688249 晶合集成
已收盘 09-11 15:00:01
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晶合集成获得发明专利授权：“用于工艺监测的关键尺寸条形结构及关键尺寸监测方法”
证券之星 · 09-11 03:38
晶合集成获得发明专利授权：“用于工艺监测的关键尺寸条形结构及关键尺寸监测方法”
晶合集成：后续代工报价会综合市场需求等因素综合考虑
格隆汇 · 09-10 18:56
晶合集成：后续代工报价会综合市场需求等因素综合考虑
晶合集成盘中涨近4% 近日拟以合肥瑞昱科技全部股权向安徽瑞晶半导体增资
新浪港股 · 09-10 10:05
晶合集成盘中涨近4% 近日拟以合肥瑞昱科技全部股权向安徽瑞晶半导体增资
TrendForce：二季度全球前十大晶圆代工厂合计产值接近534.9亿美元 再创新高
智通财经 · 09-09
TrendForce：二季度全球前十大晶圆代工厂合计产值接近534.9亿美元 再创新高
每周股票复盘：晶合集成（688249）以子公司股权出资2.4亿元参与增资
证券之星 · 09-06
每周股票复盘：晶合集成（688249）以子公司股权出资2.4亿元参与增资
股市必读：晶合集成新发布《晶合集成关于参加科创板2026年半年度半导体制造、设备及材料行业集体业绩说明会的公告》
证券之星 · 09-04
股市必读：晶合集成新发布《晶合集成关于参加科创板2026年半年度半导体制造、设备及材料行业集体业绩说明会的公告》
晶合集成（688249）披露将参加科创板2026年半年度半导体行业集体业绩说明会，9月2日股价下跌3.3%
证券之星 · 09-02
晶合集成（688249）披露将参加科创板2026年半年度半导体行业集体业绩说明会，9月2日股价下跌3.3%
摩根士丹利在晶合集成的H股好仓比例上升0.51%至7.15%
南方财经网 · 09-01
摩根士丹利在晶合集成的H股好仓比例上升0.51%至7.15%
股市必读：晶合集成新发布《H股公告-2026年中期报告》
证券之星 · 08-31
股市必读：晶合集成新发布《H股公告-2026年中期报告》
晶合集成2026年半年报：净利润下滑26%，显示驱动芯片占比收缩拖累盈利
蓝鲸财经 · 08-29
晶合集成2026年半年报：净利润下滑26%，显示驱动芯片占比收缩拖累盈利
晶合集成：华泰证券、天弘基金等多家机构于8月25日调研我司
证券之星 · 08-28
晶合集成：华泰证券、天弘基金等多家机构于8月25日调研我司
山西证券：首次覆盖晶合集成给予买入评级
证券之星 · 08-26
山西证券：首次覆盖晶合集成给予买入评级
晶合集成(688249)6月30日股东户数5.22万户，较上期减少15.65%
证券之星 · 08-25
晶合集成(688249)6月30日股东户数5.22万户，较上期减少15.65%
晶合集成（688249）披露H股上市后注册资本变更及公司章程修订公告，8月25日股价下跌2.83%
证券之星 · 08-25
晶合集成（688249）披露H股上市后注册资本变更及公司章程修订公告，8月25日股价下跌2.83%
图解晶合集成中报：第二季度单季净利润同比下降0.99%
证券之星 · 08-25
图解晶合集成中报：第二季度单季净利润同比下降0.99%
晶合集成(02249)公布中期业绩 拥有人应占利润约2.45亿元 同比减少26.12%
智通财经 · 08-24
晶合集成(02249)公布中期业绩 拥有人应占利润约2.45亿元 同比减少26.12%
8月17日晶合集成涨8.76%，兴全合润混合C基金重仓该股
证券之星 · 08-17
8月17日晶合集成涨8.76%，兴全合润混合C基金重仓该股
每周股票复盘：晶合集成（688249）H股增发致股东持股稀释
证券之星 · 08-16
每周股票复盘：晶合集成（688249）H股增发致股东持股稀释
晶合集成（688249）披露董事会会议安排，8月12日股价上涨1.28%
证券之星 · 08-12
晶合集成（688249）披露董事会会议安排，8月12日股价上涨1.28%
晶合集成（688249）披露翌日披露报表：因部分行使超额配股权限发行10,886,900股H股，8月11日股价下跌1.19%
证券之星 · 08-11
晶合集成（688249）披露翌日披露报表：因部分行使超额配股权限发行10,886,900股H股，8月11日股价下跌1.19%
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公司概况
公司名称：
合肥晶合集成电路股份有限公司
所属行业：
计算机、通信和其他电子设备制造业
上市日期：
2023-05-05
主营业务：
合肥晶合集成电路股份有限公司的主营业务是12英寸晶圆代工业务及其配套服务。公司的主要产品是DDIC、CIS、PMIC、Logic、MCU。
发行价格：
19.86
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10:05","pubTimestamp":1789005900,"startTime":"0","endTime":"0","summary":"模拟交易客户端晶合集成盘中涨近4%，截至发稿，股价上涨2.61%，现报28.36港元，成交额1734.96万港元。近日，晶合集成发布公告，本公司与目标公司安徽瑞晶半导体、现有股东及其他增资方订立增资及股东协议，内容有关本公司拟以其持有的合肥瑞昱科技100%股权作价人民币240，916，988.78元出资，认购目标公司新增注册资本人民币240，916，988.78元；及其他增资方将合计以现金人民币170，000，000元认购目标公司新增注册资本人民币170，000，000元。","market":"hk","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://finance.sina.com.cn/stock/hkstock/marketalerts/2026-09-10/doc-iniriaey5374139.shtml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"shareholding","news_rank":0,"length":0,"strategy_id":0,"source":"sina","symbols":["688249","BK1163","02249"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2666533583","title":"TrendForce：二季度全球前十大晶圆代工厂合计产值接近534.9亿美元 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01:33","pubTimestamp":1788629590,"startTime":"0","endTime":"0","summary":"截至2026年9月4日收盘，晶合集成报收于35.07元，较上周的39.1元下跌10.31%。本周，晶合集成8月31日盘中最高价报38.96元。本周关注点公司公告汇总：晶合集成以全资子公司100%股权作价约2.41亿元参与安徽瑞晶增资，持股比例达26.43%。交易完成后，晶合集成将持有安徽瑞晶26.43%股权，不导致合并报表范围变更，亦不会对公司财务状况和经营成果造成重大影响。其他增资方合计以现金1.7亿元认缴新增注册资本。","market":"fut","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://stock.stockstar.com/RB2026090600000271.shtml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"shareholding","news_rank":0,"length":0,"strategy_id":0,"source":"stockstar","symbols":["BK1163","BK0214","02249","688249"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2664805139","title":"股市必读：晶合集成新发布《晶合集成关于参加科创板2026年半年度半导体制造、设备及材料行业集体业绩说明会的公告》","url":"https://stock-news.laohu8.com/highlight/detail?id=2664805139","media":"证券之星","labels":["conferences"],"top":-1,"itemType":null,"share":"https://www.laohunote.com/m/news/2664805139?lang=zh_cn&edition=full","pubTime":"2026-09-04 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22:07","pubTimestamp":1788358036,"startTime":"0","endTime":"0","summary":"截至2026年9月2日收盘，晶合集成报收于36.02元，较前一交易日下跌3.3%，最新总市值为804.92亿元。公告显示，公司将于2026年9月10日15:00-17:00通过上证路演中心以网络文字互动方式参加科创板2026年半年度半导体制造、设备及材料行业集体业绩说明会。投资者可于2026年9月3日至9月9日16:00前通过上证路演中心“提问预征集”栏目或公司邮箱提交问题。本次说明会主要围绕公司2026年半年度经营成果及财务状况进行互动交流。","market":"sh","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://stock.stockstar.com/RB2026090200042647.shtml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"-1","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"stockstar","symbols":["BK1163","BK0214","02249","688249"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2664837908","title":"摩根士丹利在晶合集成的H股好仓比例上升0.51%至7.15%","url":"https://stock-news.laohu8.com/highlight/detail?id=2664837908","media":"南方财经网","labels":[],"top":-1,"itemType":null,"share":"https://www.laohunote.com/m/news/2664837908?lang=zh_cn&edition=full","pubTime":"2026-09-01 17:21","pubTimestamp":1788254460,"startTime":"0","endTime":"0","summary":"南财智讯9月1日电，香港交易所披露信息显示，MorganStanley（摩根士丹利）在晶合集成的H股好仓（L）比例于8月26日从6.64%上升至7.15%。同时淡仓（S）比例从0.05%降至0.02%。","market":"hk","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"stock_eastmoney","url":"http://finance.eastmoney.com/a/202609013861552291.html","rn_cache_url":null,"directOrigin":true},"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"http://finance.eastmoney.com/a/202609013861552291.html","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"stock_eastmoney","symbols":["02249","688249","BK0214","BK1163"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2663042439","title":"股市必读：晶合集成新发布《H股公告-2026年中期报告》","url":"https://stock-news.laohu8.com/highlight/detail?id=2663042439","media":"证券之星","labels":[],"top":-1,"itemType":null,"share":"https://www.laohunote.com/m/news/2663042439?lang=zh_cn&edition=full","pubTime":"2026-08-31 02:41","pubTimestamp":1788115268,"startTime":"0","endTime":"0","summary":"截至2026年8月28日收盘，晶合集成报收于39.1元，下跌4.7%，换手率1.1%，成交量22.07万手，成交额8.77亿元。机构调研要点：四期项目将建设5.5万片/月的12英寸晶圆代工生产线，布局40nm及28nm CIS、OLED、逻辑工艺。公司公告汇总H股公告-2026年中期报告合肥晶合集成电路股份有限公司发布2026年中期报告：报告期内实现收入57.66亿元，同比增长12.40%；归属于母公司股东的净利润为2.45亿元，同比下降26.12%；经营活动产生的现金流量净额为27.98亿元，同比增长64.10%。","market":"sh","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://stock.stockstar.com/RB2026083100000809.shtml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"stockstar","symbols":["688249","BK0214","02249","BK1163"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2663014243","title":"晶合集成2026年半年报：净利润下滑26%，显示驱动芯片占比收缩拖累盈利","url":"https://stock-news.laohu8.com/highlight/detail?id=2663014243","media":"蓝鲸财经","labels":["dataReport"],"top":-1,"itemType":null,"share":"https://www.laohunote.com/m/news/2663014243?lang=zh_cn&edition=full","pubTime":"2026-08-29 15:29","pubTimestamp":1787988573,"startTime":"0","endTime":"0","summary":"报告期内，公司实现营业收入57.66亿元人民币，同比增长12.40%；归属于上市公司股东的净利润为2.45亿元人民币，同比下降26.12%。截至2026年6月30日，公司资产总额达587.83亿元人民币，负债总额为276.56亿元人民币，基本每股收益为0.13元人民币。管理层指出，报告期内研发开支为7.59亿元人民币，占收入比重13.17%，其中符合资本化条件的项目进入开发阶段致使费用化研发投入同比下降12.32%。","market":"us","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":["earning"],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://www.lanjinger.com/d/1787986428261697240","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"-1","news_top_title":null,"news_tag":"dataReport","news_rank":0,"length":0,"strategy_id":0,"source":"lanjinger_stock","symbols":["BK1163","02249","688249"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2662616093","title":"晶合集成：华泰证券、天弘基金等多家机构于8月25日调研我司","url":"https://stock-news.laohu8.com/highlight/detail?id=2662616093","media":"证券之星","labels":[],"top":-1,"itemType":null,"share":"https://www.laohunote.com/m/news/2662616093?lang=zh_cn&edition=full","pubTime":"2026-08-28 20:43","pubTimestamp":1787920990,"startTime":"0","endTime":"0","summary":"证券之星消息，2026年8月28日晶合集成发布公告称华泰证券、天弘基金、泰康资产、中信证券、拾贝投资、高腾资产、久期投资、鹏扬基金、中英人寿、安捷国际于2026年8月25日调研我司。晶合集成主营业务：12英寸晶圆代工业务及其配套服务。该股最近90天内共有2家机构给出评级，买入评级2家；过去90天内机构目标均价为71.75。以上内容为证券之星据公开信息整理，仅供参考不构成投资建议。","market":"sh","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://stock.stockstar.com/RB2026082800050529.shtml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"stockstar","symbols":["LU1064130708.USD","LU0039217434.USD","LU1328615791.USD","688249","601688","BK0214","BK0028","LU0871576103.HKD","LU1979443071.USD","LU1781817850.SGD","BK0188","BK0276","02249","LU1808992512.USD","BK1163","LU2148510915.USD","LU1064131003.USD","BK0012","LU0164865239.USD","BK0183","LU0531971595.HKD","LU1934453819.USD","LU1580142542.USD"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2662071931","title":"山西证券：首次覆盖晶合集成给予买入评级","url":"https://stock-news.laohu8.com/highlight/detail?id=2662071931","media":"证券之星","labels":[],"top":-1,"itemType":null,"share":"https://www.laohunote.com/m/news/2662071931?lang=zh_cn&edition=full","pubTime":"2026-08-26 19:59","pubTimestamp":1787745577,"startTime":"0","endTime":"0","summary":"山西证券股份有限公司张天,李明阳近期对晶合集成进行研究并发布了研究报告《制程节点及产品结构优化，国产替代空间广阔》，首次覆盖晶合集成给予买入评级。预计公司2026-2028年EPS分别为0.27\\0.44\\0.56，对应公司8月25日收盘价的2026-2028年PB分别为2.9\\2.8\\2.7，首次覆盖给予“买入-A” 评级。本文数据来源于山西证券股份有限公司，仅供参考不构成投资建议。","market":"hk","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":["rate"],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://stock.stockstar.com/RB2026082600046652.shtml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"stockstar","symbols":["02249","002500","688249"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2662738625","title":"晶合集成(688249)6月30日股东户数5.22万户，较上期减少15.65%","url":"https://stock-news.laohu8.com/highlight/detail?id=2662738625","media":"证券之星","labels":["shareholding"],"top":-1,"itemType":null,"share":"https://www.laohunote.com/m/news/2662738625?lang=zh_cn&edition=full","pubTime":"2026-08-25 17:41","pubTimestamp":1787650874,"startTime":"0","endTime":"0","summary":"证券之星消息，近日晶合集成披露，截至2026年6月30日公司股东户数为5.22万户，较3月31日减少9684.0户，减幅为15.65%。在半导体行业个股中，晶合集成股东户数低于行业平均水平，截至6月30日，半导体行业平均股东户数为7.92万户。从股价来看，2026年3月31日至2026年6月30日，晶合集成区间涨幅为123.77%，在此期间股东户数减少9684.0户，减幅为15.65%。","market":"fut","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://stock.stockstar.com/RB2026082500036820.shtml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"-1","news_top_title":null,"news_tag":"shareholding","news_rank":0,"length":0,"strategy_id":0,"source":"stockstar","symbols":["02249","BK1163","BK0214","688249"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2662800257","title":"晶合集成（688249）披露H股上市后注册资本变更及公司章程修订公告，8月25日股价下跌2.83%","url":"https://stock-news.laohu8.com/highlight/detail?id=2662800257","media":"证券之星","labels":[],"top":-1,"itemType":null,"share":"https://www.laohunote.com/m/news/2662800257?lang=zh_cn&edition=full","pubTime":"2026-08-25 17:33","pubTimestamp":1787650382,"startTime":"0","endTime":"0","summary":"截至2026年8月25日收盘，晶合集成报收于37.37元，较前一交易日下跌2.83%，最新总市值为835.09亿元。近日，晶合集成发布《关于变更公司注册资本、修订〈公司章程〉并办理工商登记的公告》。本次发行完成后，公司总股本由2,007,591,697股变更为2,234,645,597股，注册资本相应由人民币2,007,591,697元变更为2,234,645,597元。公司据此修订《公司章程》，更新注册资本、H股发行情况及股份结构，并调整管理层职务称谓，相关事项已获董事会审议通过，部分条款尚需提交股东会审议。","market":"fut","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://stock.stockstar.com/RB2026082500036151.shtml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"-1","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"stockstar","symbols":["688249","BK0214","BK1163","02249"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2662175208","title":"图解晶合集成中报：第二季度单季净利润同比下降0.99%","url":"https://stock-news.laohu8.com/highlight/detail?id=2662175208","media":"证券之星","labels":[],"top":-1,"itemType":null,"share":"https://www.laohunote.com/m/news/2662175208?lang=zh_cn&edition=full","pubTime":"2026-08-25 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公布2026年中期业绩，收入约57.66亿元，同比增长12.4%;公司拥有人应占期内利润约2.45亿元，同比减少26.12%;每股基本收益0.13元。按国际财务报告准则，公司预计2026年第三季度的收入约在32亿元至33亿元之间;预计2026年第三季度的毛利率约在25%至27%之间。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"http://www.zhitongcaijing.com/content/detail/1484472.html","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"-1","news_top_title":null,"news_tag":"dataReport","news_rank":0,"length":0,"strategy_id":0,"source":"stock_zhitongcaijing","symbols":["BK1163","BK0214","02249","688249"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2660483251","title":"8月17日晶合集成涨8.76%，兴全合润混合C基金重仓该股","url":"https://stock-news.laohu8.com/highlight/detail?id=2660483251","media":"证券之星","labels":["shareholding"],"top":-1,"itemType":null,"share":"https://www.laohunote.com/m/news/2660483251?lang=zh_cn&edition=full","pubTime":"2026-08-17 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