603005 晶方科技
已收盘 09-04 15:00:00
资讯
新帖
简况
晶方科技：汽车智能化向L3、L4快速发展带来积极正向影响
证券之星 · 16:18
晶方科技：汽车智能化向L3、L4快速发展带来积极正向影响
晶方科技：公司本次股权激励旨在加大对光学业务板块的资源投入与考核激励力度
证券之星 · 16:06
晶方科技：公司本次股权激励旨在加大对光学业务板块的资源投入与考核激励力度
晶方科技：公司马来西亚子公司购买的土地位于马来西亚槟城Byanlepas工业园区
证券之星 · 16:06
晶方科技：公司马来西亚子公司购买的土地位于马来西亚槟城Byanlepas工业园区
晶方科技：加大对光学业务板块的资源投入与考核激励力度
证券之星 · 08-31
晶方科技：加大对光学业务板块的资源投入与考核激励力度
晶方科技：手机等消费类电子市场需求疲软
证券之星 · 08-31
晶方科技：手机等消费类电子市场需求疲软
股市必读：晶方科技新发布《晶方科技关于召开2026年半年度业绩说明会的公告》
证券之星 · 08-31
股市必读：晶方科技新发布《晶方科技关于召开2026年半年度业绩说明会的公告》
每周股票复盘：晶方科技（603005）股东户数增47.91%，净利润降19.5%
证券之星 · 08-30
每周股票复盘：晶方科技（603005）股东户数增47.91%，净利润降19.5%
股市必读：晶方科技新发布《晶方科技关于召开2026年半年度业绩说明会的公告》
证券之星 · 08-28
股市必读：晶方科技新发布《晶方科技关于召开2026年半年度业绩说明会的公告》
股市必读：晶方科技（603005）8月26日董秘有最新回复
证券之星 · 08-27
股市必读：晶方科技（603005）8月26日董秘有最新回复
晶方科技：工业自动化、汽车、3D传感等应用领域已经是公司光学器件业务的主要应用领域之一
证券之星 · 08-26
晶方科技：工业自动化、汽车、3D传感等应用领域已经是公司光学器件业务的主要应用领域之一
晶方科技：公司正在推进荷兰子公司的分拆上市工作
证券之星 · 08-26
晶方科技：公司正在推进荷兰子公司的分拆上市工作
晶方科技：台积电为晶圆制造厂，公司专注于集成电路先进封装技术服务
证券之星 · 08-26
晶方科技：台积电为晶圆制造厂，公司专注于集成电路先进封装技术服务
晶方科技：马来西亚项目预计年底进入打样试生产阶段
证券之星 · 08-26
晶方科技：马来西亚项目预计年底进入打样试生产阶段
晶方科技：混合光学镜头、WLO晶圆级微型学器件等产品可实现自由光学曲面、提高光效效能、微型化与高集成度等核心特点
证券之星 · 08-26
晶方科技：混合光学镜头、WLO晶圆级微型学器件等产品可实现自由光学曲面、提高光效效能、微型化与高集成度等核心特点
晶方科技：晶圆级TSV先进封装、微型光学为公司核心技术与业务构成
证券之星 · 08-26
晶方科技：晶圆级TSV先进封装、微型光学为公司核心技术与业务构成
晶方科技(603005)6月30日股东户数19.68万户，较上期增加47.91%
证券之星 · 08-25
晶方科技(603005)6月30日股东户数19.68万户，较上期增加47.91%
晶方科技（603005）披露2026年半年度报告，8月25日股价下跌4.17%
证券之星 · 08-25
晶方科技（603005）披露2026年半年度报告，8月25日股价下跌4.17%
图解晶方科技中报：第二季度单季净利润同比下降32.39%
证券之星 · 08-25
图解晶方科技中报：第二季度单季净利润同比下降32.39%
晶方科技：马来西亚项目预计年底进入打样试生产阶段
证券之星 · 08-06
晶方科技：马来西亚项目预计年底进入打样试生产阶段
晶方科技：公司是传感器晶圆级TSV封装服务技术引领者和市场龙头
证券之星 · 07-27
晶方科技：公司是传感器晶圆级TSV封装服务技术引领者和市场龙头
加载更多
公司概况
公司名称：
苏州晶方半导体科技股份有限公司
所属行业：
计算机、通信和其他电子设备制造业
上市日期：
2014-02-10
主营业务：
苏州晶方半导体科技股份有限公司的主营业务是传感器领域的封装测试业务。公司的主要产品是影像传感器芯片封装测试、生物身份识别芯片封装测试、MEMS芯片封装测试、射频芯片封装测试。
发行价格：
19.16
{"stockData":{"symbol":"603005","market":"SH","secType":"STK","nameCN":"晶方科技","latestPrice":28.9,"timestamp":1788505200000,"preClose":29.45,"halted":0,"volume":26401922,"delay":0,"changeRate":-0.0187,"floatShares":652000000,"shares":652000000,"eps":0.5175,"marketStatus":"已收盘","change":-0.55,"latestTime":"09-04 15:00:00","open":29.7,"high":30.06,"low":28.7,"amount":774000000,"amplitude":0.0462,"askPrice":28.9,"askSize":110,"bidPrice":28.89,"bidSize":114,"shortable":0,"etf":0,"ttmEps":0.5175,"tradingStatus":0,"nextMarketStatus":{"tag":"开盘","tradingStatus":2,"beginTime":1788744600000},"marketStatusCode":5,"adr":0,"adjPreClose":29.45,"symbolType":"stock","openAndCloseTimeList":[[1788485400000,1788492600000],[1788498000000,1788505200000]],"highLimit":32.4,"lowLimit":26.51,"ibTradeSell":false,"ibTradeBuySell":true,"totalEquity":652171706,"isCdr":false,"pbRate":4.07,"roa":"--","peRate":55.845411,"roe":"2.88%","epsLYR":0.57,"committee":-0.103563,"marketValue":18848000000,"turnoverRate":0.0405,"status":1,"floatMarketCap":18848000000},"requestUrl":"/m/hq/s/603005","defaultTab":"news","newsList":[{"id":"2664938771","title":"晶方科技：汽车智能化向L3、L4快速发展带来积极正向影响","url":"https://stock-news.laohu8.com/highlight/detail?id=2664938771","media":"证券之星","labels":[],"top":-1,"itemType":null,"share":"https://www.laohunote.com/m/news/2664938771?lang=zh_cn&edition=full","pubTime":"2026-09-04 16:18","pubTimestamp":1788509896,"startTime":"0","endTime":"0","summary":"证券之星消息，晶方科技09月04日在投资者关系平台上答复投资者关心的问题。对公司的营收有没有正面影响？请在合规范围内给出明确答复晶方科技回复：您好，汽车智能化的发展趋势正在加速前进，驱动摄像头为代表的传感器的市场快速发展。公司专注于集成电路先进封装技术服务，聚焦摄像头芯片领域，并建立了显著的技术与市场领先优势。随着汽车智能化向L3、L4的快速发展，对公司聚焦的客户与市场需求将带来积极正向的影响。","market":"sh","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://stock.stockstar.com/RB2026090400027569.shtml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"stockstar","symbols":["BK0121","BK0198","BK0125","BK0012","BK0067","BK0214","BK0028","BK0108","603005","BK0133"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2664387163","title":"晶方科技：公司本次股权激励旨在加大对光学业务板块的资源投入与考核激励力度","url":"https://stock-news.laohu8.com/highlight/detail?id=2664387163","media":"证券之星","labels":[],"top":-1,"itemType":null,"share":"https://www.laohunote.com/m/news/2664387163?lang=zh_cn&edition=full","pubTime":"2026-09-04 16:06","pubTimestamp":1788509188,"startTime":"0","endTime":"0","summary":"证券之星消息，晶方科技(603005)09月04日在投资者关系平台上答复投资者关心的问题。投资者提问：公司的CPO（光电共封装）是不是一个彻头彻尾的骗局?员工激励计划真的不需要利润指标考核吗？晶方科技回复：关于CPO的问题已回复交流过多次，请您详见之前的回复。公司本次股权激励旨在加大对光学业务板块的资源投入与考核激励力度，打造公司业务发展新曲线，相关考核指标合理合规，具体考核指标设定的具体分析烦请您详见激励计划草案文件，谢谢您的关注！本文数据来源于上海证券交易所e互动，仅供参考不构成投资建议。责任编辑：刘浩然","market":"sh","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://stock.stockstar.com/RB2026090400026380.shtml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"stockstar","symbols":["BK0214","BK0012","BK0028","BK0125","BK0121","BK0133","BK0108","BK0067","BK0198","603005"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2664387155","title":"晶方科技：公司马来西亚子公司购买的土地位于马来西亚槟城Byanlepas工业园区","url":"https://stock-news.laohu8.com/highlight/detail?id=2664387155","media":"证券之星","labels":[],"top":-1,"itemType":null,"share":"https://www.laohunote.com/m/news/2664387155?lang=zh_cn&edition=full","pubTime":"2026-09-04 16:06","pubTimestamp":1788509187,"startTime":"0","endTime":"0","summary":"证券之星消息，晶方科技09月04日在投资者关系平台上答复投资者关心的问题。地图显示公司是原来Dynacraft工厂，但是Dynacraft卖给了Open DC PE2，且价格远低于公司公告的价格，请问这中间是否有什么暗箱操作？","market":"hk","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://stock.stockstar.com/RB2026090400026376.shtml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"stockstar","symbols":["BK0121","BK0108","BK0125","BK0214","BK0067","BK0198","BK0028","BK0133","BK0012","603005"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2663735400","title":"晶方科技：加大对光学业务板块的资源投入与考核激励力度","url":"https://stock-news.laohu8.com/highlight/detail?id=2663735400","media":"证券之星","labels":[],"top":-1,"itemType":null,"share":"https://www.laohunote.com/m/news/2663735400?lang=zh_cn&edition=full","pubTime":"2026-08-31 16:03","pubTimestamp":1788163396,"startTime":"0","endTime":"0","summary":"证券之星消息，晶方科技(603005)08月31日在投资者关系平台上答复投资者关心的问题。投资者提问：请公司管理层说明，股权激励与子公司分拆上市中出现的员工持股计划，两者是否关联公司未来整体被收购或者被兼并的可能性？晶方科技回复：您好，公司目前生产经营一切正常，公司于2026年8月25日发布《晶方科技2026年限制性股票激励计划（草案）摘要公告》旨在加大对光学业务板块的资源投入与考核激励力度，打造公司业务发展新曲线。如有您所提到的收购或兼并事项，公司将严格按照相关法律法规进行信息披露，谢谢您的关注！本文数据来源于上海证券交易所e互动，仅供参考不构成投资建议。责任编辑：刘浩然","market":"hk","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://stock.stockstar.com/RB2026083100019343.shtml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"stockstar","symbols":["BK0108","BK0133","BK0028","BK0012","BK0198","BK0214","603005","BK0121","BK0125","BK0067"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2663073545","title":"晶方科技：手机等消费类电子市场需求疲软","url":"https://stock-news.laohu8.com/highlight/detail?id=2663073545","media":"证券之星","labels":["dataReport"],"top":-1,"itemType":null,"share":"https://www.laohunote.com/m/news/2663073545?lang=zh_cn&edition=full","pubTime":"2026-08-31 16:03","pubTimestamp":1788163394,"startTime":"0","endTime":"0","summary":"晶方科技回复：您好，从半年度维度来看，公司同比营收下滑一个方面是手机等消费类电子市场需求疲软，以手机为代表，26年上半年全球手机出货量出现明显下降趋势。另一方面，虽然汽车智能化趋势持续发展，但受到2025年行业库存影响，上半年车规CIS市场处于去库存态势，影响了整体出货需求。","market":"sh","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://stock.stockstar.com/RB2026083100019338.shtml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"-1","news_top_title":null,"news_tag":"dataReport","news_rank":0,"length":0,"strategy_id":0,"source":"stockstar","symbols":["BK0125","BK0198","BK0214","603005","BK0108","BK0121","BK0133","BK0012","BK0067","BK0028"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2663042586","title":"股市必读：晶方科技新发布《晶方科技关于召开2026年半年度业绩说明会的公告》","url":"https://stock-news.laohu8.com/highlight/detail?id=2663042586","media":"证券之星","labels":["conferences"],"top":-1,"itemType":null,"share":"https://www.laohunote.com/m/news/2663042586?lang=zh_cn&edition=full","pubTime":"2026-08-31 00:59","pubTimestamp":1788109150,"startTime":"0","endTime":"0","summary":"截至2026年8月28日收盘，晶方科技报收于30.2元，下跌2.04%，换手率4.15%，成交量27.06万手，成交额8.29亿元。当日关注点交易信息汇总：8月28日主力资金净流出9098.8万元，占总成交额10.97%。公司公告汇总：晶方科技将于2026年9月7日11:00–12:00通过“价值在线”平台召开2026年半年度业绩说明会，董事长兼总经理王蔚等高管将出席。说明会结束后，投资者可通过价值在线或易董app查看会议情况。","market":"sh","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://stock.stockstar.com/RB2026083100000525.shtml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"conferences","news_rank":0,"length":0,"strategy_id":0,"source":"stockstar","symbols":["BK0121","BK0125","BK0198","BK0133","603005","BK0012","BK0214","BK0067","BK0028","BK0108"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2663010807","title":"每周股票复盘：晶方科技（603005）股东户数增47.91%，净利润降19.5%","url":"https://stock-news.laohu8.com/highlight/detail?id=2663010807","media":"证券之星","labels":["shareholding"],"top":-1,"itemType":null,"share":"https://www.laohunote.com/m/news/2663010807?lang=zh_cn&edition=full","pubTime":"2026-08-30 01:34","pubTimestamp":1788024850,"startTime":"0","endTime":"0","summary":"截至2026年8月28日收盘，晶方科技报收于30.2元，较上周的32.75元下跌7.79%。公司公告汇总：拟实施限制性股票激励计划，授予74.77万股，占总股本0.11%。股本股东变化截至2026年6月30日，晶方科技股东户数为19.68万户，较3月31日增加6.38万户，增幅47.91%。户均持股数量由4901.0股降至3314.0股，户均持股市值为17.85万元。业绩披露要点晶方科技2026年中报显示，上半年主营收入6.76亿元，同比上升1.39%；归母净利润1.33亿元，同比下降19.5%；扣非净利润1.19亿元，同比下降21.47%。","market":"sh","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":["earning"],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://stock.stockstar.com/RB2026083000000538.shtml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"-1","news_top_title":null,"news_tag":"shareholding","news_rank":0,"length":0,"strategy_id":0,"source":"stockstar","symbols":["603005"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2662082381","title":"股市必读：晶方科技新发布《晶方科技关于召开2026年半年度业绩说明会的公告》","url":"https://stock-news.laohu8.com/highlight/detail?id=2662082381","media":"证券之星","labels":["conferences"],"top":-1,"itemType":null,"share":"https://www.laohunote.com/m/news/2662082381?lang=zh_cn&edition=full","pubTime":"2026-08-28 00:58","pubTimestamp":1787849895,"startTime":"0","endTime":"0","summary":"截至2026年8月27日收盘，晶方科技报收于30.83元，上涨2.84%，换手率4.77%，成交量31.12万手，成交额9.55亿元。当日关注点交易信息汇总：8月27日主力资金净流出5083.05万元，占总成交额5.32%。公司公告汇总：晶方科技将于2026年9月7日11:00–12:00通过“价值在线”平台召开2026年半年度业绩说明会，董事长兼总经理王蔚等高管将出席。说明会结束后，投资者可通过价值在线或易董app查看会议情况。","market":"sh","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://stock.stockstar.com/RB2026082800002772.shtml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"conferences","news_rank":0,"length":0,"strategy_id":0,"source":"stockstar","symbols":["BK0198","BK0121","BK0133","BK0028","BK0067","BK0125","BK0108","603005","BK0214","BK0012"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2662746373","title":"股市必读：晶方科技（603005）8月26日董秘有最新回复","url":"https://stock-news.laohu8.com/highlight/detail?id=2662746373","media":"证券之星","labels":[],"top":-1,"itemType":null,"share":"https://www.laohunote.com/m/news/2662746373?lang=zh_cn&edition=full","pubTime":"2026-08-27 01:07","pubTimestamp":1787764034,"startTime":"0","endTime":"0","summary":"截至2026年8月26日收盘，晶方科技报收于29.98元，下跌1.15%，换手率4.97%，成交量32.44万手，成交额9.7亿元。董秘最新回复投资者： CPO需要外置连续波激光源，单台交换机需144颗高功率激光器。投资者： 机构预计未来2-3年Anteryon业务规模可能超过现有主业。CPO将光引擎与高热功耗的交换ASIC共封，热管理是核心挑战。","market":"hk","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://stock.stockstar.com/RB2026082700003323.shtml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"stockstar","symbols":["BK0108","BK0121","BK0133","BK0012","BK0067","BK0198","BK0028","BK0214","BK0125","603005"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2662291796","title":"晶方科技：工业自动化、汽车、3D传感等应用领域已经是公司光学器件业务的主要应用领域之一","url":"https://stock-news.laohu8.com/highlight/detail?id=2662291796","media":"证券之星","labels":[],"top":-1,"itemType":null,"share":"https://www.laohunote.com/m/news/2662291796?lang=zh_cn&edition=full","pubTime":"2026-08-26 16:33","pubTimestamp":1787733190,"startTime":"0","endTime":"0","summary":"证券之星消息，晶方科技(603005)08月26日在投资者关系平台上答复投资者关心的问题。投资者提问：光学器件拓展方向：除ASML外，Anteryon的产品在工业自动化、汽车、安防、3D传感器等应用领域的拓展进展如何？是否有新的头部客户进入量产阶段？晶方科技回复：工业自动化、汽车、3D传感等应用领域已经是公司光学器件业务的主要应用领域之一，谢谢您的关注！本文数据来源于上海证券交易所e互动，仅供参考不构成投资建议。责任编辑：刘浩然","market":"sh","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://stock.stockstar.com/RB2026082600036606.shtml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"stockstar","symbols":["BK0121","603005","BK0198","BK0067","BK0125","BK0012","BK0028","BK0133","BK0214","BK0108"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2662796258","title":"晶方科技：公司正在推进荷兰子公司的分拆上市工作","url":"https://stock-news.laohu8.com/highlight/detail?id=2662796258","media":"证券之星","labels":["corporation"],"top":-1,"itemType":null,"share":"https://www.laohunote.com/m/news/2662796258?lang=zh_cn&edition=full","pubTime":"2026-08-26 16:33","pubTimestamp":1787733189,"startTime":"0","endTime":"0","summary":"证券之星消息，晶方科技(603005)08月26日在投资者关系平台上答复投资者关心的问题。投资者提问：公司目前集成电路封装与光学器件的收入占比分别约为67%和32%，请问2026年上半年这一比例是否有明显变化？光学器件业务增速是否持续高于封装业务？晶方科技回复：您好，公司正在推进荷兰子公司的分拆上市工作，相关工作的有序推进将对公司光学器件业务的发展带来积极推动作用，谢谢您的关注！本文数据来源于上海证券交易所e互动，仅供参考不构成投资建议。责任编辑：刘浩然","market":"sh","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://stock.stockstar.com/RB2026082600036604.shtml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"corporation","news_rank":0,"length":0,"strategy_id":0,"source":"stockstar","symbols":["BK0133","BK0067","BK0121","BK0028","BK0012","BK0125","603005","BK0198","BK0108","BK0214"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2662969987","title":"晶方科技：台积电为晶圆制造厂，公司专注于集成电路先进封装技术服务","url":"https://stock-news.laohu8.com/highlight/detail?id=2662969987","media":"证券之星","labels":["corporation"],"top":-1,"itemType":null,"share":"https://www.laohunote.com/m/news/2662969987?lang=zh_cn&edition=full","pubTime":"2026-08-26 16:27","pubTimestamp":1787732839,"startTime":"0","endTime":"0","summary":"证券之星消息，晶方科技(603005)08月26日在投资者关系平台上答复投资者关心的问题。投资者提问：您好董秘，关于索尼与台积电拟合资建厂 1万亿日元布局下一代图像传感器芯片，这对于贵司会有什么挑战，晶方作为索尼的占比高的封测代工，对于台积电入局，肯定减少晶方的订单，是否产生业绩不好的影响。晶方科技回复：您好，台积电为晶圆制造厂，公司专注于集成电路先进封装技术服务，主要为客户提供封测服务，在产业链上晶圆厂、封测厂是晶圆流转的前、后道关系，谢谢您的关注！本文数据来源于上海证券交易所e互动，仅供参考不构成投资建议。责任编辑：刘浩然","market":"sh","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://stock.stockstar.com/RB2026082600036265.shtml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"corporation","news_rank":0,"length":0,"strategy_id":0,"source":"stockstar","symbols":["BK0121","BK0125","BK0198","159546","BK0133","603005","03191","BK0012","BK0214","BK0067","BK0028","BK0108"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2662796967","title":"晶方科技：马来西亚项目预计年底进入打样试生产阶段","url":"https://stock-news.laohu8.com/highlight/detail?id=2662796967","media":"证券之星","labels":[],"top":-1,"itemType":null,"share":"https://www.laohunote.com/m/news/2662796967?lang=zh_cn&edition=full","pubTime":"2026-08-26 16:27","pubTimestamp":1787732837,"startTime":"0","endTime":"0","summary":"请问苏州新产线的具体规划产能是多少？晶方科技回复：您好，在建工程增长主要系公司子公司wafertek正在牵头推进马来西亚生产基地的建设，以顺应满足海外市场与客户的需求，马来西亚项目正处在设备的购置、安装、调试等产线建设与验证阶段，团队组建与培训工作也有序同步展开，预计年底进入打样试生产阶段，谢谢您的关注!","market":"sh","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://stock.stockstar.com/RB2026082600036261.shtml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"stockstar","symbols":["BK0198","BK0125","BK0108","BK0028","BK0012","BK0133","BK0121","BK0214","BK0067","603005"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2662796945","title":"晶方科技：混合光学镜头、WLO晶圆级微型学器件等产品可实现自由光学曲面、提高光效效能、微型化与高集成度等核心特点","url":"https://stock-news.laohu8.com/highlight/detail?id=2662796945","media":"证券之星","labels":["productRelease"],"top":-1,"itemType":null,"share":"https://www.laohunote.com/m/news/2662796945?lang=zh_cn&edition=full","pubTime":"2026-08-26 16:27","pubTimestamp":1787732832,"startTime":"0","endTime":"0","summary":"请问Anteryon的WLO产能目前是多少？晶方科技回复：您好，公司子公司具备领先的微型光学设计、研发与制造等核心能力，其混合光学镜头、WLO晶圆级微型学器件等产品可实现自由光学曲面、提高光效效能、微型化与高集成度等核心特点，相关产品广泛应用在半导体设备、工业智能与自动化等市场领域，并在3D传感、智能投射、光互连等领域有广阔应用前景，谢谢您的关注。","market":"hk","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://stock.stockstar.com/RB2026082600036250.shtml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"productRelease","news_rank":0,"length":0,"strategy_id":0,"source":"stockstar","symbols":["BK0012","BK0125","BK0133","BK0198","BK0121","603005","BK0067","BK0214","BK0028","BK0108"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2662948796","title":"晶方科技：晶圆级TSV先进封装、微型光学为公司核心技术与业务构成","url":"https://stock-news.laohu8.com/highlight/detail?id=2662948796","media":"证券之星","labels":["productRelease"],"top":-1,"itemType":null,"share":"https://www.laohunote.com/m/news/2662948796?lang=zh_cn&edition=full","pubTime":"2026-08-26 16:27","pubTimestamp":1787732830,"startTime":"0","endTime":"0","summary":"证券之星消息，晶方科技08月26日在投资者关系平台上答复投资者关心的问题。Anteryon的激光模块技术是否可用于CPO光引擎中的激光源集成？有源/无源协同：公司在CPO领域同时布局有源和无源器件，这种\"有源+无源\"一体化能力是否为差异化优势？","market":"hk","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://stock.stockstar.com/RB2026082600036244.shtml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"productRelease","news_rank":0,"length":0,"strategy_id":0,"source":"stockstar","symbols":["603005","BK0214","BK0125","BK0012","BK0028","BK0133","BK0198","BK0067","BK0108","BK0121"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2662599738","title":"晶方科技(603005)6月30日股东户数19.68万户，较上期增加47.91%","url":"https://stock-news.laohu8.com/highlight/detail?id=2662599738","media":"证券之星","labels":["shareholding"],"top":-1,"itemType":null,"share":"https://www.laohunote.com/m/news/2662599738?lang=zh_cn&edition=full","pubTime":"2026-08-25 17:36","pubTimestamp":1787650608,"startTime":"0","endTime":"0","summary":"证券之星消息，近日晶方科技披露，截至2026年6月30日公司股东户数为19.68万户，较3月31日增加6.38万户，增幅为47.91%。在半导体行业个股中，晶方科技股东户数高于行业平均水平，截至6月30日，半导体行业平均股东户数为7.92万户。从股价来看，2026年3月31日至2026年6月30日，晶方科技区间涨幅为105.11%，在此期间股东户数增加6.38万户，增幅为47.91%。","market":"hk","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://stock.stockstar.com/RB2026082500036493.shtml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"shareholding","news_rank":0,"length":0,"strategy_id":0,"source":"stockstar","symbols":["BK0012","BK0108","BK0125","603005","BK0028","BK0198","BK0214","BK0067","BK0121","BK0133"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2662780074","title":"晶方科技（603005）披露2026年半年度报告，8月25日股价下跌4.17%","url":"https://stock-news.laohu8.com/highlight/detail?id=2662780074","media":"证券之星","labels":["dataReport"],"top":-1,"itemType":null,"share":"https://www.laohunote.com/m/news/2662780074?lang=zh_cn&edition=full","pubTime":"2026-08-25 17:32","pubTimestamp":1787650368,"startTime":"0","endTime":"0","summary":"截至2026年8月25日收盘，晶方科技报收于30.33元，较前一交易日下跌4.17%，最新总市值为197.8亿元。该股当日开盘30.0元，最高30.87元，最低28.98元，成交额达14.27亿元，换手率为7.32%。公司于2026年8月25日披露《2026年半年度报告》。公告显示，苏州晶方半导体科技股份有限公司总资产为5,307,060,383.57元，较上年度末增长2.60%；归属于上市公司股东的净资产为4,630,062,541.98元，较上年度末增长0.47%。经营活动产生的现金流量净额为201,229,636.23元，同比增长26.57%。","market":"hk","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://stock.stockstar.com/RB2026082500036123.shtml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"-1","news_top_title":null,"news_tag":"dataReport","news_rank":0,"length":0,"strategy_id":0,"source":"stockstar","symbols":["603005","BK0125","BK0133","BK0012","BK0121","BK0214","BK0028","BK0067","BK0198","BK0108"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2662205897","title":"图解晶方科技中报：第二季度单季净利润同比下降32.39%","url":"https://stock-news.laohu8.com/highlight/detail?id=2662205897","media":"证券之星","labels":["dataReport"],"top":-1,"itemType":null,"share":"https://www.laohunote.com/m/news/2662205897?lang=zh_cn&edition=full","pubTime":"2026-08-25 03:12","pubTimestamp":1787598746,"startTime":"0","endTime":"0","summary":"证券之星消息，晶方科技2026年中报显示，上半年度公司主营收入6.76亿元，同比上升1.39%；归母净利润1.33亿元，同比下降19.5%；扣非净利润1.19亿元，同比下降21.47%；其中2026年第二季度，公司单季度主营收入3.42亿元，同比下降9.02%；单季度归母净利润6727.69万元，同比下降32.39%；单季度扣非净利润5720.61万元，同比下降40.42%；负债率12.14%，投资收益665.28万元，财务费用1326.8万元，毛利率46.01%。财报数据概要请见下图:本文数据来源于晶方科技2026年中报，仅供参考不构成投资建议。","market":"hk","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":["earning"],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://stock.stockstar.com/RB2026082500005785.shtml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"-1","news_top_title":null,"news_tag":"dataReport","news_rank":0,"length":0,"strategy_id":0,"source":"stockstar","symbols":["603005"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2657810446","title":"晶方科技：马来西亚项目预计年底进入打样试生产阶段","url":"https://stock-news.laohu8.com/highlight/detail?id=2657810446","media":"证券之星","labels":["productRelease"],"top":-1,"itemType":null,"share":"https://www.laohunote.com/m/news/2657810446?lang=zh_cn&edition=full","pubTime":"2026-08-06 17:48","pubTimestamp":1786009705,"startTime":"0","endTime":"0","summary":"证券之星消息，晶方科技(603005)08月06日在投资者关系平台上答复投资者关心的问题。投资者提问：马来西亚的规划产能相当于苏州工厂的多少？晶方科技回复：马来西亚项目正处在设备的购置、安装、调试等产线建设与验证阶段，团队组建与培训工作也有序同步展开，预计年底进入打样试生产阶段，谢谢您的关注!本文数据来源于上海证券交易所e互动，仅供参考不构成投资建议。责任编辑：刘浩然","market":"hk","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://stock.stockstar.com/RB2026080600029874.shtml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"productRelease","news_rank":0,"length":0,"strategy_id":0,"source":"stockstar","symbols":["BK0028","BK0133","BK0214","BK0012","603005","BK0198","BK0108","BK0125","BK0121","BK0067"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2654015654","title":"晶方科技：公司是传感器晶圆级TSV封装服务技术引领者和市场龙头","url":"https://stock-news.laohu8.com/highlight/detail?id=2654015654","media":"证券之星","labels":[],"top":-1,"itemType":null,"share":"https://www.laohunote.com/m/news/2654015654?lang=zh_cn&edition=full","pubTime":"2026-07-27 17:06","pubTimestamp":1785143197,"startTime":"0","endTime":"0","summary":"证券之星消息，晶方科技07月27日在投资者关系平台上答复投资者关心的问题。晶方科技回复：您好，公司专注于集成电路先进封装服务，在传感器晶圆级TSV封装服务细分领域，公司是技术引领者和市场龙头，相关技术在3D堆叠、异质集成等领域具有应用前景。公司将继续聚焦集成电路先进封装技术，密切关注产业发展新趋势，通过技术工艺创新迭代与市场客户拓展，以期把握新的市场机遇，致力于以可持续的成长回报广大股东，谢谢您的关注！","market":"fut","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://stock.stockstar.com/RB2026072700021768.shtml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"stockstar","symbols":["BK0012","BK0028","BK0125","BK0108","BK0121","BK0133","BK0214","BK0067","603005","BK0198"],"isVideo":false,"video":null,"gpt_icon":0}],"profile":{"ret":0,"serverTime":1788534269350,"stockEarnings":[{"period":"1week","weight":-0.0448},{"period":"1month","weight":-0.0332},{"period":"3month","weight":-0.357},{"period":"6month","weight":-0.0658},{"period":"1year","weight":-0.0375},{"period":"ytd","weight":0.0687}],"compareEarnings":[{"period":"1week","weight":-0.0037},{"period":"1month","weight":0.0313},{"period":"3month","weight":-0.0213},{"period":"6month","weight":-0.0442},{"period":"1year","weight":0.0337},{"period":"ytd","weight":-0.0067}],"compareStock":{"symbol":"000001.SH","name":"上证指数"},"companyName":"苏州晶方半导体科技股份有限公司","boardCode":"AI0039","boardName":"计算机、通信和其他电子设备制造业","stockholders":"196816人(较上一季度增加47.91%)","perCapita":"3313股","listingDate":"2014-02-10","address":"江苏省苏州市吴中区苏州工业园区汀兰巷29号","registeredCapital":"65217万元","survey":" 苏州晶方半导体科技股份有限公司的主营业务是传感器领域的封装测试业务。公司的主要产品是影像传感器芯片封装测试、生物身份识别芯片封装测试、MEMS芯片封装测试、射频芯片封装测试。","listedPrice":19.16},"APP":{"userAgent":"Mozilla/5.0 AppleWebKit/537.36 (KHTML, like Gecko; compatible; ClaudeBot/1.0; +claudebot@anthropic.com)","isDev":false,"isTTM":false,"isLaohu8Offline":false,"tenantId":"TBCN","deviceId":"web-server-community-laohu8-v3","version":"4.44.1","shortVersion":"4.44.1","platform":"web","vendor":"web","appName":"laohu8","isIOS":false,"isAndroid":false,"isTiger":false,"isTHS":false,"isWeiXin":false,"isWeiXinMini":false,"isWeiBo":false,"isQQ":false,"isBaiduSwan":false,"isBaiduBox":false,"isDingTalk":false,"isToutiao":false,"isOnePlus":false,"isHuaWei":false,"isXiaomi":false,"isXiaomiWebView":false,"isOppo":false,"isVivo":false,"isSamsung":false,"isMobile":false},"pagemeta":{"title":"晶方科技(603005)_个股概要_股票价格_最新资讯_行情走势_历史数据","description":"美港股上老虎。老虎社区提供晶方科技(603005)今日价格,行情走势,历史数据,股票概要及实时的新闻资讯,近期大事等重要参考决策数据。","keywords":"晶方科技,603005,晶方科技股票,晶方科技股票老虎,晶方科技股票老虎国际,晶方科技行情,晶方科技股票行情,晶方科技股价,晶方科技股市,晶方科技股票价格,晶方科技股票交易,晶方科技股票购买,晶方科技股票实时行情,购买美股,购买港股,港股开户,美股开户,美股交易,港股交易,开通美港股账户,老虎国际行情","social":{"og_title":"晶方科技(603005)_个股概要_股票价格_最新资讯_行情走势_历史数据","og_description":"美港股上老虎。老虎社区提供晶方科技(603005)今日价格,行情走势,历史数据,股票概要及实时的新闻资讯,近期大事等重要参考决策数据。","og_image":"https://static.tigerbbs.com/a0b84b8debbbce3b4440f7fdd5eed2e7"}}}