芯德半导体(07672)_个股概要_股票价格_最新资讯_行情走势_历史数据 - 老虎社区

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07672 芯德半导体

待上市 10-30 13:34:59

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北京优虎网络科技有限公司

免责声明:香港交易所资讯服务有限公司、其控股公司及／或该等控股公司的任何附属公司均竭力确保所提供信息的准确和可靠度，但不能保证其绝对准确和可靠，且亦不会承担因任何不准确或遗漏而引起的任何损失或损害的责任（不管是否侵权法下的责任或合约责任又或其它责任）

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| 芯德半导体今起招股，一手入场费4848.41港元","url":"https://stock-news.laohu8.com/highlight/detail?id=1186248061","media":"老虎资讯综合","labels":[],"top":1,"itemType":null,"share":"https://www.laohunote.com/m/news/1186248061?lang=zh_cn&edition=full","pubTime":"2026-10-30 09:31","pubTimestamp":1793323870,"startTime":"0","endTime":"0","summary":"公司是中国具备传统及先进封装技术能力的企业之一，能够在“后摩尔时代”推动半导体创新取得突破并支持“AI+时代”的发展浪潮。基于每股发售股份9.10港元的发售价，基石投资者将认购合共3439.35万股发售股份。假设发售价为每股H股9.10港元，公司将收取全球发售所得款项净额约9.043亿港元。","market":"hk","thumbnail":"https://static.tigerbbs.com/03e38a3a3c63bd5a9d8d8ca2d384d1c5","type":0,"news_type":0,"thumbnails":["https://static.tigerbbs.com/03e38a3a3c63bd5a9d8d8ca2d384d1c5"],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"","is_publish_highlight":true,"source_rank":0,"column":"","sentiment":"0","news_top_title":"新股招股 | 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08:33","pubTimestamp":1793320380,"startTime":"0","endTime":"0","summary":"公司已订立基石投资协议，根据基石投资协议，基石投资者已同意，受限于其中所载的条件，按发售价认购或促使彼等的指定实体认购可以约3.13亿港元的总额购买的该等数目的发售股份。基于每股发售股份9.10港元的发售价，基石投资者将认购合共3439.35万股发售股份。公司累计完成7轮融资，融资额超过20亿元，IPO前估值约72亿元。2023年至2025年，净亏损分别为3.59亿元、3.77亿元和4.83亿元，三年累计亏损12.19亿元。芯德半导体的IPO，本质上是在为这场跨越负毛","market":"hk","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"http://mp.weixin.qq.com/s?__biz=MzU3MTY1MzExOQ==&mid=2247615184&idx=3&sn=a715c09d6a2288a614ac3873077cf449&chksm=fddd3a42b3626800f87fc2988926bb783cf9fed725db3f375d04ba18afe8d56e112b7c92fa6e&scene=0#rd","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":null,"symbols":["07672"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2679125381","title":"芯德半导体(07672)10月30日-11月5日招股 拟全球发售1.07亿股H股 引入广发基金、国惠香港等基石投资者","url":"https://stock-news.laohu8.com/highlight/detail?id=2679125381","media":"智通财经","labels":[],"top":-1,"itemType":null,"share":"https://www.laohunote.com/m/news/2679125381?lang=zh_cn&edition=full","pubTime":"2026-10-30 07:36","pubTimestamp":1793316962,"startTime":"0","endTime":"0","summary":"智通财经APP讯，芯德半导体 于2026年10月30日-2026年11月5日招股，拟全球发售1.07亿股H股，其中，香港公开发售占约10%，国际发售占约90%。集团的收入由截至2025 年4月30日止四个月的人民币3.06亿元增加至截至2026年4月30日止四个月的人民币3.6亿元。于2023年、2024年及2025年以及截至2025年及2026年4月30日止四个月，集团分别取得期内亏损为人民币3.59亿元、人民币3.77亿元、人民币4.83亿元、人民币1.64亿元及人民币1.62亿元。","market":"us","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"http://www.zhitongcaijing.com/content/detail/1515763.html","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"stock_zhitongcaijing","symbols":["07672"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"1188586706","title":"江苏信德半导体科技启动全球发售，拟融资约9.04亿港元","url":"https://stock-news.laohu8.com/highlight/detail?id=1188586706","media":"公告速递","labels":[],"top":1,"itemType":null,"share":"https://www.laohunote.com/m/news/1188586706?lang=zh_cn&edition=full","pubTime":"2026-10-30 07:10","pubTimestamp":1793315446,"startTime":"0","endTime":"0","summary":"江苏信德半导体科技股份有限公司是一家主要从事半导体封测业务的企业。公司在南京和扬州建设了生产基地，持续扩能以应对全球芯片需求增长，并承接消费电子、通信、汽车电子及数据中心等领域的业务。公司按每股9.10港元的中间价计算，预计全球发售的净募集资金约为9.043亿港元。发行完成后，公司的单一最大股东组合持股比例将由约24.95%降至约22.45%。","market":"us","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":"a3893e2538b44a4c9453f52433cb6ed2","theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":"江苏信德半导体科技启动全球发售，拟融资约9.04亿港元","news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":null,"symbols":["07672"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"1114792928","title":"江苏芯德半导体科技全球发售：拟发行逾1.06亿股H股，最高发售价每股9.60港元","url":"https://stock-news.laohu8.com/highlight/detail?id=1114792928","media":"公告速递","labels":[],"top":1,"itemType":null,"share":"https://www.laohunote.com/m/news/1114792928?lang=zh_cn&edition=full","pubTime":"2026-10-30 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预计11月10日登陆港交所","url":"https://stock-news.laohu8.com/highlight/detail?id=1107834708","media":"公告速递","labels":[],"top":-1,"itemType":null,"share":"https://www.laohunote.com/m/news/1107834708?lang=zh_cn&edition=full","pubTime":"2026-10-30 06:10","pubTimestamp":1793311852,"startTime":"0","endTime":"0","summary":"2026年10月30日，江蘇芯德半导体科技股份有限公司公布全球发售详情。公司拟发行106,562,500股H股，其中香港公开发售10,656,500股，占本次发行规模约10%；国际发售95,906,000股，占约90%，两者均可重新分配。本次H股发售价区间为每股8.60港元至9.60港元。发行结果及最终发售价将不迟于2026年11月9日23:00在港交所网站及公司网站披露。如所有条件达成，江蘇芯德半导体科技股份有限公司H股将于2026年11月10日09:00在港交所主板挂牌交易，股票代码为07672，买卖单位为每手500股。","market":"hk","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":"a3893e2538b44a4c9453f52433cb6ed2","theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":null,"symbols":["07672"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2677940854","title":"芯德半导体港股聆讯落地，董事长薪酬一年涨超八倍，营收增长利润仍亏","url":"https://stock-news.laohu8.com/highlight/detail?id=2677940854","media":"蓝鲸财经","labels":[],"top":-1,"itemType":null,"share":"https://www.laohunote.com/m/news/2677940854?lang=zh_cn&edition=full","pubTime":"2026-10-23 17:37","pubTimestamp":1792748225,"startTime":"0","endTime":"0","summary":"芯德半导体成立于2020年9月，定位为半导体封测技术解决方案提供商，采用OSAT模式，其核心业务聚焦封装设计及测试服务。值得注意的是，2025年董事长张国栋的薪酬达到1527万元，较前一年涨幅超过八倍，四名执行董事合计薪酬较2024年增加170%、超过3700万元，其中股份支付集中摊销是重要推手。整体来看，营收快速增长未能覆盖高昂的固定成本及前期投入。","market":"hk","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":["earning"],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://www.lanjinger.com/d/1792747455880655435","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"lanjinger_stock","symbols":["07672"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2677591992","title":"成立仅6年的芯德半导体通过聆讯，如何看先进封测新星的成长后劲？","url":"https://stock-news.laohu8.com/highlight/detail?id=2677591992","media":"同花顺","labels":[],"top":-1,"itemType":null,"share":"https://www.laohunote.com/m/news/2677591992?lang=zh_cn&edition=full","pubTime":"2026-10-23 10:16","pubTimestamp":1792721760,"startTime":"0","endTime":"0","summary":"2020年9月才成立的芯德半导体，距离叩开港交所的大门似乎只剩下临门一脚了。智通财经注意到，日前，芯德半导体通过港交所聆讯。这家以提供半导体封测服务为主业的公司，在过去几年里实现了 ...","market":"sg","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tonghuashun","url":"http://stock.10jqka.com.cn/hks/20261023/c681010508.shtml","rn_cache_url":null,"directOrigin":true},"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"http://stock.10jqka.com.cn/hks/20261023/c681010508.shtml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"tonghuashun","symbols":["07672","159582"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2677991986","title":"新股解读|成立仅6年的芯德半导体通过聆讯，如何看先进封测新星的成长后劲？","url":"https://stock-news.laohu8.com/highlight/detail?id=2677991986","media":"智通财经","labels":[],"top":-1,"itemType":null,"share":"https://www.laohunote.com/m/news/2677991986?lang=zh_cn&edition=full","pubTime":"2026-10-23 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21:11","pubTimestamp":1792674667,"startTime":"0","endTime":"0","summary":"江苏芯德半导体科技股份有限公司（简称：“芯德半导体”）日前通过上市聆讯，准备在港交所上市。","market":"hk","thumbnail":"https://leidinews-1256465536.cos.ap-chengdu.myqcloud.com/u_News/20261022/6392830023973030832526117.jpeg","type":0,"news_type":0,"thumbnails":["https://leidinews-1256465536.cos.ap-chengdu.myqcloud.com/u_News/20261022/6392830023973030832526117.jpeg"],"rights":null,"property":["earning"],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://www.leinews.com/n35466/detail.html","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"leinews_highlight","symbols":["07672"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2677598579","title":"芯德半导体通过港交所聆讯，小米、OPPO、联发科为股东，今年前四个月收入3.6亿元","url":"https://stock-news.laohu8.com/highlight/detail?id=2677598579","media":"市场资讯","labels":[],"top":-1,"itemType":null,"share":"https://www.laohunote.com/m/news/2677598579?lang=zh_cn&edition=full","pubTime":"2026-10-22 08:01","pubTimestamp":1792627260,"startTime":"0","endTime":"0","summary":"来源：独角兽早知道 iponews10月21日，据港交所披露，江苏芯德半导体科技股份有限公司更新聆讯后资料集，公司正式通过港交所主板上市聆讯，华泰国际担任独家保荐人。小米、OPPO、联发科的集体入局，并非单纯的财务投资。截至2026年4月30日止四个月，营收继续同比增长17.4%至3.60亿元。2026年前四个月，亏损为1.62亿元。芯德半导体成立于2020年，目前正处于这一行业周期的爬坡关键期。截至2026年4月30日，公司拥有277名研发人员。","market":"sg","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://finance.sina.com.cn/stock/hkstock/2026-10-22/doc-inivzyty4806624.shtml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"sina","symbols":["07672"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2677499983","title":"新股消息 | 芯德半导体通过港交所聆讯 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06:45","pubTimestamp":1792622728,"startTime":"0","endTime":"0","summary":"智通财经APP获悉，据港交所10月21日披露，江苏芯德半导体科技股份有限公司通过港交所主板上市聆讯，华泰国际为独家保荐人。招股书显示，芯德半导体是一家半导体封测技术解决方案提供商，主要从事开发封装设计、提供定制封装产品以及封装产品测试服务。在晶体管密度增长接近其规模极限的“后摩尔时代”，依靠新型半导体封装架构作为连接芯片设计与应用的关键环节成为了提升芯片性能、效率及功能灵活性的关键驱动力。","market":"fut","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"http://www.zhitongcaijing.com/content/detail/1510458.html","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"stock_zhitongcaijing","symbols":["07672"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2671296721","title":"技术壁垒成色堪忧？芯德半导体港股IPO前夕董事会主席薪酬包激增八倍","url":"https://stock-news.laohu8.com/highlight/detail?id=2671296721","media":"新浪证券","labels":["executive"],"top":-1,"itemType":null,"share":"https://www.laohunote.com/m/news/2671296721?lang=zh_cn&edition=full","pubTime":"2026-09-29 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