美国超微公司(AMD)_个股概要_股票价格_最新资讯_行情走势_历史数据 - 老虎社区

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AMD 美国超微公司

盘前交易 09-02 05:09:12 EDT

162.63

-5.95

-3.53%

盘前160.01

-2.62-1.61%

05:09 EDT

最高168.57	最低161.90	成交量3,752万
今开166.81	昨收168.58	日振幅3.96%
总市值2,639亿	流通市值2,621亿	总股本16.23亿
成交额61.47亿	换手率2.33%	流通股本16.11亿
市净率--	ROE--	每股收益0.00
52周最高--	52周最低--	市盈率--
股息--	股息收益率--	ROA--

数据加载中...

北京优虎网络科技有限公司

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09:15","pubTimestamp":1756689323,"startTime":"0","endTime":"0","summary":"AMD 基于 RDNA 4 架构的当前Radeon RX 9000 系列产品线并未试图在高端桌面 GPU 市场挑战英伟达。此外，Navi 31 GCD 的平面图表明其设计非常对称，这意味着如果需要，芯片可以“减半”，前提是 AMD 能够找到在逻辑层面分解设计的方法，并让软件认为它正在处理单片 GPU。AMD 通常的 GPU 发布周期是两年。也就是说，AMD 将在未来几个月内通过对实际硬件的测试，来了解多区块设计是否适用于消费级 GPU。","market":"us","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20250901092217a7081d48&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, 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22:17","pubTimestamp":1756649823,"startTime":"0","endTime":"0","summary":"尔英于8月29日发布瑶光Alkiad AMD Ryzen M-ATX D5主板，该产品搭载锐龙7000HX \"Dragon Range\"系列处理器，成为尔英首款基于AMD平台的MoDT主板。Alkiad AMD Ryzen M-ATX D5主板采用全黑色PCB，尺寸为240mm×185mm，配备6+2+1相60A DrMOS供电，提供单组EPS 8-Pin CPU供电接口。处理器散热方案采用裸Die+VC均热板设计。尔英提供四种配置版本，首发价格如下：锐龙9 7945HX2199元；锐龙9 7940HX1999元；锐龙9 7845HX1789元；锐龙7 7745HX（8核心）1499元。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20250831222118976e5acb&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, 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19:47","pubTimestamp":1756640828,"startTime":"0","endTime":"0","summary":"快科技8月31日消息，根据Jon Peddie Research发布的最新报告，2025年第二季度，全球PC GPU总出货量达到了7470万块。从市场份额来看，AMD和Intel的市场份额均有所下降，AMD较上一季度下降了2.4%，Intel下降了1.9%，与此同时，NVIDIA的市场份额增长到了24%，增加了4.3%。至于NVIDIA，根据2025年第一季度的报告，NVIDIA在独立显卡市场的份额已经达到了92%，本季度可能会更高。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20250831194947a4ab39c3&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, 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chiplet架构封装GPU：重返高端显卡市场和NVIDIA竞争","url":"https://stock-news.laohu8.com/highlight/detail?id=2563977839","media":"快科技","labels":["productRelease"],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/2563977839?lang=zh_cn&edition=full","pubTime":"2025-08-31 11:29","pubTimestamp":1756610972,"startTime":"0","endTime":"0","summary":"据Tom's Hardware报道，AMD旗下资深研究员、公司SoC首席架构师Laks Pappu在其LinkedIn资料中透露，AMD正研发新一代采用2.5D / 3.5D chiplet架构封装的GPU，这代表着AMD有望在下一代产品中重返高性能GPU市场竞争。Laks 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被曝研发 2.5D / 3.5D 芯粒封装","url":"https://stock-news.laohu8.com/highlight/detail?id=2563001890","media":"IT之家","labels":[],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/2563001890?lang=zh_cn&edition=full","pubTime":"2025-08-30 11:28","pubTimestamp":1756524507,"startTime":"0","endTime":"0","summary":"IT之家 8 月 30 日消息，科技媒体 Tom's Hardware 昨日发布博文，报道称 AMD 资深研究员、SoC 首席架构师 Laks Pappu 在其 LinkedIn 资料中透露，AMD 正研发新一代基于 2.5D / 3.5D 芯粒封装及单芯片架构的 GPU，意味着该公司有望在下一代产品中重返高性能 GPU 竞争。Laks Pappu 在个人介绍中提到，其工作包括“打造下一代具竞争力的 2.5D / 3.5D 芯粒封装及单芯片图形 SoC，基于多种封装技术”。虽然 AMD 并未公开具体发布时间或型号，但该媒体认为这释放了 AMD 公司未来可能重返高性能 GPU 竞争的信号。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN202508301129069506f58f&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description 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FSR 3.1 游戏可手动换 DLL 跳到 FSR 4","url":"https://stock-news.laohu8.com/highlight/detail?id=2563300417","media":"市场资讯","labels":[],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/2563300417?lang=zh_cn&edition=full","pubTime":"2025-08-30 11:05","pubTimestamp":1756523100,"startTime":"0","endTime":"0","summary":"IT之家 8 月 30 日消息，科技媒体 Tom’s Hardware 昨日发布博文，报道称 GitHub 社区发现，无需等待开发者更新，玩家可通过手动替换 DLL 文件，将支持 FSR 3.1 的游戏升级至 AMD 最新的 FSR 4。FSR SDK 2.0 包含三个关键 DLL 文件：用户只需将 loader 文件重命名为“amd_fidelityfx_dx12”，并将三者放入原 FSR 3.1 DLL 所在目录，同时删除旧文件，即可完成升级。此外，旧款 Radeon 显卡运行此方法后，仍会停留在 FSR 3.1.5 版本。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20250830122932976b6027&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description 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