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ASX 日月光半导体
交易中 03-04 11:41:53 EST
22.04
-0.27
-1.23%
最高
22.65
最低
21.81
成交量
339.30万
今开
22.60
昨收
22.31
日振幅
3.76%
总市值
489.95亿
流通市值
371.34亿
总股本
22.24亿
成交额
7,487万
换手率
0.20%
流通股本
16.85亿
市净率
--
ROE
--
每股收益
0.00
52周最高
--
52周最低
--
市盈率
--
股息
--
股息收益率
--
ROA
--
分时
五日
日K
周K
月K
数据加载中...
北京优虎网络科技有限公司
资讯
新帖
简况
异动解读 | 阿斯麦EUV技术突破提振，日月光半导体盘中大涨6.64%
异动解读 · 02-25
异动解读 | 阿斯麦EUV技术突破提振，日月光半导体盘中大涨6.64%
异动解读 | 阿斯麦EUV技术突破，日月光半导体盘前大涨5.41%
异动解读 · 02-24
异动解读 | 阿斯麦EUV技术突破，日月光半导体盘前大涨5.41%
盘前异动｜VIR暴涨超50%，KEYS涨17%，芯片制造概念股拉升
老虎资讯综合 · 02-24
盘前异动｜VIR暴涨超50%，KEYS涨17%，芯片制造概念股拉升
【2月15日】字节跳动芯片量产在即,AMD借力Arista进军AI集群
芯域 · 02-18
【2月15日】字节跳动芯片量产在即,AMD借力Arista进军AI集群
日月光首条CoWoS生产线，今年底亮相
半导体新知道 · 02-09
日月光首条CoWoS生产线，今年底亮相
异动解读 | 日月光半导体盘中大涨5.03%，先进封装业务前景乐观及高雄新产线计划成催化剂
异动解读 · 02-06
异动解读 | 日月光半导体盘中大涨5.03%，先进封装业务前景乐观及高雄新产线计划成催化剂
日月光首条CoWoS落地高雄，台积电“后院”被攻破？
未来半导体 · 02-05
日月光首条CoWoS落地高雄，台积电“后院”被攻破？
机构：2030年先进封装市场规模将达近800亿美元
满天芯 · 02-02
机构：2030年先进封装市场规模将达近800亿美元
先进封装市场年增9.4%，2.5D/3D封装因AI需求迎爆发增长
爱集微 · 02-01
先进封装市场年增9.4%，2.5D/3D封装因AI需求迎爆发增长
财报前瞻 ｜日月光半导体本季度营收预计增4.70%，机构观点偏乐观
财报Agent · 01-29
财报前瞻 ｜日月光半导体本季度营收预计增4.70%，机构观点偏乐观
先进封装，全速扩产
半导体行业观察 · 01-18
先进封装，全速扩产
瑞银：艾马克技术飙涨已反映算力增长预期，下调评级以权衡成本风险
智通财经 · 01-14
瑞银：艾马克技术飙涨已反映算力增长预期，下调评级以权衡成本风险
日月光投控斥资28亿扩产 旗下硅品购入联合再生竹南厂房
维库电子市场网 · 01-14
日月光投控斥资28亿扩产 旗下硅品购入联合再生竹南厂房
先进封装火了，2026谁吃香？
半导体产业纵横 · 01-05
先进封装火了，2026谁吃香？
纳斯达克中国金龙指数涨0.86% 热门中概股涨多跌少 禾赛涨3.9%
金吾财讯 · 2025-12-12
纳斯达克中国金龙指数涨0.86% 热门中概股涨多跌少 禾赛涨3.9%
台积电、日月光、Amkor及联电等加速扩产CoWoS
格隆汇 · 2025-12-10
台积电、日月光、Amkor及联电等加速扩产CoWoS
纳斯达克中国金龙指数升幅扩至0.38% 热门中概股多数走高 日月光半导体升4.47%
金吾财讯 · 2025-12-08
纳斯达克中国金龙指数升幅扩至0.38% 热门中概股多数走高 日月光半导体升4.47%
台积电先进封装订单大爆满 扩大委外释单 日月光大赢家
爱集微 · 2025-12-08
台积电先进封装订单大爆满 扩大委外释单 日月光大赢家
纳斯达克中国金龙指数升逾0.5% 热门中概股普升 霸王茶姬涨4.1%
金吾财讯 · 2025-11-28
纳斯达克中国金龙指数升逾0.5% 热门中概股普升 霸王茶姬涨4.1%
美国住房市场困境加剧，James Hardie Industries跌13%
环球市场播报 · 2025-11-06
美国住房市场困境加剧，James Hardie Industries跌13%
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公司概况
公司名称：
日月光半导体
所属市场：
NYSE
上市日期：
--
主营业务：
日月光投资控股股份有限公司成立于1984年3月23日，是一家根据(中国台湾)公司法成立的股份有限公司，位于中国台湾高雄南泽出口加工区。根据2012年的收入，该公司是全球最大的半导体封装和测试服务独立提供商。该公司的服务包括半导体封装、互连材料生产、前端工程测试、晶圆探测、最终测试服务以及与计算机、外围设备、通信、工业、汽车、存储和服务器应用相关的电子制造服务的集成解决方案。
发行价格：
--
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17:11","pubTimestamp":1771924261,"startTime":"0","endTime":"0","summary":"美股三大指数期货在盘前时段小幅上涨。","market":"us","thumbnail":"https://static.tigerbbs.com/3a33c23f8e5a366189f532d19af270ed","type":0,"news_type":0,"thumbnails":["https://static.tigerbbs.com/3a33c23f8e5a366189f532d19af270ed"],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":"c4f7d9aa98dfc3df88fea4a3c65a916e","theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"","is_publish_highlight":true,"source_rank":0,"column":"","sentiment":"2","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":null,"symbols":["KEYS","VIR","ASX"],"gpt_icon":1},{"id":"2612925114","title":"【2月15日】字节跳动芯片量产在即,AMD借力Arista进军AI集群","url":"https://stock-news.laohu8.com/highlight/detail?id=2612925114","media":"芯域","labels":["productRelease"],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/2612925114?lang=zh_cn&edition=full","pubTime":"2026-02-18 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16:01","pubTimestamp":1770278510,"startTime":"0","endTime":"0","summary":"作为目前唯一能大规模量产CoWoS的厂商，台积电的产能早已被英伟达、AMD、博通等巨头瓜分殆尽。2025年，其CoWoS月产能约为6.5至7万片，2026年预计将翻倍至12至13万片。供应链最新传出，日月光正在高雄K18厂建造其首条“类CoWoS-L”封装产线。日月光的介入，恰好提供了这种可能性。它此前已承接英伟达CoWoS后段的“oS”段订单，并从2025年起启动前段“CoW”计划，且获得了台积电的到厂协助。除了紧追CoWoS，日月光也在打造属于自己的“技术备胎”。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20260205180800953ff573&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, 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12:07","pubTimestamp":1770005239,"startTime":"0","endTime":"0","summary":"市场调查机构Yole Group研报显示，先进封装已成为推动封装市场扩张的重要力量。2024年先进封装市场达到460亿美元，较2023年回暖后同比增长19%。Yole Group预计，随着AI、高性能计算和数据中心等领域的需求增长，2.5D/3D先进封装市场将持续扩大，到2030年有望接近350亿美元，2024年至2030年的复合年增长率约为19%。技术与市场首席分析师Yik Yee Tan博士指出，“它已成为AI、数据中心和未来系统性能的中央支柱。”","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20260202131129953f5fef&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, 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17:18","pubTimestamp":1765358316,"startTime":"0","endTime":"0","summary":"格隆汇12月10日｜据台湾电子时报，半导体设备厂商透露，台积电与日月光集团、Amkor与联电等都在加速扩充先进封装CoWoS产能，从订单分布观察，2026~2027年GPU、ASIC客户需求均超出预期。其中，英伟达持续预订台积CoWoS过半产能，博通与AMD分别占据二、三名。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN202512101719229535534c&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, 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