露明确季度指引。本季度一致预期显示营收同比增速达56.25%，其内生驱动力主要来自AI集群的扩容与交换设备的结构性放量。","market":"us","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":"","theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":"财报前瞻｜天弘科技本季度营收预计增56.25%，机构看多占比88%","news_tag":"earningPreview","news_rank":0,"length":0,"strategy_id":0,"source":null,"symbols":["CLS"],"isVideo":false,"video":null,"gpt_icon":1},{"id":"1160138324","title":"异动解读 | 天弘科技盘中大涨5.07%，AI合作与上调营收指引提振市场信心","url":"https://stock-news.laohu8.com/highlight/detail?id=1160138324","media":"异动解读","labels":["movement"],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/1160138324?lang=zh_cn&edition=full","pubTime":"2026-04-14 22:44","pubTimestamp":1776177884,"startTime":"0","endTime":"0","summary":"天弘科技今日盘中大涨5.07%，引起了市场的广泛关注。消息面上，天弘科技近期利好因素持续发酵。公司与AMD在“Helios”AI机架平台上达成战略合作，显著拓展了其在人工智能基础设施领域的布局，有望推动营收来源多样化并增强市场地位。同时，公司上调了全年营收指引，反映出AI基础设施市场的强劲需求预期。此外，公司在新能源能效治理领域亦取得进展，AI边缘计算传感器已应用于风机及储能电芯侧，国际市场认可度持续提升。多重积极因素叠加科技板块整体看涨情绪，共同推动了股价的上涨。","market":"hk","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":"","theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"movement","news_rank":0,"length":0,"strategy_id":0,"source":"ai_movement_cn","symbols":["CLS"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"1198111994","title":"异动解读 | 天弘科技(CLS)盘中大涨7.92%，分析师乐观预期与AI合作推动股价上扬","url":"https://stock-news.laohu8.com/highlight/detail?id=1198111994","media":"异动解读","labels":["movement"],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/1198111994?lang=zh_cn&edition=full","pubTime":"2026-04-10 23:23","pubTimestamp":1775834592,"startTime":"0","endTime":"0","summary":"天弘科技今日盘中大涨7.92%，引起了市场的广泛关注。消息面上，该股上涨可归因于多个积极因素。其次，天弘科技通过战略合作伙伴关系显著扩大了其在人工智能领域的参与，尤其是与AMD在“Helios”AI机架平台上的合作，预计这将使营收来源多样化并增强其市场地位。此外，该公司更新后的2026年财务目标，包括上调的营收指引，预示着AI基础设施市场的强劲需求。同时，科技股整体市场的看涨情绪也助推了该股的上涨势头。","market":"sg","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":"","theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"movement","news_rank":0,"length":0,"strategy_id":0,"source":"ai_movement_cn","symbols":["CLS"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"1186400260","title":"天弘科技与美国超微公司携手推出\"Helios\"机架级AI平台，共拓人工智能新纪元","url":"https://stock-news.laohu8.com/highlight/detail?id=1186400260","media":"美股速递","labels":["corporation"],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/1186400260?lang=zh_cn&edition=full","pubTime":"2026-03-16 20:36","pubTimestamp":1773664601,"startTime":"0","endTime":"0","summary":"全球领先的技术解决方案供应商天弘科技与高性能计算巨头美国超微公司正式宣布达成战略合作，双方将共同推进人工智能技术的创新发展。此次合作的核心成果是联合推出名为\"Helios\"的机架级人工智能平台，该平台旨在为下一代AI应用提供强大的计算支持。两家公司表示，此次合作标志着人工智能基础设施建设迈入新阶段。通过强强联合，双方将共同推动AI技术在各行各业的规模化应用，助力客户应对日益复杂的计算挑战，开启智能计算的新篇章。","market":"us","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":"f6574e1382e251d40c42e6a229c109f8","theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"corporation","news_rank":0,"length":0,"strategy_id":0,"source":null,"symbols":["LU1803068979.SGD","LU2458330169.SGD","LU1242518857.USD","LU1880398554.USD","IE00B5949003.HKD","AMUU","AMYY","BK4554","LU0081259029.USD","LU0719512351.SGD","IE00BMPRXR70.SGD","IE00BMPRXN33.USD","LU2931357623.SGD","AMDG","AMDL","LU1861558580.USD","LU0109392836.USD","AMDY","LU1316542783.SGD","LU0823434740.USD","AMDU","LU1242518931.SGD","LU1303367103.USD","AMD","IE0009356076.USD","LU0979878070.USD","LU2054465674.USD","LU2458330243.SGD","AMDD","BK4532","LU2360106780.USD","LU1951200564.SGD","DAMD","BK4529","LU0823421333.USD","LU0823434583.USD","BK4141","BK4543","LU0198837287.USD","LU0390134368.USD","LU0889565833.HKD","LU1064131342.USD","LU1951198990.SGD","LU0274383776.USD","BK4612","BK4605","LU0082616367.USD","LU1861559042.SGD","LU1852331112.SGD","LU1923623000.USD","LU0642271901.SGD","BK4588","IE0004445239.USD","LU1988902786.USD","LU2098885051.SGD","BK4585","LU0823421416.USD","LU2264538146.SGD","BK4512","BK4573","LU0056508442.USD","LU2250418816.HKD","LU1989764664.SGD","LU2355687059.USD","CLS","BK4566","LU1880398471.USD","LU2089985449.USD","AMDW","LU0127658192.USD","BK4534","BK4575","BK4614"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"1184830402","title":"天弘科技将负责AMD“Helios”机架级AI架构中扩展网络交换机的研发、设计与制造","url":"https://stock-news.laohu8.com/highlight/detail?id=1184830402","media":"美股速递","labels":[],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/1184830402?lang=zh_cn&edition=full","pubTime":"2026-03-16 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在高端网络交换技术领域的专业实力深度融合。","market":"fut","thumbnail":"https://static.szfiu.com/news/20210810/MGE2ZWRkM2ExNzliODFiMWYxODE0Mjk1MTc3MTQ2.jpg","type":0,"news_type":0,"thumbnails":["https://static.szfiu.com/news/20210810/MGE2ZWRkM2ExNzliODFiMWYxODE0Mjk1MTc3MTQ2.jpg"],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":"f6574e1382e251d40c42e6a229c109f8","theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"298051","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"corporation","news_rank":0,"length":0,"strategy_id":0,"source":null,"symbols":["IE00BMPRXR70.SGD","BK4532","LU1880398554.USD","LU1988902786.USD","LU2290526834.HKD","LU2355687059.USD","AMDW","LU1951198990.SGD","BK4573","BK4612","BK4529","AMD","BK4145","LU0198837287.USD","LU1316542783.SGD","LU0719512351.SGD","BK4512","LU2264538146.SGD","AMUU","LU0642271901.SGD","IE0009356076.USD","LU1880398471.USD","LU2054465674.USD","BK4566","LU0127658192.USD","LU2125910500.SGD","BK4575","LU1064131342.USD","AMYY","LU2089985449.USD","LU0390134368.USD","LU1989764664.SGD","BK4605","LU2360106780.USD","IE00BMPRXN33.USD","LU2045819591.USD","AMDU","LU2360107168.USD","AMDL","IE0004445239.USD","LU1303367103.USD","LU0823421416.USD","LU1923623000.USD","LU0081259029.USD","LU0823421333.USD","BK4534","LU1803068979.SGD","LU2543165471.USD","LU2098885051.SGD","AMDY","BK4543","BK4554","LU0823434740.USD","BK4141","LU0056508442.USD","LU1861558580.USD","IE00B5949003.HKD","BK4588","LU1242518931.SGD","LU1951200564.SGD","BK4614","LU0889565833.HKD","AMDD","AMDG","BK4585","LU1861215975.USD","LU1861220033.SGD","LU1861559042.SGD","DAMD","IE00BMPRXQ63.HKD","LU1242518857.USD","LU0979878070.USD","LU0274383776.USD","LU0109392836.USD","LU1852331112.SGD","LU0823434583.USD","CLS","LU2250418816.HKD","LU2931357623.SGD","LU2458330243.SGD","LU0082616367.USD","LU2458330169.SGD"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2618993274","title":"Dell'Oro：以太网规模超InfiniBand两倍，成AI网络首选架构","url":"https://stock-news.laohu8.com/highlight/detail?id=2618993274","media":"讯石光通讯网","labels":[],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/2618993274?lang=zh_cn&edition=full","pubTime":"2026-03-11 08:48","pubTimestamp":1773190112,"startTime":"0","endTime":"0","summary":"ICC讯根据市场研究机构Dell'Oro Group最新发布的报告，2025年以太网交换机在人工智能 Scale-out网络中的规模已超过InfiniBand的两倍，成为领先的互联架构。报告显示，在AI后端网络中，以太网交换机销售额增长超过两倍，在2025年第四季度及全年均占AI集群数据中心交换机销售额的三分之二以上。NVIDIA和Celestica在AI集群以太网交换机销售中领先，两者合计占据近50%的市场份额。Arista排名第三，尽管其与AI相关产品收入的很大一部分被递延确认。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN2026031108502997acc050&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, 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