688249 晶合集成
已收盘 07-25 15:00:00
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晶合集成获得实用新型专利授权：“一种晶圆清洗装置”
证券之星企业动态 · 18:45
晶合集成获得实用新型专利授权：“一种晶圆清洗装置”
上证国新科创板国企指数上涨1.81%，前十大权重包含西部超导等
金融界 · 07-24 13:49
上证国新科创板国企指数上涨1.81%，前十大权重包含西部超导等
晶合集成获得发明专利授权：“半导体器件及其制备方法”
证券之星 · 07-22
晶合集成获得发明专利授权：“半导体器件及其制备方法”
晶合集成：预计2025年1-6月扣非后净利润盈利1.57亿元至2.35亿元
证券之星 · 07-21
晶合集成：预计2025年1-6月扣非后净利润盈利1.57亿元至2.35亿元
晶合集成(688249.SH)发预增，预计半年度归母净利润2.6亿元到3.9亿元，同比增长39.04%到108.55%
智通财经 · 07-21
晶合集成(688249.SH)发预增，预计半年度归母净利润2.6亿元到3.9亿元，同比增长39.04%到108.55%
晶合集成获得实用新型专利授权：“一种监测镀膜机台内晶圆状态的装置”
证券之星 · 07-11
晶合集成获得实用新型专利授权：“一种监测镀膜机台内晶圆状态的装置”
晶合集成获得实用新型专利授权：“一种晶圆清洗装置”
证券之星 · 07-10
晶合集成获得实用新型专利授权：“一种晶圆清洗装置”
晶合集成再度亮相集微大会，以创新铸就晶圆代工新辉煌
集微网 · 07-10
晶合集成再度亮相集微大会，以创新铸就晶圆代工新辉煌
晶合集成获得发明专利授权：“用于半导体制造工厂的产品品质监控方法及监控系统”
证券之星 · 07-04
晶合集成获得发明专利授权：“用于半导体制造工厂的产品品质监控方法及监控系统”
晶合集成获得实用新型专利授权：“一种半导体芯片的测试装置”
证券之星企业动态 · 07-03
晶合集成获得实用新型专利授权：“一种半导体芯片的测试装置”
行业回暖驱动销量激增46%，晶合集成扣非净利同比增逾1倍，聚焦新业务放量
时代周报 · 07-03
行业回暖驱动销量激增46%，晶合集成扣非净利同比增逾1倍，聚焦新业务放量
晶合集成收盘下跌1.24%，滚动市盈率68.08倍，总市值401.03亿元
金融界 · 07-02
晶合集成收盘下跌1.24%，滚动市盈率68.08倍，总市值401.03亿元
每周股票复盘：晶合集成（688249）审议通过多项重要议案
证券之星 · 06-28
每周股票复盘：晶合集成（688249）审议通过多项重要议案
晶合集成获得发明专利授权：“半导体器件的制备方法及半导体器件”
证券之星 · 06-27
晶合集成获得发明专利授权：“半导体器件的制备方法及半导体器件”
晶合集成获得实用新型专利授权：“一种监测镀膜机台内晶圆状态的装置”
证券之星 · 06-26
晶合集成获得实用新型专利授权：“一种监测镀膜机台内晶圆状态的装置”
晶合集成：“40纳米逻辑芯片工艺平台研发项目”予以结项
格隆汇 · 06-26
晶合集成：“40纳米逻辑芯片工艺平台研发项目”予以结项
晶合集成(688249.SH)向993名激励对象授予5938.85万股限制性股票
智通财经 · 06-26
晶合集成(688249.SH)向993名激励对象授予5938.85万股限制性股票
晶合集成06月26日遭主力抛售3493.9万元
市场透视 · 06-26
晶合集成06月26日遭主力抛售3493.9万元
晶合集成获得发明专利授权：“一种半导体器件的制造方法及半导体器件”
证券之星企业动态 · 06-24
晶合集成获得发明专利授权：“一种半导体器件的制造方法及半导体器件”
晶合集成06月23日获主力加仓35.9万元
市场透视 · 06-23
晶合集成06月23日获主力加仓35.9万元
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公司概况
公司名称：
合肥晶合集成电路股份有限公司
所属行业：
计算机、通信和其他电子设备制造业
上市日期：
2023-05-05
主营业务：
合肥晶合集成电路股份有限公司的主营业务是12英寸晶圆代工业务及其配套服务。公司的主要产品是DDIC、CIS、PMIC、MCU、Logic。
发行价格：
19.86
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21:49","pubTimestamp":1753364942,"startTime":"0","endTime":"0","summary":"数据统计显示，上证国新科创板国企指数近一个月上涨7.75%，近三个月上涨7.77%，年至今上涨7.88%。据了解，上证国新科创板国企指数从科创板上市证券中选取国有企业上市公司或国有资本参股且无实际控制人的上市公司样本，反映科创板上市国企主题证券的整体表现。从上证国新科创板国企指数持仓样本的行业来看，信息技术占比54.04%、工业占比29.80%、原材料占比8.82%、通信服务占比4.89%、医药卫生占比2.46%。","market":"hk","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20250724215643971c31d1&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, .wx-sou","directOrigin":true},"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20250724215643971c31d1&s=b","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"tencent","symbols":["688981","688012","BK1163","00981","BK1610","BK1614","688249","688041","HSCEI","BK1607","688027","688396","688568","688347","688120","BK1526"],"gpt_icon":1},{"id":"2553026828","title":"晶合集成获得发明专利授权：“半导体器件及其制备方法”","url":"https://stock-news.laohu8.com/highlight/detail?id=2553026828","media":"证券之星","labels":["productRelease"],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/2553026828?lang=zh_cn&edition=full","pubTime":"2025-07-23 02:58","pubTimestamp":1753210711,"startTime":"0","endTime":"0","summary":"证券之星消息，根据天眼查APP数据显示晶合集成新获得一项发明专利授权，专利名为“半导体器件及其制备方法”，专利申请号为CN202510260244.1，授权日为2025年7月22日。今年以来晶合集成新获得专利授权224个，较去年同期增加了17.28%。通过天眼查大数据分析，合肥晶合集成电路股份有限公司共对外投资了8家企业，参与招投标项目628次；财产线索方面有商标信息52条，专利信息1188条，著作权信息7条；此外企业还拥有行政许可21个。","market":"fut","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://stock.stockstar.com/RB2025072300002975.shtml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"productRelease","news_rank":0,"length":0,"strategy_id":0,"source":"stockstar","symbols":["BK0214","688249"],"gpt_icon":0},{"id":"2553478070","title":"晶合集成：预计2025年1-6月扣非后净利润盈利1.57亿元至2.35亿元","url":"https://stock-news.laohu8.com/highlight/detail?id=2553478070","media":"证券之星","labels":["dataReport"],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/2553478070?lang=zh_cn&edition=full","pubTime":"2025-07-21 18:00","pubTimestamp":1753092044,"startTime":"0","endTime":"0","summary":"证券之星消息，晶合集成发布业绩预告，预计2025年1-6月扣非后净利润盈利1.57亿元至2.35亿元。经财务部门初步测算， 2025 年上半年 CIS 占主营业务收入的比例持续提高。晶合集成2025年一季报显示，公司主营收入25.68亿元，同比上升15.25%；归母净利润1.35亿元，同比上升70.92%；扣非净利润1.23亿元，同比上升113.92%；负债率46.75%，投资收益925.12万元，财务费用1.5亿元，毛利率27.25%。","market":"fut","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":["earning"],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://stock.stockstar.com/RB2025072100025213.shtml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"dataReport","news_rank":0,"length":0,"strategy_id":0,"source":"stockstar","symbols":["688249"],"gpt_icon":0},{"id":"2553242214","title":"晶合集成(688249.SH)发预增，预计半年度归母净利润2.6亿元到3.9亿元，同比增长39.04%到108.55%","url":"https://stock-news.laohu8.com/highlight/detail?id=2553242214","media":"智通财经","labels":["dataReport"],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/2553242214?lang=zh_cn&edition=full","pubTime":"2025-07-21 16:42","pubTimestamp":1753087344,"startTime":"0","endTime":"0","summary":"智通财经APP讯，晶合集成(688249.SH)发布公告，公司预计2025年半年度实现归属于母公司所有者的净利润2.6亿元到3.9亿元，与上年同期相比，将增加7,300万元到20,300万元，同比增长39.04%到108.55%。报告期内，随着行业景气度逐渐回升，公司产品销量增加，整体产能利用率维持高位水平，助益公司营业收入和产品毛利水平稳步提升。","market":"fut","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":["earning"],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"http://www.zhitongcaijing.com/content/detail/1320051.html","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":"晶合集成(688249.SH)发预增，预计半年度归母净利润2.6亿元到3.9亿元，同比增长39.04%到108.55%","news_tag":"dataReport","news_rank":0,"length":0,"strategy_id":0,"source":"stock_zhitongcaijing","symbols":["688249"],"gpt_icon":0},{"id":"2550965250","title":"晶合集成获得实用新型专利授权：“一种监测镀膜机台内晶圆状态的装置”","url":"https://stock-news.laohu8.com/highlight/detail?id=2550965250","media":"证券之星","labels":["productRelease"],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/2550965250?lang=zh_cn&edition=full","pubTime":"2025-07-12 02:41","pubTimestamp":1752259271,"startTime":"0","endTime":"0","summary":"证券之星消息，根据天眼查APP数据显示晶合集成新获得一项实用新型专利授权，专利名为“一种监测镀膜机台内晶圆状态的装置”，专利申请号为CN202422195868.3，授权日为2025年6月27日。今年以来晶合集成新获得专利授权211个，较去年同期增加了15.93%。","market":"sh","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://stock.stockstar.com/RB2025071200001732.shtml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"productRelease","news_rank":0,"length":0,"strategy_id":0,"source":"stockstar","symbols":["BK0214","688249"],"gpt_icon":0},{"id":"2550678539","title":"晶合集成获得实用新型专利授权：“一种晶圆清洗装置”","url":"https://stock-news.laohu8.com/highlight/detail?id=2550678539","media":"证券之星","labels":["productRelease"],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/2550678539?lang=zh_cn&edition=full","pubTime":"2025-07-11 02:09","pubTimestamp":1752170960,"startTime":"0","endTime":"0","summary":"证券之星消息，根据天眼查APP数据显示晶合集成新获得一项实用新型专利授权，专利名为“一种晶圆清洗装置”，专利申请号为CN202422137738.4，授权日为2025年7月11日。通过本实用新型提供的晶圆清洗装置，能够改善对晶圆的清洗效果，节省清洗成本，提高半导体产品的良率。今年以来晶合集成新获得专利授权203个，较去年同期增加了13.41%。","market":"fut","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://stock.stockstar.com/RB2025071100001055.shtml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"productRelease","news_rank":0,"length":0,"strategy_id":0,"source":"stockstar","symbols":["688249","BK0214"],"gpt_icon":0},{"id":"2550242216","title":"晶合集成再度亮相集微大会，以创新铸就晶圆代工新辉煌","url":"https://stock-news.laohu8.com/highlight/detail?id=2550242216","media":"集微网","labels":[],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/2550242216?lang=zh_cn&edition=full","pubTime":"2025-07-10 22:44","pubTimestamp":1752158660,"startTime":"0","endTime":"0","summary":"晶合集成成立于2015年5月，由合肥市建设投资控股（集团）有限公司与台湾力晶科技股份有限公司合资建设，位于合肥市新站高新技术产业开发区综合保税区内，是安徽省首家12英寸晶圆代工企业。2023年5月，晶合集成正式在上海证券交易所科创板挂牌上市，成为安徽省首家成功登陆资本市场的纯晶圆代工企业。晶合集成的快速发展使其在成立10年内便跃居国内第三大晶圆代工企业。","market":"sh","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20250710225554a442d83c&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, 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02:47","pubTimestamp":1751654858,"startTime":"0","endTime":"0","summary":"证券之星消息，根据天眼查APP数据显示晶合集成新获得一项发明专利授权，专利名为“用于半导体制造工厂的产品品质监控方法及监控系统”，专利申请号为CN202510130106.1，授权日为2025年7月4日。今年以来晶合集成新获得专利授权197个，较去年同期增加了13.22%。","market":"fut","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://stock.stockstar.com/RB2025070500002955.shtml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"stockstar","symbols":["BK0214","159582","688249"],"gpt_icon":0},{"id":"2548384491","title":"晶合集成获得实用新型专利授权：“一种半导体芯片的测试装置”","url":"https://stock-news.laohu8.com/highlight/detail?id=2548384491","media":"证券之星企业动态","labels":[],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/2548384491?lang=zh_cn&edition=full","pubTime":"2025-07-04 02:15","pubTimestamp":1751566519,"startTime":"0","endTime":"0","summary":"证券之星消息，根据天眼查APP数据显示晶合集成新获得一项实用新型专利授权，专利名为“一种半导体芯片的测试装置”，专利申请号为CN202421948018.X，授权日为2025年7月4日。今年以来晶合集成新获得专利授权192个，较去年同期增加了12.28%。通过天眼查大数据分析，合肥晶合集成电路股份有限公司共对外投资了7家企业，参与招投标项目626次；财产线索方面有商标信息52条，专利信息1157条，著作权信息7条；此外企业还拥有行政许可17个。","market":"sh","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN202507040219509798e847&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, 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22:20","pubTimestamp":1751552429,"startTime":"0","endTime":"0","summary":"2024年，晶合集成实现营业收入92.49亿元，同比增长27.69%；扣非净利润为3.94亿元，同比激增736.77%，业绩弹性显著释放。晶合集成在2024年年报中指出，半导体行业景气度持续上行，带动公司产品销量显著提升，推动收入规模实现增长。从销量看，2024年，晶合集成的晶圆代工产品产量为135.72万片，同比增长41.76%；销量达136.66万片，同比增长46.02%。2025年第一季度，晶合集成的营业收入同比增长15.25%，扣非净利润同比增长113.92%，业绩延续增长态势。","market":"sh","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN202507032220499798b68b&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, 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19:09","pubTimestamp":1751454588,"startTime":"0","endTime":"0","summary":"7月2日，晶合集成今日收盘19.99元，下跌1.24%，滚动市盈率PE达到68.08倍，总市值401.03亿元。从行业市盈率排名来看，公司所处的半导体行业市盈率平均100.24倍，行业中值67.99倍，晶合集成排名第107位。股东方面，截至2025年3月31日，晶合集成股东户数65318户，较上次减少3648户，户均持股市值35.28万元，户均持股数量2.76万股。合肥晶合集成电路股份有限公司的主营业务是12英寸晶圆代工业务及其配套服务。","market":"sh","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://finance.jrj.com.cn/2025/07/02190951446746.shtml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"-1","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"jinrongjie_stock","symbols":["688249","BK0214"],"gpt_icon":0},{"id":"2547709691","title":"每周股票复盘：晶合集成（688249）审议通过多项重要议案","url":"https://stock-news.laohu8.com/highlight/detail?id=2547709691","media":"证券之星","labels":["corporation"],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/2547709691?lang=zh_cn&edition=full","pubTime":"2025-06-29 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15:21","pubTimestamp":1750922493,"startTime":"0","endTime":"0","summary":"06月26日, 晶合集成股价跌1.49%，报收19.90元，成交金额2.0亿元，换手率0.85%，振幅2.03%，量比0.95。晶合集成今日主力资金净流出3493.9万元，连续3日净流出，上一交易日主力净流出248.7万元。该股近5个交易日上涨3.06%，主力资金累计净流出4823.2万元；近20日主力资金累计净流出1.6亿元，其中净流出天数为15日。","market":"sh","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20250626170107a71e8fc6&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, 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