应用材料(AMAT)_个股概要_股票价格_最新资讯_行情走势_历史数据 - 老虎社区

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AMAT 应用材料

休市中 11-06 16:00:00 EST

332.72

+13.47

+4.22%

盘后334.32

+1.60+0.48%

19:59 EST

最高348.71	最低329.29	成交量947.21万
今开346.16	昨收319.25	日振幅6.08%
总市值2,638亿	流通市值2,638亿	总股本7.93亿
成交额31.73亿	换手率1.19%	流通股本7.93亿
市净率--	ROE--	每股收益0.00
52周最高--	52周最低--	市盈率--
股息--	股息收益率--	ROA--

数据加载中...

北京优虎网络科技有限公司

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17:01","pubTimestamp":1793955701,"startTime":"0","endTime":"0","summary":"11月6日，应用材料盘前上涨5.34%，报337.0884美元/股，成交额24.92万美元。消息面上，半导体设备板块延续反弹，对股价形成直接带动；同业中，拉姆研究上涨9.05%，科磊上涨5.43%，泰瑞达上涨5.38%，阿斯麦上涨4.77%，板块联动明显。同时，AI热潮推动先进封装成为行业关键战场。公司此前已将对Besi持股提升至约20%，强化先进封装长期合作；叠加市场预计其将于11月12日公布的财季营收约102.99亿美元、调整后每股收益约4.05美元，机构整体观点偏乐观。（以上内容均基于市场公开消息，由程序或算法智能生成，仅作为股价异动提醒，不作为投资建议或交易依据。）","market":"hk","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":"应用材料盘前上涨，先进封装合作升温","news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":null,"symbols":["AMAT"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"1105654554","title":"AI热潮使芯片封装成为半导体行业下一个关键战场","url":"https://stock-news.laohu8.com/highlight/detail?id=1105654554","media":"老虎资讯综合","labels":["EditorSelect"],"top":-1,"itemType":null,"share":"https://www.laohunote.com/m/news/1105654554?lang=zh_cn&edition=full","pubTime":"2026-11-06 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22:34","pubTimestamp":1793889286,"startTime":"0","endTime":"0","summary":"11月5日，应用材料盘中下跌6.24%，报348.57美元/股，成交额2.62亿美元。消息面上，半导体设备及芯片概念股当日再度走弱，成为压制股价的直接因素。盘前数据显示，高通跌9.7%，AMD跌3.7%，拉姆研究跌3.6%，科磊跌3.2%，应用材料跌3.4%，板块联动明显。此外，公司增持Besi至约20%以强化先进封装合作，但已明确无意继续增持且不寻求董事会席位，事件更偏长期战略协同，短线边际提振效应减弱。（以上内容均基于市场公开消息，由程序或算法智能生成，仅作为股价异动提醒，不作为投资建议或交易依据。）","market":"us","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":"应用材料盘中走弱，半导体设备板块集体承压","news_tag":"dataReport","news_rank":0,"length":0,"strategy_id":0,"source":null,"symbols":["AMAT"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2681042092","title":"美股盘前芯片概念股普跌，高通跌 9.7%，AMD 跌 3.7%","url":"https://stock-news.laohu8.com/highlight/detail?id=2681042092","media":"链捕手","labels":["dataReport"],"top":-1,"itemType":null,"share":"https://www.laohunote.com/m/news/2681042092?lang=zh_cn&edition=full","pubTime":"2026-11-05 17:18","pubTimestamp":1793870330,"startTime":"0","endTime":"0","summary":" ChainCatcher 消息，据 Rootdata 行情数据，美股盘前芯片概念股普跌：高通 (QCOM.O) 下跌 9.7%，AMD (AMD.O) 下跌 3.7%，Arm (ARM.O) 下跌 3.6%，拉姆研究 (LRCX.O) 下跌 3.6%，应用材料 (AMAT.O) 下跌 3.4%，迈威尔科技 (MRVL.O) 下跌 3.3%，科磊 (KLAC.O) 下跌 3.2%，美光 (MU.O) 下跌 3%，英特尔 (INTC.O) 下跌 2.7%，博通 (AVGO.O) 下跌 1.9%，台积电 (TSM.N) 下跌 1.8%，阿斯麦 (ASML.O) 下跌 1.7%。 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Inc跌4.4%，板块联动明显。此外，公司将对Besi持股提升至约20%以强化先进封装合作，但已明确无意继续增持且不寻求董事会席位，显示该事件更偏长期战略协同，短线边际提振效应减弱。（以上内容均基于市场公开消息，由程序或算法智能生成，仅作为股价异动提醒，不作为投资建议或交易依据。）","market":"us","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":"半导体板块走弱，应用材料盘前承压","news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":null,"symbols":["AMAT"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"1145111885","title":"异动解读｜应用材料夜盘下跌3.08%，半导体设备板块走弱压制股价","url":"https://stock-news.laohu8.com/highlight/detail?id=1145111885","media":"行情直击","labels":[],"top":-1,"itemType":null,"share":"https://www.laohunote.com/m/news/1145111885?lang=zh_cn&edition=full","pubTime":"2026-11-05 09:20","pubTimestamp":1793841650,"startTime":"0","endTime":"0","summary":"11月5日，应用材料夜盘下跌3.08%，报358.03美元/股，成交额53.67万美元。消息面上，半导体设备板块再度走弱，成为压制股价的直接因素；同行中，拉姆研究跌2.67%，阿斯麦跌2.16%，科磊跌2.27%，泰瑞达跌2.41%，AXT Inc跌4.63%。此外，公司将对Besi持股提升至约20%以强化先进封装合作，但已明确无意继续增持且不寻求董事会席位，显示该事件更偏长期战略协同，短线边际提振效应减弱。（以上内容均基于市场公开消息，由程序或算法智能生成，仅作为股价异动提醒，不作为投资建议或交易依据。）","market":"hk","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":"半导体设备板块走弱，应用材料夜盘下跌","news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":null,"symbols":["AMAT"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"1139030804","title":"财报前瞻 | 应用材料本季度营收预计增51.45%，机构观点偏乐观","url":"https://stock-news.laohu8.com/highlight/detail?id=1139030804","media":"财报Agent","labels":["earningPreview"],"top":1,"itemType":null,"share":"https://www.laohunote.com/m/news/1139030804?lang=zh_cn&edition=full","pubTime":"2026-11-05 08:02","pubTimestamp":1793836928,"startTime":"0","endTime":"0","summary":"应用材料将于2026年11月12日发布新财季业绩，市场普遍预计营收与盈利同比显著提升，AI相关资本开支周期仍在演进中。市场一致预期显示，本季度应用材料营收预计为102.99亿美元，同比增51.45%；调整后每股收益预计为4.05美元，同比增86.80%；EBIT预计为36.17亿美元，同比增85.75%。公司上季度管理层在财报中对本季度的收入、毛利率、净利润或净利率、调整后每股收益的指引未在可得资料中披露。","market":"us","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":"财报前瞻 | 应用材料本季度营收预计增51.45%，机构观点偏乐观","news_tag":"earningPreview","news_rank":0,"length":0,"strategy_id":0,"source":null,"symbols":["AMAT"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"1100185525","title":"异动解读｜应用材料盘中下跌3.35%，半导体设备板块走弱压制股价","url":"https://stock-news.laohu8.com/highlight/detail?id=1100185525","media":"行情直击","labels":[],"top":-1,"itemType":null,"share":"https://www.laohunote.com/m/news/1100185525?lang=zh_cn&edition=full","pubTime":"2026-11-04 23:54","pubTimestamp":1793807693,"startTime":"0","endTime":"0","summary":"11月4日，应用材料盘中下跌3.35%，报369.77美元/股，成交额7.73亿美元。消息面上，半导体设备板块当日整体走弱，成为压制公司股价的直接因素；同时，公司增持Besi至约20%以强化先进封装合作的消息边际提振作用有所减弱。从板块表现看，阿斯麦跌3.85%，科磊跌3.51%，拉姆研究跌2.08%，同业普遍承压。此前应用材料已明确将Besi持股提升至约20%，但无意继续增持，也不会寻求董事会席位，显示该事件更偏长期战略协同，短线对股价的支撑有限。（以上内容均基于市场公开消息，由程序或算法智能生成，仅作为股价异动提醒，不作为投资建议或交易依据。）","market":"us","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":"半导体设备板块走弱，应用材料承压下行","news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":null,"symbols":["AMAT"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"1164036739","title":"异动解读｜应用材料夜盘下跌3.07%，先进封装增持消息边际效应减弱","url":"https://stock-news.laohu8.com/highlight/detail?id=1164036739","media":"行情直击","labels":[],"top":-1,"itemType":null,"share":"https://www.laohunote.com/m/news/1164036739?lang=zh_cn&edition=full","pubTime":"2026-11-04 09:07","pubTimestamp":1793754454,"startTime":"0","endTime":"0","summary":"11月4日，应用材料夜盘下跌3.07%，报370.6美元/股，成交额40.36万美元。近期消息面上，公司此前宣布将对荷兰先进封装设备商Besi的持股比例提升至约20%，以强化双方在先进封装领域的长期战略合作；公司同时明确无意继续增持，也不会寻求董事会席位。从已披露信息看，该投资最初于4月启动，10月下旬公司进一步确认增持安排。尽管这一布局一度提振市场对先进封装协同的预期，但当前半导体设备板块夜盘整体走弱，拉姆研究、科磊、泰瑞达等同业同步下跌，应用材料股价随板块承压。（以上内容均基于市场公开消息，由程序或算法智能生成，仅作为股价异动提醒，不作为投资建议或交易依据。）","market":"hk","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":"应用材料夜盘下跌，先进封装增持效应减弱","news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":null,"symbols":["AMAT"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"1104158681","title":"美股异动 | 费城半导体指数升逾3%，闪迪升逾5%，美光科技升逾4%，莱迪思半导体绩后升逾12%","url":"https://stock-news.laohu8.com/highlight/detail?id=1104158681","media":"老虎资讯综合","labels":[],"top":-1,"itemType":null,"share":"https://www.laohunote.com/m/news/1104158681?lang=zh_cn&edition=full","pubTime":"2026-11-03 23:00","pubTimestamp":1793718015,"startTime":"0","endTime":"0","summary":"11月3日，费城半导体指数升逾3%，存储、半导体股涨幅居前，闪迪升逾5%，美光科技升逾4%，ARM、Coherent、美国超微公司、博通、英特尔升逾3%,阿斯麦升逾2%；莱迪思半导体升逾12%。莱迪思半导体公布截至10月3日的第三财季业绩，非GAAP每股摊薄收益0.72美元，营收2.91亿美元，均超预期；公司预计第四财季非GAAP每股收益0.82至0.86美元，营收3.25亿至3.45亿美元，指引同样高于市场预期。","market":"us","thumbnail":"https://static.tigerbbs.com/f5e8aba7de194dc92d26747c1cfec057","type":0,"news_type":0,"thumbnails":["https://static.tigerbbs.com/f5e8aba7de194dc92d26747c1cfec057"],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"","is_publish_highlight":true,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":null,"symbols":["QRVO","SOXS","QCOM","SNPS","STM","AMAT","SOXL","NXPI","LSCC","ASML","ADI","SOX","UMC","MRVL","ALAB","MU","KLAC","SWKS","MCHP","AMBQ","AVGO","TSM","SNDK","WOLF","Q","SMTC","ARM","STX","UCTT","HIMX","NVTS","SMH","SMCI","ON","LRCX","GFS","TXN","AMBA","WDC","NVDA","AMD","INTC","CRDO","PXLW"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"1138312019","title":"异动解读｜应用材料盘中上涨3.06%，增持Besi至约20%强化先进封装布局","url":"https://stock-news.laohu8.com/highlight/detail?id=1138312019","media":"行情直击","labels":[],"top":-1,"itemType":null,"share":"https://www.laohunote.com/m/news/1138312019?lang=zh_cn&edition=full","pubTime":"2026-11-03 22:45","pubTimestamp":1793717105,"startTime":"0","endTime":"0","summary":"11月3日，应用材料盘中上涨3.06%，报388.405美元/股，成交额1.98亿美元。消息面上，公司此前宣布将对荷兰先进封装设备商Besi的持股比例提升至约20%，以强化双方在先进封装领域的长期战略合作。已披露信息显示，应用材料最初于4月投资Besi；本次增持后，公司明确无意继续提高持股，也不会寻求董事会席位。叠加当日美股盘前芯片概念股普涨，半导体设备板块情绪整体偏强。（以上内容均基于市场公开消息，由程序或算法智能生成，仅作为股价异动提醒，不作为投资建议或交易依据。）","market":"hk","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":"应用材料走强，增持Besi强化先进封装","news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":null,"symbols":["AMAT"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"1197018634","title":"异动解读｜应用材料盘前上涨3.17%，增持Besi至约20%强化先进封装布局","url":"https://stock-news.laohu8.com/highlight/detail?id=1197018634","media":"行情直击","labels":[],"top":-1,"itemType":null,"share":"https://www.laohunote.com/m/news/1197018634?lang=zh_cn&edition=full","pubTime":"2026-11-03 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