688249 晶合集成
已收盘 07-19 15:00:00
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晶合集成07月17日主力资金流出419万元 连续3日减仓
自选股智能写手 · 07-17
晶合集成07月17日主力资金流出419万元 连续3日减仓
中银证券给予晶合集成买入评级：稼动率反映至财报存在迟滞性 高景气度有望体现在下半年业绩上
每日经济新闻 · 07-15
中银证券给予晶合集成买入评级：稼动率反映至财报存在迟滞性 高景气度有望体现在下半年业绩上
晶合集成2024年上半年预计净利1.5亿-2.2亿同比增加444%-604% 公司产能利用率持续提升
挖贝网 · 07-15
晶合集成2024年上半年预计净利1.5亿-2.2亿同比增加444%-604% 公司产能利用率持续提升
晶合集成(688249.SH)预计上半年净利扭亏为盈至1.5亿元-2.2亿元 产能持续满载
智通财经 · 07-14
晶合集成(688249.SH)预计上半年净利扭亏为盈至1.5亿元-2.2亿元 产能持续满载
晶合集成：上半年预盈1.5亿元—2.2亿元 同比扭亏
第一财经 · 07-14
晶合集成：上半年预盈1.5亿元—2.2亿元 同比扭亏
晶合集成：预计2024年1-6月归属净利润盈利1.5亿元至2.2亿元
证券之星 · 07-14
晶合集成：预计2024年1-6月归属净利润盈利1.5亿元至2.2亿元
晶合集成获得实用新型专利授权：“一种累和运算系统”
证券之星 · 07-13
晶合集成获得实用新型专利授权：“一种累和运算系统”
北向资金7月11日净买入晶合集成8.16万股 连续3日增持
自选股智能写手 · 07-12
北向资金7月11日净买入晶合集成8.16万股 连续3日增持
晶合集成获得发明专利授权：“控制刻蚀图形偏差的方法和系统”
证券之星 · 07-11
晶合集成获得发明专利授权：“控制刻蚀图形偏差的方法和系统”
晶合集成获得发明专利授权：“研磨方法及研磨设备”
证券之星 · 07-10
晶合集成获得发明专利授权：“研磨方法及研磨设备”
晶合集成获得实用新型专利授权：“晶圆处理装置、检测装置及半导体器件”
证券之星 · 07-09
晶合集成获得实用新型专利授权：“晶圆处理装置、检测装置及半导体器件”
晶合集成： 公司55nm中高阶单芯片及堆栈式图像传感器芯片已批量生产，中高阶CIS产品量产顺利
证券之星 · 07-05
晶合集成： 公司55nm中高阶单芯片及堆栈式图像传感器芯片已批量生产，中高阶CIS产品量产顺利
晶合集成(688249.SH)：55nm中高阶单芯片及堆栈式图像传感器芯片已批量生产
格隆汇资讯 · 07-05
晶合集成(688249.SH)：55nm中高阶单芯片及堆栈式图像传感器芯片已批量生产
晶合集成7月4日转融通出借成交45900股
金融界 · 07-05
晶合集成7月4日转融通出借成交45900股
晶合集成：APG ASSET MANAGEMENT、GREENWOODS ASSET MGMT LTD等多家机构于7月2日调研我司
证券之星 · 07-04
晶合集成：APG ASSET MANAGEMENT、GREENWOODS ASSET MGMT LTD等多家机构于7月2日调研我司
晶合集成：公司已根据市场情况对部分产品代工价格进行上调
每日经济新闻 · 07-03
晶合集成：公司已根据市场情况对部分产品代工价格进行上调
晶合集成：7月份订单数量高于6月份 预计第三季度产能将继续维持满载
第一财经 · 07-03
晶合集成：7月份订单数量高于6月份 预计第三季度产能将继续维持满载
晶合集成：目前公司的生产经营情况正常，订单充足，产能处于满载状态
每日经济新闻 · 07-03
晶合集成：目前公司的生产经营情况正常，订单充足，产能处于满载状态
晶合集成(688249.SH)累计回购4436.09万股 耗资6.32亿元
智通财经 · 07-01
晶合集成(688249.SH)累计回购4436.09万股 耗资6.32亿元
晶合集成6月产线负荷约为110% 计划于2024年内总扩产3万—5万片/月
证券时报网 · 06-25
晶合集成6月产线负荷约为110% 计划于2024年内总扩产3万—5万片/月
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公司概况
公司名称：
合肥晶合集成电路股份有限公司
所属行业：
计算机、通信和其他电子设备制造业
上市日期：
2023-05-05
主营业务：
合肥晶合集成电路股份有限公司的主营业务为12 英寸晶圆代工业务，致力于研发并应用行业先进的工艺，为客户提供多种制程节点、不同工艺平台的晶圆代工服务。公司的主要产品及服务为集成电路晶圆制造代工。
发行价格：
19.86
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22:03","pubTimestamp":1721052180,"startTime":"0","endTime":"0","summary":"中银证券07月15日发布研报称，给予晶合集成（688249.SH，最新价：15.06元）买入评级。评级理由主要包括：1）营业收入同比稳健增长；2）稼动率满载推动量价齐升，高景气度有望体现在下半年业绩上；3）OLED平台稳步推进，CIS积极扩产。风险提示：市场需求不及预期。行业竞争格局恶化。产品研发进度不及预期。（文章来源：每日经济新闻）","market":"sh","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN2024071522072795c0cf52&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, .wx-sou","directOrigin":true},"property":["rate","earning"],"language":"zh","translate_title":"","themeId":null,"isJumpTheme":false,"source_url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN2024071522072795c0cf52&s=b","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"tencent","symbols":["601696","688249"],"gpt_icon":0},{"id":"2451769389","title":"晶合集成2024年上半年预计净利1.5亿-2.2亿同比增加444%-604% 公司产能利用率持续提升","url":"https://stock-news.laohu8.com/highlight/detail?id=2451769389","media":"挖贝网","labels":[],"top":-1,"share":"https://www.laohu8.com/m/news/2451769389?lang=zh_cn&edition=full","pubTime":"2024-07-15 13:16","pubTimestamp":1721020569,"startTime":"0","endTime":"0","summary":"预计2024年半年度实现归属于母公司所有者的净利润15,000.00万元到22,000.00万元，与上年同期相比，将增加19,361.02万元到26,361.02万元，同比增长443.96%到604.47%。DDIC继续巩固优势，CIS成为公司第二大主轴产品，其他产品竞争力持续稳步提升。经财务部门初步测算，2024年上半年CIS占主营业务收入的比例持续提高。","market":"sh","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN202407151317299f4cb1a7&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, .wx-sou","directOrigin":true},"property":[],"language":"zh","translate_title":"","themeId":null,"isJumpTheme":false,"source_url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN202407151317299f4cb1a7&s=b","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"tencent","symbols":["688249","BK0214"],"gpt_icon":0},{"id":"2451685768","title":"晶合集成(688249.SH)预计上半年净利扭亏为盈至1.5亿元-2.2亿元 产能持续满载","url":"https://stock-news.laohu8.com/highlight/detail?id=2451685768","media":"智通财经","labels":[],"top":-1,"share":"https://www.laohu8.com/m/news/2451685768?lang=zh_cn&edition=full","pubTime":"2024-07-14 17:20","pubTimestamp":1720948827,"startTime":"0","endTime":"0","summary":"智通财经APP讯，晶合集成 发布2024年半年度业绩预告，预计2024年半年度实现营业收入43亿元至45亿元，与上年同期相比，将增加133033.41万元至153033.41万元，同比增长44.80%至51.53%。预计2024年半年度实现归属于母公司所有者的净利润1.5亿元到2.2亿元，与上年同期相比，将增加1.94亿元到2.64亿元，同比扭亏为盈。DDIC继续巩固优势，CIS成为公司第二大主轴产品，其他产品竞争力持续稳步提升。经财务部门初步测算，2024年上半年CIS占主营业务收入的比例持续提高。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"isJumpTheme":false,"source_url":"http://www.zhitongcaijing.com/content/detail/1150602.html","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"stock_zhitongcaijing","symbols":["688249","BK0214"],"gpt_icon":0},{"id":"2451856806","title":"晶合集成：上半年预盈1.5亿元—2.2亿元 同比扭亏","url":"https://stock-news.laohu8.com/highlight/detail?id=2451856806","media":"第一财经","labels":[],"top":-1,"share":"https://www.laohu8.com/m/news/2451856806?lang=zh_cn&edition=full","pubTime":"2024-07-14 17:04","pubTimestamp":1720947846,"startTime":"0","endTime":"0","summary":"晶合集成公告，预计上半年实现净利润1.5亿元—2.2亿元，同比扭亏。公司上年同期亏损4361.02万元。报告期内，公司产能利用率持续提升，3月份起产能持续维持满载状态，上半年整体销量实现快速增长。公司持续丰富晶圆代工领域产品结构，DDIC继续巩固优势，CIS成为公司第二大主轴产品，上半年CIS占主营业务收入的比例持续提高，中高阶CIS产品产能处于满载状态。目前公司55nm中高阶单芯片及堆栈式CIS芯片工艺平台已大批量生产，40nm高压OLED芯片工艺平台已实现小批量生产，28nm芯片工艺平台研发正在稳步推进中。同时，公司积极配合汽车产业链的需求，已有部分DDIC芯片应用于汽车领域。","market":"sh","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20240714170407af9234fd&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, .wx-sou","directOrigin":true},"property":[],"language":"zh","translate_title":"","themeId":null,"isJumpTheme":false,"source_url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20240714170407af9234fd&s=b","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"tencent","symbols":["688249","BK0214"],"gpt_icon":0},{"id":"2451050072","title":"晶合集成：预计2024年1-6月归属净利润盈利1.5亿元至2.2亿元","url":"https://stock-news.laohu8.com/highlight/detail?id=2451050072","media":"证券之星","labels":[],"top":-1,"share":"https://www.laohu8.com/m/news/2451050072?lang=zh_cn&edition=full","pubTime":"2024-07-14 16:00","pubTimestamp":1720944046,"startTime":"0","endTime":"0","summary":"证券之星消息，晶合集成发布业绩预告，预计2024年1-6月归属净利润盈利1.5亿元至2.2亿元。DDIC继续巩固优势,CIS成为公司第二大主轴产品,其他产品竞争力持续稳步提升。经财务部门初步测算,2024年上半年CIS占主营业务收入的比例持续提高。晶合集成2024年一季报显示，公司主营收入22.28亿元，同比上升104.44%；归母净利润7925.88万元，同比上升123.98%；扣非净利润5730.97万元，同比上升114.87%；负债率53.79%，投资收益1986.74万元，财务费用8668.89万元，毛利率24.99%。","market":"sh","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":["earning"],"language":"zh","translate_title":"","themeId":null,"isJumpTheme":false,"source_url":"https://stock.stockstar.com/RB2024071400001857.shtml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"stockstar","symbols":["688249"],"gpt_icon":0},{"id":"2451555423","title":"晶合集成获得实用新型专利授权：“一种累和运算系统”","url":"https://stock-news.laohu8.com/highlight/detail?id=2451555423","media":"证券之星","labels":[],"top":-1,"share":"https://www.laohu8.com/m/news/2451555423?lang=zh_cn&edition=full","pubTime":"2024-07-13 02:30","pubTimestamp":1720809057,"startTime":"0","endTime":"0","summary":"证券之星消息，根据企查查数据显示晶合集成新获得一项实用新型专利授权，专利名为“一种累和运算系统”，专利申请号为CN202323360054.2，授权日为2024年7月12日。今年以来晶合集成新获得专利授权181个，较去年同期增加了60.18%。","market":"fut","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"isJumpTheme":false,"source_url":"https://stock.stockstar.com/RB2024071300002193.shtml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"stockstar","symbols":["688249","BK0214"],"gpt_icon":0},{"id":"2450598344","title":"北向资金7月11日净买入晶合集成8.16万股 连续3日增持","url":"https://stock-news.laohu8.com/highlight/detail?id=2450598344","media":"自选股智能写手","labels":[],"top":-1,"share":"https://www.laohu8.com/m/news/2450598344?lang=zh_cn&edition=full","pubTime":"2024-07-12 09:30","pubTimestamp":1720747840,"startTime":"0","endTime":"0","summary":"7月11日, 北向资金增持晶合集成8.16万股，连续3日增持。截止当日收盘，沪股通共持有晶合集成78.57万股，占流通股0.06%。沪股通增持金额前五个股分别为贵州茅台、中国核电、紫金矿业、中国中免、长江电力。晶合集成近5个交易日上涨3.59%，沪股通累计增持32.85万股；近20个交易日上涨3.24%。","market":"sh","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN202407120936089f385604&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, .wx-sou","directOrigin":true},"property":[],"language":"zh","translate_title":"","themeId":null,"isJumpTheme":false,"source_url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN202407120936089f385604&s=b","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"tencent","symbols":["BK0214","688249"],"gpt_icon":0},{"id":"2450849791","title":"晶合集成获得发明专利授权：“控制刻蚀图形偏差的方法和系统”","url":"https://stock-news.laohu8.com/highlight/detail?id=2450849791","media":"证券之星","labels":[],"top":-1,"share":"https://www.laohu8.com/m/news/2450849791?lang=zh_cn&edition=full","pubTime":"2024-07-11 02:16","pubTimestamp":1720635379,"startTime":"0","endTime":"0","summary":"证券之星消息，根据企查查数据显示晶合集成新获得一项发明专利授权，专利名为“控制刻蚀图形偏差的方法和系统”，专利申请号为CN202410347138.2，授权日为2024年7月9日。今年以来晶合集成新获得专利授权179个，较去年同期增加了62.73%。","market":"hk","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"isJumpTheme":false,"source_url":"https://stock.stockstar.com/RB2024071100001775.shtml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"stockstar","symbols":["688249","BK0214"],"gpt_icon":0},{"id":"2450079265","title":"晶合集成获得发明专利授权：“研磨方法及研磨设备”","url":"https://stock-news.laohu8.com/highlight/detail?id=2450079265","media":"证券之星","labels":[],"top":-1,"share":"https://www.laohu8.com/m/news/2450079265?lang=zh_cn&edition=full","pubTime":"2024-07-10 02:27","pubTimestamp":1720549650,"startTime":"0","endTime":"0","summary":"证券之星消息，根据企查查数据显示晶合集成新获得一项发明专利授权，专利名为“研磨方法及研磨设备”，专利申请号为CN202410355754.2，授权日为2024年7月9日。本公开利于提高产品表面的均匀度，并有效提升产品良率。今年以来晶合集成新获得专利授权178个，较去年同期增加了61.82%。结合公司2023年年报财务数据，2023年公司在研发方面投入了10.58亿元，同比增23.39%。","market":"hk","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"isJumpTheme":false,"source_url":"https://stock.stockstar.com/RB2024071000003782.shtml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"stockstar","symbols":["688249","BK0214"],"gpt_icon":0},{"id":"2450089354","title":"晶合集成获得实用新型专利授权：“晶圆处理装置、检测装置及半导体器件”","url":"https://stock-news.laohu8.com/highlight/detail?id=2450089354","media":"证券之星","labels":[],"top":-1,"share":"https://www.laohu8.com/m/news/2450089354?lang=zh_cn&edition=full","pubTime":"2024-07-09 02:16","pubTimestamp":1720462588,"startTime":"0","endTime":"0","summary":"证券之星消息，根据企查查数据显示晶合集成新获得一项实用新型专利授权，专利名为“晶圆处理装置、检测装置及半导体器件”，专利申请号为CN202322935289.3，授权日为2024年7月9日。今年以来晶合集成新获得专利授权175个，较去年同期增加了63.55%。","market":"sh","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"isJumpTheme":false,"source_url":"https://stock.stockstar.com/RB2024070900002061.shtml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"stockstar","symbols":["688249","BK0214"],"gpt_icon":0},{"id":"2449025926","title":"晶合集成：\n公司55nm中高阶单芯片及堆栈式图像传感器芯片已批量生产，中高阶CIS产品量产顺利","url":"https://stock-news.laohu8.com/highlight/detail?id=2449025926","media":"证券之星","labels":[],"top":-1,"share":"https://www.laohu8.com/m/news/2449025926?lang=zh_cn&edition=full","pubTime":"2024-07-05 17:06","pubTimestamp":1720170386,"startTime":"0","endTime":"0","summary":"证券之星消息，晶合集成07月05日在投资者关系平台上答复投资者关心的问题。请问公司CIS新产品的进展情况如何？晶合集成董秘：尊敬的投资者您好，公司55nm中高阶单芯片及堆栈式图像传感器芯片已批量生产，中高阶CIS产品量产顺利。晶合集成董秘：尊敬的投资者您好，公司2024年计划扩产3-5万片/月，制程节点主要涵盖55nm、40nm，公司将以高阶CIS为2024年度扩产主要方向，并依据市场需求逐步扩充OLED显示驱动芯片产能。","market":"hk","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"isJumpTheme":false,"source_url":"https://stock.stockstar.com/RB2024070500033940.shtml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"stockstar","symbols":["159813","688249","BK0214"],"gpt_icon":0},{"id":"2449258387","title":"晶合集成(688249.SH)：55nm中高阶单芯片及堆栈式图像传感器芯片已批量生产","url":"https://stock-news.laohu8.com/highlight/detail?id=2449258387","media":"格隆汇资讯","labels":[],"top":-1,"share":"https://www.laohu8.com/m/news/2449258387?lang=zh_cn&edition=full","pubTime":"2024-07-05 15:50","pubTimestamp":1720165830,"startTime":"0","endTime":"0","summary":"格隆汇7月5日丨晶合集成(688249.SH)在互动平台表示，公司55nm中高阶单芯片及堆栈式图像传感器芯片已批量生产，中高阶CIS产品量产顺利。","market":"sh","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN202407051550349f09081a&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, .wx-sou","directOrigin":true},"property":[],"language":"zh","translate_title":"","themeId":null,"isJumpTheme":false,"source_url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN202407051550349f09081a&s=b","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"tencent","symbols":["159813","BK0214","688249"],"gpt_icon":0},{"id":"2449409596","title":"晶合集成7月4日转融通出借成交45900股","url":"https://stock-news.laohu8.com/highlight/detail?id=2449409596","media":"金融界","labels":[],"top":-1,"share":"https://www.laohu8.com/m/news/2449409596?lang=zh_cn&edition=full","pubTime":"2024-07-05 08:14","pubTimestamp":1720138497,"startTime":"0","endTime":"0","summary":"根据上交所网站显示，7月4日，晶合集成转融通出借成交45900股，期限为14天。据了解，转融通是指证券金融公司将自有或者依法筹集的资金和证券出借给证券公司，以供其办理融资融券业务的经营活动。上交所接受借入人借入申报的时间为每个交易日 9:15 至 11:30、13:00 至 15:10。公开资料显示，晶合集成法人代表为蔡国智，公司注册资本20.06亿元。","market":"sh","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN2024070508172995788453&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, .wx-sou","directOrigin":true},"property":[],"language":"zh","translate_title":"","themeId":null,"isJumpTheme":false,"source_url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN2024070508172995788453&s=b","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"tencent","symbols":["688249","BK0214"],"gpt_icon":0},{"id":"2448417706","title":"晶合集成：APG ASSET MANAGEMENT、GREENWOODS ASSET MGMT LTD等多家机构于7月2日调研我司","url":"https://stock-news.laohu8.com/highlight/detail?id=2448417706","media":"证券之星","labels":[],"top":-1,"share":"https://www.laohu8.com/m/news/2448417706?lang=zh_cn&edition=full","pubTime":"2024-07-04 17:16","pubTimestamp":1720084577,"startTime":"0","endTime":"0","summary":"鉴于目前 OLED 在小尺寸面板的不断渗透，公司将依据市场需求逐步扩充 OLED 显示驱动芯片产能。目前公司已有部分 DDIC 芯片应用于汽车，汽车芯片也是未来市场拓展的主力，具体的比例要结合市场需求和公司产品开发进度综合来看。晶合集成2024年一季报显示，公司主营收入22.28亿元，同比上升104.44%；归母净利润7925.88万元，同比上升123.98%；扣非净利润5730.97万元，同比上升114.87%；负债率53.79%，投资收益1986.74万元，财务费用8668.89万元，毛利率24.99%。","market":"sh","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"isJumpTheme":false,"source_url":"https://stock.stockstar.com/RB2024070400034401.shtml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"stockstar","symbols":["688249","BK0214"],"gpt_icon":0},{"id":"2448038177","title":"晶合集成：公司已根据市场情况对部分产品代工价格进行上调","url":"https://stock-news.laohu8.com/highlight/detail?id=2448038177","media":"每日经济新闻","labels":[],"top":-1,"share":"https://www.laohu8.com/m/news/2448038177?lang=zh_cn&edition=full","pubTime":"2024-07-03 17:52","pubTimestamp":1720000336,"startTime":"0","endTime":"0","summary":"每经AI快讯，有投资者在投资者互动平台提问：公司目前主要产品的价格趋势如何？晶合集成（688249.SH）7月3日在投资者互动平台表示，公司产品价格随行就市，主要受供需关系、行业景气度等多方面因素影响。公司已根据市场情况对部分产品代工价格进行上调，由于目前公司产能供不应求，公司代工价格易涨难跌，后续公司将结合市场情况及产能利用率对代工价格进行相应调整。(记者 毕陆名)","market":"sh","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20240703175243956d0a7d&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, .wx-sou","directOrigin":true},"property":[],"language":"zh","translate_title":"","themeId":null,"isJumpTheme":false,"source_url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20240703175243956d0a7d&s=b","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"tencent","symbols":["BK0214","688249"],"gpt_icon":0},{"id":"2448317703","title":"晶合集成：7月份订单数量高于6月份 预计第三季度产能将继续维持满载","url":"https://stock-news.laohu8.com/highlight/detail?id=2448317703","media":"第一财经","labels":[],"top":-1,"share":"https://www.laohu8.com/m/news/2448317703?lang=zh_cn&edition=full","pubTime":"2024-07-03 17:50","pubTimestamp":1720000242,"startTime":"0","endTime":"0","summary":"晶合集成在互动平台表示，目前公司的生产经营情况正常，订单充足，产能处于满载状态。公司7月份订单数量高于6月份，预计2024年第三季度产能将继续维持满载。","market":"sh","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20240703175042aef7c0bc&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, 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毕陆名)","market":"sh","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN202407031743479efaff10&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, .wx-sou","directOrigin":true},"property":[],"language":"zh","translate_title":"","themeId":null,"isJumpTheme":false,"source_url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN202407031743479efaff10&s=b","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"tencent","symbols":["BK0214","688249"],"gpt_icon":0},{"id":"2448082965","title":"晶合集成(688249.SH)累计回购4436.09万股 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