应交易所要求,美/港股行情延时15分钟展示,下载APP即可免费查看实时行情。
关闭
91199 江苏芯德半导体科技股份有限公司(临时代码)
休市中 10-23 16:00:00
0.000
+0.000
--
最高
0.000
最低
0.000
成交量
0.00
今开
0.000
昨收
0.000
日振幅
0.00%
总市值
0.00
流通市值
0.00
总股本
0.00
成交额
0.00
换手率
--
流通股本
0.00
市净率
--
ROE
--
每股收益
0.00
52周最高
--
52周最低
--
市盈率
--
股息
--
股息收益率
--
ROA
--
分时
五日
日K
周K
月K
数据加载中...
北京优虎网络科技有限公司
免责声明:香港交易所资讯服务有限公司、其控股公司及/或该等控股公司的任何附属公司均竭力确保所提供信息的准确和可靠度,但不能保证其绝对准确和可靠,且亦不会承担因任何不准确或遗漏而引起的任何损失或损害的责任(不管是否侵权法下的责任或合约责任又或其它责任)
资讯
新帖
简况
芯德半导体港股聆讯落地,董事长薪酬一年涨超八倍,营收增长利润仍亏
蓝鲸财经 · 10-23 17:37
芯德半导体港股聆讯落地,董事长薪酬一年涨超八倍,营收增长利润仍亏
新股解读|成立仅6年的芯德半导体通过聆讯,如何看先进封测新星的成长后劲?
智通财经 · 10-23 10:10
新股解读|成立仅6年的芯德半导体通过聆讯,如何看先进封测新星的成长后劲?
芯德半导体通过港交所聆讯,小米、OPPO、联发科为股东,今年前四个月收入3.6亿元
市场资讯 · 10-22
芯德半导体通过港交所聆讯,小米、OPPO、联发科为股东,今年前四个月收入3.6亿元
新股消息 | 芯德半导体通过港交所聆讯 专注于半导体封测技术解决方案
智通财经 · 10-22
新股消息 | 芯德半导体通过港交所聆讯 专注于半导体封测技术解决方案
江苏芯德半导体科技股份有限公司通过港交所上市聆讯
格隆汇 · 10-21
江苏芯德半导体科技股份有限公司通过港交所上市聆讯
据港交所文件:江苏芯德半导体科技股份有限公司通过港交所上市聆讯。
智通财经 · 10-21
据港交所文件:江苏芯德半导体科技股份有限公司通过港交所上市聆讯。
新股消息 | 芯德半导体港股IPO及境内未上市股份“全流通”获中国证监会备案
智通财经 · 09-18
新股消息 | 芯德半导体港股IPO及境内未上市股份“全流通”获中国证监会备案
芯德半导体港股上市获中国证监会备案
智通财经 · 09-18
芯德半导体港股上市获中国证监会备案
港股半导体板块尾盘继续拉升,澜起科技涨超20%
每日经济新闻 · 05-13
港股半导体板块尾盘继续拉升,澜起科技涨超20%
新股前瞻|芯德半导体:增收难增利,先进封测新秀能否穿越亏损周期?
智通财经 · 05-13
新股前瞻|芯德半导体:增收难增利,先进封测新秀能否穿越亏损周期?
成立不到六年,芯德半导体冲刺港股
华尔街见闻 · 05-09
成立不到六年,芯德半导体冲刺港股
新股消息 | 芯德半导体二次递表港交所
智通财经 · 05-08
新股消息 | 芯德半导体二次递表港交所
新股消息 | 芯德半导体港股IPO招股书失效
智通财经网 · 04-30
新股消息 | 芯德半导体港股IPO招股书失效
加载更多
公司概况
公司名称:
江苏芯德半导体科技股份有限公司(临时代码)
所属市场:
SEHK
上市日期:
--
主营业务:
发行价格:
--
{"stockData":{"symbol":"91199","market":"HK","secType":"STK","nameCN":"江苏芯德半导体科技股份有限公司(临时代码)","latestPrice":0,"timestamp":1792742400000,"preClose":0,"halted":9,"volume":0,"delay":0,"floatShares":0,"shares":0,"eps":0,"marketStatus":"休市中","change":0,"latestTime":"10-23 16:00:00","open":0,"high":0,"low":0,"amount":0,"amplitude":0,"askPrice":0,"askSize":0,"bidPrice":0,"bidSize":0,"shortable":3,"etf":0,"ttmEps":0,"tradingStatus":0,"nextMarketStatus":{"tag":"开盘","tradingStatus":2,"beginTime":1792978200000},"marketStatusCode":7,"adr":0,"exchange":"SEHK","adjPreClose":0,"openAndCloseTimeList":[[1792719000000,1792728000000],[1792731600000,1792742400000]],"volumeRatio":0,"lotSize":100,"spreadScale":0},"requestUrl":"/m/hq/s/91199","defaultTab":"news","newsList":[{"id":"2677940854","title":"芯德半导体港股聆讯落地,董事长薪酬一年涨超八倍,营收增长利润仍亏","url":"https://stock-news.laohu8.com/highlight/detail?id=2677940854","media":"蓝鲸财经","labels":[],"top":-1,"itemType":null,"share":"https://www.laohunote.com/m/news/2677940854?lang=zh_cn&edition=full","pubTime":"2026-10-23 17:37","pubTimestamp":1792748225,"startTime":"0","endTime":"0","summary":"芯德半导体成立于2020年9月,定位为半导体封测技术解决方案提供商,采用OSAT模式,其核心业务聚焦封装设计及测试服务。值得注意的是,2025年董事长张国栋的薪酬达到1527万元,较前一年涨幅超过八倍,四名执行董事合计薪酬较2024年增加170%、超过3700万元,其中股份支付集中摊销是重要推手。整体来看,营收快速增长未能覆盖高昂的固定成本及前期投入。","market":"sh","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":["earning"],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://www.lanjinger.com/d/1792747455880655435","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"lanjinger_stock","symbols":["91199"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2677991986","title":"新股解读|成立仅6年的芯德半导体通过聆讯,如何看先进封测新星的成长后劲?","url":"https://stock-news.laohu8.com/highlight/detail?id=2677991986","media":"智通财经","labels":[],"top":-1,"itemType":null,"share":"https://www.laohunote.com/m/news/2677991986?lang=zh_cn&edition=full","pubTime":"2026-10-23 10:10","pubTimestamp":1792721441,"startTime":"0","endTime":"0","summary":"2020年9月才成立的芯德半导体,距离叩开港交所的大门似乎只剩下临门一脚了。间隔一年时间,芯德半导体如愿通过聆讯。2026年前四个月,芯德半导体的收入为3.60亿元,同比增长17.4%。收入扩张的同时,由于公司整体仍处于战略投入期,芯德半导体尚未完成扭亏。芯德半导体的招股书显示,2025年全球半导体先进封测市场规模为3967亿元,预计到2030年将增长至7903亿元,对应期间的复合年增长率高达14.8%。","market":"fut","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"http://www.zhitongcaijing.com/content/detail/1511272.html","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"stock_zhitongcaijing","symbols":["91199"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2677598579","title":"芯德半导体通过港交所聆讯,小米、OPPO、联发科为股东,今年前四个月收入3.6亿元","url":"https://stock-news.laohu8.com/highlight/detail?id=2677598579","media":"市场资讯","labels":[],"top":-1,"itemType":null,"share":"https://www.laohunote.com/m/news/2677598579?lang=zh_cn&edition=full","pubTime":"2026-10-22 08:01","pubTimestamp":1792627260,"startTime":"0","endTime":"0","summary":"来源:独角兽早知道 iponews10月21日,据港交所披露,江苏芯德半导体科技股份有限公司更新聆讯后资料集,公司正式通过港交所主板上市聆讯,华泰国际担任独家保荐人。小米、OPPO、联发科的集体入局,并非单纯的财务投资。截至2026年4月30日止四个月,营收继续同比增长17.4%至3.60亿元。2026年前四个月,亏损为1.62亿元。芯德半导体成立于2020年,目前正处于这一行业周期的爬坡关键期。截至2026年4月30日,公司拥有277名研发人员。","market":"fut","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://finance.sina.com.cn/stock/hkstock/2026-10-22/doc-inivzyty4806624.shtml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"sina","symbols":["91199"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2677499983","title":"新股消息 | 芯德半导体通过港交所聆讯 专注于半导体封测技术解决方案","url":"https://stock-news.laohu8.com/highlight/detail?id=2677499983","media":"智通财经","labels":[],"top":-1,"itemType":null,"share":"https://www.laohunote.com/m/news/2677499983?lang=zh_cn&edition=full","pubTime":"2026-10-22 06:45","pubTimestamp":1792622728,"startTime":"0","endTime":"0","summary":"智通财经APP获悉,据港交所10月21日披露,江苏芯德半导体科技股份有限公司通过港交所主板上市聆讯,华泰国际为独家保荐人。招股书显示,芯德半导体是一家半导体封测技术解决方案提供商,主要从事开发封装设计、提供定制封装产品以及封装产品测试服务。在晶体管密度增长接近其规模极限的“后摩尔时代”,依靠新型半导体封装架构作为连接芯片设计与应用的关键环节成为了提升芯片性能、效率及功能灵活性的关键驱动力。","market":"fut","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"http://www.zhitongcaijing.com/content/detail/1510458.html","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"stock_zhitongcaijing","symbols":["91199"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2677608341","title":"江苏芯德半导体科技股份有限公司通过港交所上市聆讯","url":"https://stock-news.laohu8.com/highlight/detail?id=2677608341","media":"格隆汇","labels":[],"top":-1,"itemType":null,"share":"https://www.laohunote.com/m/news/2677608341?lang=zh_cn&edition=full","pubTime":"2026-10-21 22:57","pubTimestamp":1792594622,"startTime":"0","endTime":"0","summary":null,"market":"sh","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://www.gelonghui.com/rss/live/live.xml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"live_gelonghui","symbols":["91199"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2677260834","title":"据港交所文件:江苏芯德半导体科技股份有限公司通过港交所上市聆讯。","url":"https://stock-news.laohu8.com/highlight/detail?id=2677260834","media":"智通财经","labels":[],"top":-1,"itemType":null,"share":"https://www.laohunote.com/m/news/2677260834?lang=zh_cn&edition=full","pubTime":"2026-10-21 22:55","pubTimestamp":1792594507,"startTime":"0","endTime":"0","summary":null,"market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://www.zhitongcaijing.com/immediately.html?type=usstock","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"live_zhitongcaijing","symbols":["91199"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2668472899","title":"新股消息 | 芯德半导体港股IPO及境内未上市股份“全流通”获中国证监会备案","url":"https://stock-news.laohu8.com/highlight/detail?id=2668472899","media":"智通财经","labels":[],"top":-1,"itemType":null,"share":"https://www.laohunote.com/m/news/2668472899?lang=zh_cn&edition=full","pubTime":"2026-09-18 18:32","pubTimestamp":1789727527,"startTime":"0","endTime":"0","summary":"智通财经APP获悉,9月18日,中国证监会国际合作司发布《关于江苏芯德半导体科技股份有限公司境外发行上市及境内未上市股份“全流通”备案通知书》。公司51名股东拟将所持合计693,909,187股境内未上市股份转为境外上市股份,并在香港联合交易所上市流通。招股书显示,芯德半导体是一家半导体封测技术解决方案提供商,主要从事开发封装设计、提供定制封装产品以及封装产品测试服务。","market":"sh","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"http://www.zhitongcaijing.com/content/detail/1498101.html","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"stock_zhitongcaijing","symbols":["91199"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2668942708","title":"芯德半导体港股上市获中国证监会备案","url":"https://stock-news.laohu8.com/highlight/detail?id=2668942708","media":"智通财经","labels":[],"top":-1,"itemType":null,"share":"https://www.laohunote.com/m/news/2668942708?lang=zh_cn&edition=full","pubTime":"2026-09-18 18:09","pubTimestamp":1789726151,"startTime":"0","endTime":"0","summary":null,"market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://www.zhitongcaijing.com/immediately.html?type=usstock","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"live_zhitongcaijing","symbols":["91199"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2635096132","title":"港股半导体板块尾盘继续拉升,澜起科技涨超20%","url":"https://stock-news.laohu8.com/highlight/detail?id=2635096132","media":"每日经济新闻","labels":[],"top":-1,"itemType":null,"share":"https://www.laohunote.com/m/news/2635096132?lang=zh_cn&edition=full","pubTime":"2026-05-13 15:46","pubTimestamp":1778658364,"startTime":"0","endTime":"0","summary":"港股半导体板块尾盘继续拉升,澜起科技涨超20%","market":"hk","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"stock_eastmoney","url":"http://finance.eastmoney.com/a/202605133735871679.html","rn_cache_url":null,"directOrigin":true},"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"http://finance.eastmoney.com/a/202605133735871679.html","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"stock_eastmoney","symbols":["BK1163","LU2476274308.USD","91210","LU1997245177.USD","LU2778985437.USD","LU1770034418.SGD","BK4585","LU1997245094.SGD","LU1997244956.HKD","LU1719994722.HKD","LU2289578879.USD","LU2039709279.SGD","BK0214","LU0456842615.SGD","LU1251922891.USD","LU1303224171.USD","BK4535","LU2495084118.USD","91199","BK4588","LU2476274720.SGD"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2635229572","title":"新股前瞻|芯德半导体:增收难增利,先进封测新秀能否穿越亏损周期?","url":"https://stock-news.laohu8.com/highlight/detail?id=2635229572","media":"智通财经","labels":[],"top":-1,"itemType":null,"share":"https://www.laohunote.com/m/news/2635229572?lang=zh_cn&edition=full","pubTime":"2026-05-13 08:59","pubTimestamp":1778633975,"startTime":"0","endTime":"0","summary":"芯德半导体在封装行业的地位得益于公司持续的技术创新投入及进步。营收三年翻倍,亏损持续扩大招股书财务数据显示,芯德半导体近三年营收保持高速增长,2023至2025年分别实现收入5.09亿元、8.27亿元、10.12亿元,复合年增长率达41%,呈现出强劲的业务扩张势头。整体而言,芯德半导体作为国内先进封测赛道代表性企业,身处高景气赛道,长期成长逻辑清晰。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"http://www.zhitongcaijing.com/content/detail/1440991.html","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"stock_zhitongcaijing","symbols":["BK4535","BK4585","BK4588","91199"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2634947490","title":"成立不到六年,芯德半导体冲刺港股","url":"https://stock-news.laohu8.com/highlight/detail?id=2634947490","media":"华尔街见闻","labels":["corporation"],"top":-1,"itemType":null,"share":"https://www.laohunote.com/m/news/2634947490?lang=zh_cn&edition=full","pubTime":"2026-05-09 16:54","pubTimestamp":1778316850,"startTime":"0","endTime":"0","summary":"近三年已亏损超10亿。","market":"fut","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://wallstreetcn.com/articles/3771901","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"corporation","news_rank":0,"length":0,"strategy_id":0,"source":null,"symbols":["BK4535","BK4588","BK4585","91199"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2633569324","title":"新股消息 | 芯德半导体二次递表港交所","url":"https://stock-news.laohu8.com/highlight/detail?id=2633569324","media":"智通财经","labels":[],"top":-1,"itemType":null,"share":"https://www.laohunote.com/m/news/2633569324?lang=zh_cn&edition=full","pubTime":"2026-05-08 20:20","pubTimestamp":1778242827,"startTime":"0","endTime":"0","summary":"智通财经APP获悉,据港交所5月8日披露,江苏芯德半导体科技股份有限公司(简称:芯德半导体)向港交所提交上市申请书,华泰国际为独家保荐人。芯德半导体曾于2025年10月31日递表。招股书显示,芯德半导体是一家半导体封测技术解决方案提供商,主要从事开发封装设计、提供定制封装产品以及封装产品测试服务。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"http://www.zhitongcaijing.com/content/detail/1439751.html","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"stock_zhitongcaijing","symbols":["91199","BK4535","BK4585","BK4588"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2631508865","title":"新股消息 | 芯德半导体港股IPO招股书失效","url":"https://stock-news.laohu8.com/highlight/detail?id=2631508865","media":"智通财经网","labels":[],"top":-1,"itemType":null,"share":"https://www.laohunote.com/m/news/2631508865?lang=zh_cn&edition=full","pubTime":"2026-04-30 10:29","pubTimestamp":1777516141,"startTime":"0","endTime":"0","summary":"江苏芯德半导体科技股份有限公司(简称:芯德半导体)于2025年10月31日所递交的港股招股书满6个月,于2026年4月30日失效,递表时华泰国际为独家保荐人。","market":"fut","thumbnail":"https://img.zhitongcaijing.com/image/20260430/20260430102921_35025.png?x-oss-process=image/format,jpg/quality,Q_80/resize,w_250","type":0,"news_type":0,"thumbnails":["https://img.zhitongcaijing.com/image/20260430/20260430102921_35025.png?x-oss-process=image/format,jpg/quality,Q_80/resize,w_250"],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"http://www.zhitongcaijing.com/content/detail/1437006.html","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"highlight_zhitongcaijin","symbols":["BK4535","BK4585","BK4588","91199"],"isVideo":false,"video":null,"gpt_icon":0}],"profile":{"compareEarnings":[{"period":"1week","weight":-0.0452},{"period":"1month","weight":-0.0701},{"period":"3month","weight":-0.0749},{"period":"6month","weight":-0.111},{"period":"1year","weight":-0.1107},{"period":"ytd","weight":-0.099}],"compareStock":{"symbol":"HSI","name":"恒生指数"},"exchange":"SEHK","name":"江苏芯德半导体科技股份有限公司(临时代码)","nameEN":"Jiangsu Silicon Integrity Semiconductor Technology Co., Ltd."},"APP":{"userAgent":"Mozilla/5.0 AppleWebKit/537.36 (KHTML, like Gecko; compatible; ClaudeBot/1.0; +claudebot@anthropic.com)","isDev":false,"isTTM":false,"isLaohu8Offline":false,"tenantId":"TBCN","deviceId":"web-server-community-laohu8-v3","version":"4.52.0","shortVersion":"4.52.0","platform":"web","vendor":"web","appName":"laohu8","isIOS":false,"isAndroid":false,"isTiger":false,"isTHS":false,"isWeiXin":false,"isWeiXinMini":false,"isWeiBo":false,"isQQ":false,"isBaiduSwan":false,"isBaiduBox":false,"isDingTalk":false,"isToutiao":false,"isOnePlus":false,"isHuaWei":false,"isXiaomi":false,"isXiaomiWebView":false,"isOppo":false,"isVivo":false,"isSamsung":false,"isMobile":false},"pagemeta":{"title":"江苏芯德半导体科技股份有限公司(临时代码)(91199)_个股概要_股票价格_最新资讯_行情走势_历史数据","description":"美港股上老虎。老虎社区提供江苏芯德半导体科技股份有限公司(临时代码)(91199)今日价格,行情走势,历史数据,股票概要及实时的新闻资讯,近期大事等重要参考决策数据。","keywords":"江苏芯德半导体科技股份有限公司(临时代码),91199,江苏芯德半导体科技股份有限公司(临时代码)股票,江苏芯德半导体科技股份有限公司(临时代码)股票老虎,江苏芯德半导体科技股份有限公司(临时代码)股票老虎国际,江苏芯德半导体科技股份有限公司(临时代码)行情,江苏芯德半导体科技股份有限公司(临时代码)股票行情,江苏芯德半导体科技股份有限公司(临时代码)股价,江苏芯德半导体科技股份有限公司(临时代码)股市,江苏芯德半导体科技股份有限公司(临时代码)股票价格,江苏芯德半导体科技股份有限公司(临时代码)股票交易,江苏芯德半导体科技股份有限公司(临时代码)股票购买,江苏芯德半导体科技股份有限公司(临时代码)股票实时行情,购买美股,购买港股,港股开户,美股开户,美股交易,港股交易,开通美港股账户,老虎国际行情","social":{"og_title":"江苏芯德半导体科技股份有限公司(临时代码)(91199)_个股概要_股票价格_最新资讯_行情走势_历史数据","og_description":"美港股上老虎。老虎社区提供江苏芯德半导体科技股份有限公司(临时代码)(91199)今日价格,行情走势,历史数据,股票概要及实时的新闻资讯,近期大事等重要参考决策数据。","og_image":"https://static.tigerbbs.com/a0b84b8debbbce3b4440f7fdd5eed2e7"}}}