159582 半导体
已收盘 05-21 15:00:00
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盈新发展：关于长兴半导体是否扩大产能属于交易交割后的经营安排
证券之星 · 05-21 20:53
盈新发展：关于长兴半导体是否扩大产能属于交易交割后的经营安排
容大感光：主营PCB光刻胶、显示用光刻胶、半导体光刻胶及配套化学品
证券之星 · 05-21 20:48
容大感光：主营PCB光刻胶、显示用光刻胶、半导体光刻胶及配套化学品
沃格光电最新公告：在泛半导体领域的业务尚处于早期阶段
证券之星 · 05-21 18:40
沃格光电最新公告：在泛半导体领域的业务尚处于早期阶段
达瑞电子：公司在半导体领域的设备产品系子公司山东誉正自主研发
证券之星 · 05-21 17:51
达瑞电子：公司在半导体领域的设备产品系子公司山东誉正自主研发
本川智能最新公告：控股子公司与西安交通大学签署功率半导体技术开发合同
证券之星 · 05-21 17:49
本川智能最新公告：控股子公司与西安交通大学签署功率半导体技术开发合同
科技大佬，持续抛售两只半导体股票！
格隆汇 · 05-21 17:08
科技大佬，持续抛售两只半导体股票！
5月21日奥普光电跌6.72%，南方半导体产业股票发起A基金重仓该股
证券之星 · 05-21 16:43
5月21日奥普光电跌6.72%，南方半导体产业股票发起A基金重仓该股
立中集团：硅铝合金、铝碳化硅复合材料主要应用于半导体设备
证券之星 · 05-21 16:42
立中集团：硅铝合金、铝碳化硅复合材料主要应用于半导体设备
5月21日XD深科达跌9.29%，宝盈半导体产业混合发起式A基金重仓该股
证券之星 · 05-21 16:35
5月21日XD深科达跌9.29%，宝盈半导体产业混合发起式A基金重仓该股
涪陵榨菜：未入股半导体企业
证券之星 · 05-21 15:42
涪陵榨菜：未入股半导体企业
韩国5月前20天半导体出口大增202%，DRAM出口额同比飙升498%
华尔街见闻 · 05-21 15:17
韩国5月前20天半导体出口大增202%，DRAM出口额同比飙升498%
A股三大指数早盘冲高回落 沪指抹除涨幅 石油石化、半导体等板块跌幅居前
金吾财讯 · 05-21 11:39
A股三大指数早盘冲高回落 沪指抹除涨幅 石油石化、半导体等板块跌幅居前
深圳华强：向新能源头部客户供应第三代半导体等核心元器件
证券之星 · 05-21 11:39
深圳华强：向新能源头部客户供应第三代半导体等核心元器件
日本4月出口同比猛增14.8%远超预期！半导体出货量暴拉41.6%成主引擎
智通财经 · 05-21 10:24
日本4月出口同比猛增14.8%远超预期！半导体出货量暴拉41.6%成主引擎
ETF日报｜2倍做多纳微半导体ETF涨逾36%；三倍做多半导体ETF涨逾14%；半导体与小盘成长走强
ETF追踪 · 05-21 06:02
ETF日报｜2倍做多纳微半导体ETF涨逾36%；三倍做多半导体ETF涨逾14%；半导体与小盘成长走强
美股半导体板块涨幅进一步扩大，ARM涨超16%创新高
老虎资讯综合 · 05-20 22:46
美股半导体板块涨幅进一步扩大，ARM涨超16%创新高
美股半导体板块涨幅持续扩大，ARM、Cerebras Systems涨超10%
老虎资讯综合 · 05-20 21:46
美股半导体板块涨幅持续扩大，ARM、Cerebras Systems涨超10%
开盘 | 美股三大指数集体高开！半导体板块普涨，英特尔涨超6%
老虎资讯综合 · 05-20 21:30
开盘 | 美股三大指数集体高开！半导体板块普涨，英特尔涨超6%
台基股份：聚焦功率半导体主业，实施内生增长和外延扩张并举的发展战略
证券之星 · 05-20 20:52
台基股份：聚焦功率半导体主业，实施内生增长和外延扩张并举的发展战略
台基股份：推进IGBT、SiC等功率半导体模块业务
证券之星 · 05-20 20:52
台基股份：推进IGBT、SiC等功率半导体模块业务
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15:00:00","open":3.76,"high":3.87,"low":3.509,"amount":202000000,"amplitude":0.0978,"askPrice":3.601,"askSize":25,"bidPrice":3.6,"bidSize":827,"shortable":0,"etf":1,"tradingStatus":0,"nextMarketStatus":{"tag":"开盘","tradingStatus":2,"beginTime":1779413400000},"marketStatusCode":5,"adr":0,"adjPreClose":3.691,"symbolType":"fund","openAndCloseTimeList":[[1779327000000,1779334200000],[1779339600000,1779346800000]],"highLimit":4.06,"lowLimit":3.322,"ibTradeSell":false,"ibTradeBuySell":false,"isCdr":false,"pbRate":0,"committee":0.432128,"marketValue":0,"turnoverRate":0,"status":1,"floatMarketCap":0},"requestUrl":"/m/hq/s/159582","defaultTab":"news","newsList":[{"id":"2637336253","title":"盈新发展：关于长兴半导体是否扩大产能属于交易交割后的经营安排","url":"https://stock-news.laohu8.com/highlight/detail?id=2637336253","media":"证券之星","labels":[],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/2637336253?lang=zh_cn&edition=full","pubTime":"2026-05-21 20:53","pubTimestamp":1779367987,"startTime":"0","endTime":"0","summary":"证券之星消息，盈新发展(000620)05月21日在投资者关系平台上答复投资者关心的问题。投资者提问：董秘 你好 公司已经成功收购长兴半导体、什么时候扩大产能？新成立的公司 在机器人方面如何布局？盈新发展回复：您好，关于长兴半导体是否扩大产能属于交易交割后的经营安排。后续如有达到信息披露标准的具体规划，公司将依法合规履行信息披露义务。以上内容为证券之星据公开信息整理，由AI算法生成（网信算备310104345710301240019号），不构成投资建议。","market":"sh","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://stock.stockstar.com/RB2026052100042452.shtml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"stockstar","symbols":["BK0273","159582","BK0039","BK0012","BK0077","000620","BK0028"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2637336174","title":"容大感光：主营PCB光刻胶、显示用光刻胶、半导体光刻胶及配套化学品","url":"https://stock-news.laohu8.com/highlight/detail?id=2637336174","media":"证券之星","labels":[],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/2637336174?lang=zh_cn&edition=full","pubTime":"2026-05-21 20:48","pubTimestamp":1779367720,"startTime":"0","endTime":"0","summary":"能否应用于AI相关产品，具体性能指标如何。谢谢容大感光回复：您好，公司主营产品涵盖 PCB光刻胶、显示用光刻胶、半导体光刻胶及配套化学品等系列电子感光化学品，属于电子电路制造领域的高端功能性涂层材料。后续，公司将紧跟AI算力基础设施的升级需求，持续深化技术研发与客户拓展，推动高端电子感光化学品在AI相关领域的规模化应用。","market":"hk","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://stock.stockstar.com/RB2026052100042237.shtml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"stockstar","symbols":["BK0229","300576","159582"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2637875213","title":"沃格光电最新公告：在泛半导体领域的业务尚处于早期阶段","url":"https://stock-news.laohu8.com/highlight/detail?id=2637875213","media":"证券之星","labels":[],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/2637875213?lang=zh_cn&edition=full","pubTime":"2026-05-21 18:40","pubTimestamp":1779360018,"startTime":"0","endTime":"0","summary":"沃格光电(603773)发布股票交易异常波动公告，公司关注到近期市场对玻璃基在半导体先进封装领域应用的关注度较高。目前，公司在泛半导体领域的业务尚处于早期阶段，相关产品技术仍处于研发验证或送样验证阶段，尚未形成规模化工业量产，营收规模占比极低，且相关经营主体目前仍处于亏损状态。该业务的产业化进程、未来订单规模及经营效益存在较大不确定性，敬请广大投资者注意相关风险。以上内容为证券之星据公开信息整理，由AI算法生成（网信算备310104345710301240019号），不构成投资建议。","market":"fut","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://stock.stockstar.com/RB2026052100036775.shtml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"stockstar","symbols":["BK0214","159582","603773"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2637381720","title":"达瑞电子：公司在半导体领域的设备产品系子公司山东誉正自主研发","url":"https://stock-news.laohu8.com/highlight/detail?id=2637381720","media":"证券之星","labels":[],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/2637381720?lang=zh_cn&edition=full","pubTime":"2026-05-21 17:51","pubTimestamp":1779357072,"startTime":"0","endTime":"0","summary":"证券之星消息，达瑞电子(300976)05月21日在投资者关系平台上答复投资者关心的问题。投资者提问：公司发布的半导体设备是否自主研发？达瑞电子回复：尊敬的投资者，您好！公司在半导体领域的设备产品系子公司山东誉正自主研发，该业务营收占比较小。感谢您的关注！以上内容为证券之星据公开信息整理，由AI算法生成（网信算备310104345710301240019号），不构成投资建议。","market":"sh","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://stock.stockstar.com/RB2026052100033594.shtml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"stockstar","symbols":["300976","159582","BK0214"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2637381914","title":"本川智能最新公告：控股子公司与西安交通大学签署功率半导体技术开发合同","url":"https://stock-news.laohu8.com/highlight/detail?id=2637381914","media":"证券之星","labels":["corporation"],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/2637381914?lang=zh_cn&edition=full","pubTime":"2026-05-21 17:49","pubTimestamp":1779356948,"startTime":"0","endTime":"0","summary":"本川智能(300964.SZ)公告称，公司控股子公司南京本川鹏芯科技有限公司与西安交通大学签署《技术开发(委托)合同》，委托其研究开发功率半导体器件CIPB高密度封装技术项目，双方协同完成适配CIPB技术路线的新型碳化硅封装结构及配套工艺体系的搭建，形成可量产的功率模块解决方案。研究开发经费和报酬总额为50万元。以上内容为证券之星据公开信息整理，由AI算法生成（网信算备310104345710301240019号），不构成投资建议。","market":"hk","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://stock.stockstar.com/RB2026052100033107.shtml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"corporation","news_rank":0,"length":0,"strategy_id":0,"source":"stockstar","symbols":["159582","BK0214","300964"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2637389677","title":"科技大佬，持续抛售两只半导体股票！","url":"https://stock-news.laohu8.com/highlight/detail?id=2637389677","media":"格隆汇","labels":[],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/2637389677?lang=zh_cn&edition=full","pubTime":"2026-05-21 17:08","pubTimestamp":1779354531,"startTime":"0","endTime":"0","summary":"流动性拐点出现？","market":"hk","thumbnail":"https://img3.gelonghui.com/66148-c72b62e1-bf24-4209-b722-d6e1d43aec5d.jpg?guru_height=3264&guru_width=5824&guru_size=1537882","type":0,"news_type":0,"thumbnails":["https://img3.gelonghui.com/66148-c72b62e1-bf24-4209-b722-d6e1d43aec5d.jpg?guru_height=3264&guru_width=5824&guru_size=1537882"],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://www.gelonghui.com/p/4868768","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"-1","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"gelonghui_fund_highlight","symbols":["159582"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2637854543","title":"5月21日奥普光电跌6.72%，南方半导体产业股票发起A基金重仓该股","url":"https://stock-news.laohu8.com/highlight/detail?id=2637854543","media":"证券之星","labels":[],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/2637854543?lang=zh_cn&edition=full","pubTime":"2026-05-21 16:43","pubTimestamp":1779352987,"startTime":"0","endTime":"0","summary":"证券之星消息，5月21日奥普光电跌6.72%，收盘报62.61元，换手率5.03%，成交量12.08万手，成交额7.9亿元。重仓奥普光电的公募基金请见下表：根据2026基金Q1季报公募基金重仓股数据，重仓该股的公募基金共1家，其中持有数量最多的公募基金为南方基金的南方半导体产业股票发起A。南方半导体产业股票发起A目前规模为1.68亿元，最新净值3.4556，较上一交易日上涨4.92%，近一年上涨149.11%。该公募基金现任基金经理为郑晓曦。","market":"hk","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://stock.stockstar.com/RB2026052100030698.shtml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"-1","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"stockstar","symbols":["BK0112","BK0028","BK0121","BK0062","BK0132","159582","BK0122","002338","BK0225"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2637385480","title":"立中集团：硅铝合金、铝碳化硅复合材料主要应用于半导体设备","url":"https://stock-news.laohu8.com/highlight/detail?id=2637385480","media":"证券之星","labels":[],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/2637385480?lang=zh_cn&edition=full","pubTime":"2026-05-21 16:42","pubTimestamp":1779352947,"startTime":"0","endTime":"0","summary":"证券之星消息，立中集团05月21日在投资者关系平台上答复投资者关心的问题。公司生产的硅铝合金、铝碳化硅复合材料主要应用于半导体设备，如基座、支撑架、静电卡盘等精密零部件的制造，因商业保密要求，具体客户名称暂不便披露。相关业务受行业周期波动、下游客户认证进度、行业技术迭代及市场竞争等多重因素影响，业务开展存在一定不确定性，请注意投资风险。","market":"fut","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://stock.stockstar.com/RB2026052100030685.shtml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"stockstar","symbols":["159582","BK0028","BK0172","300428","BK0138","BK0264","BK0077"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2637738591","title":"5月21日XD深科达跌9.29%，宝盈半导体产业混合发起式A基金重仓该股","url":"https://stock-news.laohu8.com/highlight/detail?id=2637738591","media":"证券之星","labels":["dataReport"],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/2637738591?lang=zh_cn&edition=full","pubTime":"2026-05-21 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