688249 晶合集成
已收盘 09-30 15:00:00
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作价9.08亿元！688249拿全资子公司股权加码光罩
每日经济新闻 · 09-30 23:36
作价9.08亿元！688249拿全资子公司股权加码光罩
晶合集成：拟以子公司股权作价9.08亿元增资安徽晶镁
格隆汇 · 09-30 18:32
晶合集成：拟以子公司股权作价9.08亿元增资安徽晶镁
晶合集成（688249）披露关于变更公司注册资本、修订《公司章程》并办理工商登记的公告，9月29日股价上涨2.62%
证券之星 · 09-29
晶合集成（688249）披露关于变更公司注册资本、修订《公司章程》并办理工商登记的公告，9月29日股价上涨2.62%
晶合集成（688249）9月24日主力资金净卖出6999.48万元
证券之星 · 09-25
晶合集成（688249）9月24日主力资金净卖出6999.48万元
港股异动 | 晶合集成(02249)涨超3% 公司28nm逻辑工艺平台已导入客户样品流片验证中
智通财经 · 09-15
港股异动 | 晶合集成(02249)涨超3% 公司28nm逻辑工艺平台已导入客户样品流片验证中
晶合集成2023年股权激励预留部分首批归属14.16万股 9月18日上市流通
财闻 · 09-14
晶合集成2023年股权激励预留部分首批归属14.16万股 9月18日上市流通
摩根士丹利在晶合集成的H股好仓比例上升1.26%至6.71%
南方财经网 · 09-14
摩根士丹利在晶合集成的H股好仓比例上升1.26%至6.71%
晶合集成公告：141,613股限售期即将届满，9月18日起上市流通
美股速递 · 09-14
晶合集成公告：141,613股限售期即将届满，9月18日起上市流通
晶合集成获得发明专利授权：“一种SRAM集成电路结构、静态随机存取存储器及其制备方法”
证券之星 · 09-14
晶合集成获得发明专利授权：“一种SRAM集成电路结构、静态随机存取存储器及其制备方法”
晶合集成获得发明专利授权：“用于工艺监测的关键尺寸条形结构及关键尺寸监测方法”
证券之星 · 09-11
晶合集成获得发明专利授权：“用于工艺监测的关键尺寸条形结构及关键尺寸监测方法”
晶合集成：后续代工报价会综合市场需求等因素综合考虑
格隆汇 · 09-10
晶合集成：后续代工报价会综合市场需求等因素综合考虑
晶合集成盘中涨近4% 近日拟以合肥瑞昱科技全部股权向安徽瑞晶半导体增资
新浪港股 · 09-10
晶合集成盘中涨近4% 近日拟以合肥瑞昱科技全部股权向安徽瑞晶半导体增资
TrendForce：二季度全球前十大晶圆代工厂合计产值接近534.9亿美元 再创新高
智通财经 · 09-09
TrendForce：二季度全球前十大晶圆代工厂合计产值接近534.9亿美元 再创新高
每周股票复盘：晶合集成（688249）以子公司股权出资2.4亿元参与增资
证券之星 · 09-06
每周股票复盘：晶合集成（688249）以子公司股权出资2.4亿元参与增资
股市必读：晶合集成新发布《晶合集成关于参加科创板2026年半年度半导体制造、设备及材料行业集体业绩说明会的公告》
证券之星 · 09-04
股市必读：晶合集成新发布《晶合集成关于参加科创板2026年半年度半导体制造、设备及材料行业集体业绩说明会的公告》
晶合集成（688249）披露将参加科创板2026年半年度半导体行业集体业绩说明会，9月2日股价下跌3.3%
证券之星 · 09-02
晶合集成（688249）披露将参加科创板2026年半年度半导体行业集体业绩说明会，9月2日股价下跌3.3%
摩根士丹利在晶合集成的H股好仓比例上升0.51%至7.15%
南方财经网 · 09-01
摩根士丹利在晶合集成的H股好仓比例上升0.51%至7.15%
股市必读：晶合集成新发布《H股公告-2026年中期报告》
证券之星 · 08-31
股市必读：晶合集成新发布《H股公告-2026年中期报告》
晶合集成2026年半年报：净利润下滑26%，显示驱动芯片占比收缩拖累盈利
蓝鲸财经 · 08-29
晶合集成2026年半年报：净利润下滑26%，显示驱动芯片占比收缩拖累盈利
晶合集成：华泰证券、天弘基金等多家机构于8月25日调研我司
证券之星 · 08-28
晶合集成：华泰证券、天弘基金等多家机构于8月25日调研我司
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公司概况
公司名称：
合肥晶合集成电路股份有限公司
所属行业：
计算机、通信和其他电子设备制造业
上市日期：
2023-05-05
主营业务：
合肥晶合集成电路股份有限公司的主营业务是12英寸晶圆代工业务及其配套服务。公司的主要产品是DDIC、CIS、PMIC、Logic、MCU。
发行价格：
19.86
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23:36","pubTimestamp":1790782616,"startTime":"0","endTime":"0","summary":"9月30日盘后，晶合集成（SH688249，股价32.81元，市值733亿元）公告称，公司拟以其持有的全资子公司合肥晶为科技有限公司（以下简称合肥晶为）100%股权作价90825.33万元，向安徽晶镁光罩有限公司（以下简称安徽晶镁）增资。增资完成后，公司对安徽晶镁的直接持股比例将由16.6667%升至32.1599%。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"stock_eastmoney","url":"http://finance.eastmoney.com/a/202609303887950449.html","rn_cache_url":null,"directOrigin":true},"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"http://finance.eastmoney.com/a/202609303887950449.html","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"shareholding","news_rank":0,"length":0,"strategy_id":0,"source":"stock_eastmoney","symbols":["688249","BK0214"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2671720371","title":"晶合集成：拟以子公司股权作价9.08亿元增资安徽晶镁","url":"https://stock-news.laohu8.com/highlight/detail?id=2671720371","media":"格隆汇","labels":[],"top":-1,"itemType":null,"share":"https://www.laohunote.com/m/news/2671720371?lang=zh_cn&edition=full","pubTime":"2026-09-30 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22:36","pubTimestamp":1790692583,"startTime":"0","endTime":"0","summary":"截至2026年9月29日收盘，晶合集成报收于34.08元，较前一交易日上涨2.62%，最新总市值为761.62亿元。近日，晶合集成发布《关于变更公司注册资本、修订〈公司章程〉并办理工商登记的公告》。公告显示，合肥晶合集成电路股份有限公司因2023年限制性股票激励计划预留授予部分第一个归属期归属条件成就，完成141,613股限制性股票的股份登记，公司总股本由2,234,645,597股增加至2,234,787,210股，注册资本相应由2,234,645,597.00元增加至2,234,787,210.00元。同时修订《公司章程》第六条和第二十条相关内容。","market":"hk","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://stock.stockstar.com/RB2026092900040657.shtml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"stockstar","symbols":["BK0214","BK1163","02249","688249"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2670227419","title":"晶合集成（688249）9月24日主力资金净卖出6999.48万元","url":"https://stock-news.laohu8.com/highlight/detail?id=2670227419","media":"证券之星","labels":[],"top":-1,"itemType":null,"share":"https://www.laohunote.com/m/news/2670227419?lang=zh_cn&edition=full","pubTime":"2026-09-25 08:29","pubTimestamp":1790296185,"startTime":"0","endTime":"0","summary":"证券之星消息，截至2026年9月24日收盘，晶合集成报收于34.82元，下跌4.24%，换手率0.69%，成交量13.84万手，成交额4.9亿元。9月24日的资金流向数据方面，主力资金净流出6999.48万元，占总成交额14.28%，游资资金净流出982.87万元，占总成交额2.01%，散户资金净流入7982.35万元，占总成交额16.29%。融券方面，融券卖出1800.0股，融券偿还0.0股，融券余量3.05万股，融券余额106.2万元。晶合集成主营业务：12英寸晶圆代工业务及其配套服务。","market":"fut","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://stock.stockstar.com/RB2026092500005232.shtml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"-1","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"stockstar","symbols":["02249","BK0214","688249","BK1163"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2667614900","title":"港股异动 | 晶合集成(02249)涨超3% 公司28nm逻辑工艺平台已导入客户样品流片验证中","url":"https://stock-news.laohu8.com/highlight/detail?id=2667614900","media":"智通财经","labels":["productRelease"],"top":-1,"itemType":null,"share":"https://www.laohunote.com/m/news/2667614900?lang=zh_cn&edition=full","pubTime":"2026-09-15 15:04","pubTimestamp":1789455859,"startTime":"0","endTime":"0","summary":"智通财经APP获悉，晶合集成涨超3%，截至发稿，涨2.85%，报26.76港元，成交额1791.99万港元。消息面上，近日，晶合集成在科创板2026年半年度半导体制造、设备及材料行业集体业绩说明会上表示，目前公司28nm逻辑工艺平台已导入客户样品流片验证，正在进行各项工艺效能指标的优化。从制程节点看，公司2026年上半年55nm及以下、90nm、110nm、150nm占主营业务收入的比例分别为14.29%、39.38%、26.72%、19.61%。该行认为，公司多制程、多平台的布局有望为未来业绩增长提供坚实基础。","market":"hk","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"http://www.zhitongcaijing.com/content/detail/1496135.html","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"productRelease","news_rank":0,"length":0,"strategy_id":0,"source":"stock_zhitongcaijing","symbols":["688249","VXUS","BK4585","BK4588","BK0214","02249","KCAI","BK1163"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2667668073","title":"晶合集成2023年股权激励预留部分首批归属14.16万股 9月18日上市流通","url":"https://stock-news.laohu8.com/highlight/detail?id=2667668073","media":"财闻","labels":[],"top":-1,"itemType":null,"share":"https://www.laohunote.com/m/news/2667668073?lang=zh_cn&edition=full","pubTime":"2026-09-14 18:51","pubTimestamp":1789383060,"startTime":"0","endTime":"0","summary":"9月14日，晶合集成完成2023年限制性股票激励计划预留授予部分第一个归属期的股份登记工作，本次归属股份141,613股将于2026年9月18日上市流通。归属股票来源为公司定向发行的人民币A股普通股，激励对象均不属于公司董事和高级管理人员。容诚会计师事务所于2026年9月2日出具验资报告，截至2026年8月26日，公司收到5名激励对象缴纳的141,613股股权认购款合计人民币1,411,881.61元，其中计入股本141,613.00元，计入资本公积1,270,268.61元。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://finance.sina.com.cn/stock/relnews/cn/2026-09-14/doc-iniruxuw4063613.shtml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"sina","symbols":["IPOS","BK1163","02249","BK0214","688249"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2667541436","title":"摩根士丹利在晶合集成的H股好仓比例上升1.26%至6.71%","url":"https://stock-news.laohu8.com/highlight/detail?id=2667541436","media":"南方财经网","labels":[],"top":-1,"itemType":null,"share":"https://www.laohunote.com/m/news/2667541436?lang=zh_cn&edition=full","pubTime":"2026-09-14 17:19","pubTimestamp":1789377572,"startTime":"0","endTime":"0","summary":"南财智讯9月14日电，香港交易所披露信息显示，MorganStanley（摩根士丹利）在晶合集成的H股好仓（L）比例于9月9日从5.45%上升至6.71%。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"stock_eastmoney","url":"http://finance.eastmoney.com/a/202609143873497715.html","rn_cache_url":null,"directOrigin":true},"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"http://finance.eastmoney.com/a/202609143873497715.html","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"stock_eastmoney","symbols":["02249","688249","BK0214","BK1163"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"1188164860","title":"晶合集成公告：141,613股限售期即将届满，9月18日起上市流通","url":"https://stock-news.laohu8.com/highlight/detail?id=1188164860","media":"美股速递","labels":["shareholding"],"top":-1,"itemType":null,"share":"https://www.laohunote.com/m/news/1188164860?lang=zh_cn&edition=full","pubTime":"2026-09-14 17:09","pubTimestamp":1789376950,"startTime":"0","endTime":"0","summary":"晶合集成近日发布公告，宣布其141,613股股票的锁定期即将结束。这批股份预计将于9月18日正式开启上市交易，届时可在二级市场进行流通。从时间节点来看，9月18日将成为一个关键窗口。届时，这部分股份将摆脱锁定束缚，进入自由交易状态。晶合集成作为国内半导体制造领域的重要参与者，其股价表现一直受到投资者的广泛关注。随着解禁日期的临近，市场各方或已开始调整相应的交易策略。","market":"us","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"shareholding","news_rank":0,"length":0,"strategy_id":0,"source":null,"symbols":["688249","BK0214"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2667386776","title":"晶合集成获得发明专利授权：“一种SRAM集成电路结构、静态随机存取存储器及其制备方法”","url":"https://stock-news.laohu8.com/highlight/detail?id=2667386776","media":"证券之星","labels":["productRelease"],"top":-1,"itemType":null,"share":"https://www.laohunote.com/m/news/2667386776?lang=zh_cn&edition=full","pubTime":"2026-09-14 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再创新高","url":"https://stock-news.laohu8.com/highlight/detail?id=2666533583","media":"智通财经","labels":[],"top":-1,"itemType":null,"share":"https://www.laohunote.com/m/news/2666533583?lang=zh_cn&edition=full","pubTime":"2026-09-09 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