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03191 GX中国半导
未开盘 10-05 16:08:05
77.100
+0.780
+1.02%
最高
77.520
最低
76.220
成交量
28.21万
今开
76.320
昨收
76.320
日振幅
1.70%
总市值
32.42亿
流通市值
32.42亿
总股本
4,205万
成交额
2,176万
换手率
0.67%
流通股本
4,205万
市净率
--
ROE
--
每股收益
0.00
52周最高
--
52周最低
--
市盈率
--
股息
--
股息收益率
--
ROA
--
分时
五日
日K
周K
月K
数据加载中...
北京优虎网络科技有限公司
免责声明:香港交易所资讯服务有限公司、其控股公司及/或该等控股公司的任何附属公司均竭力确保所提供信息的准确和可靠度,但不能保证其绝对准确和可靠,且亦不会承担因任何不准确或遗漏而引起的任何损失或损害的责任(不管是否侵权法下的责任或合约责任又或其它责任)
资讯
新帖
简况
Broadcom豪掷420亿美元押注Anthropic,AI芯片生意正在变成一场资本游戏
FX168全球投资 · 10-03 07:48
Broadcom豪掷420亿美元押注Anthropic,AI芯片生意正在变成一场资本游戏
美股异动 | 传甲骨文(ORCL.US)签署协议出租高端AI芯片 股价涨超4.5%
智通财经 · 10-02
美股异动 | 传甲骨文(ORCL.US)签署协议出租高端AI芯片 股价涨超4.5%
SpaceX即将把谷歌AI芯片送入轨道,推进太空数据中心构想
环球市场播报 · 10-01
SpaceX即将把谷歌AI芯片送入轨道,推进太空数据中心构想
玻璃基板争夺战:AI芯片封装的下一个制高点
证券之星 · 09-29
玻璃基板争夺战:AI芯片封装的下一个制高点
狂砸8.5万亿!中国AI算力扩容三倍、国产芯片占比要超70%
快科技2018 · 09-26
狂砸8.5万亿!中国AI算力扩容三倍、国产芯片占比要超70%
A股申购 | 粤芯半导体(301660.SZ)开启申购 为广东省首家进入量产的12英寸晶圆制造企业
智通财经 · 09-24
A股申购 | 粤芯半导体(301660.SZ)开启申购 为广东省首家进入量产的12英寸晶圆制造企业
江丰电子最新公告:拟出资4.17亿元参与设立合伙企业投向半导体产业链
证券之星 · 09-22
江丰电子最新公告:拟出资4.17亿元参与设立合伙企业投向半导体产业链
国产芯片巨头入局嵌入式,海光用技术和生态破局
智东西 · 09-22
国产芯片巨头入局嵌入式,海光用技术和生态破局
平头哥发布训推一体AI芯片真武V900,计划2027年一季度量产|直击2026云栖大会
国际金融报 · 09-22
平头哥发布训推一体AI芯片真武V900,计划2027年一季度量产|直击2026云栖大会
平头哥发布真武V900 AI芯片:性能提升至三倍,2027年第一季度量产
财闻 · 09-22
平头哥发布真武V900 AI芯片:性能提升至三倍,2027年第一季度量产
平头哥发布真武V900 AI芯片:性能提升至三倍,2027年第一季度量产
财闻 · 09-22
平头哥发布真武V900 AI芯片:性能提升至三倍,2027年第一季度量产
平头哥发布国内最强AI芯片,将于2027年第一季度上市
深圳商报·读创 · 09-22
平头哥发布国内最强AI芯片,将于2027年第一季度上市
平头哥发布国内最强AI芯片,2027年第一季度上市
广州日报 · 09-22
平头哥发布国内最强AI芯片,2027年第一季度上市
大行评级丨高盛:华虹迎AI芯片机遇,维持H股“买入”评级,目标价335港元
格隆汇 · 09-22
大行评级丨高盛:华虹迎AI芯片机遇,维持H股“买入”评级,目标价335港元
中国半导体光刻胶龙头彤程新材正在招股 预计9月29日上市
格隆汇 · 09-22
中国半导体光刻胶龙头彤程新材正在招股 预计9月29日上市
半导体公司Microchip Technology(微芯科技)已完成对以色列边缘AI芯片制造商Hailo的收购。
格隆汇 · 09-21
半导体公司Microchip Technology(微芯科技)已完成对以色列边缘AI芯片制造商Hailo的收购。
每周股票复盘:炬芯科技(688049)端侧AI芯片持续放量推动业绩创新高
证券之星 · 09-20
每周股票复盘:炬芯科技(688049)端侧AI芯片持续放量推动业绩创新高
A股收评:全市成交额重回2万亿!创业板指涨2.25%,超4200股上涨,半导体产业链大涨
中金财经 · 09-18
A股收评:全市成交额重回2万亿!创业板指涨2.25%,超4200股上涨,半导体产业链大涨
A股收评:全市成交额重回2万亿!创业板指涨2.25%,超4200股上涨,半导体产业链大涨
格隆汇 · 09-18
A股收评:全市成交额重回2万亿!创业板指涨2.25%,超4200股上涨,半导体产业链大涨
集邦咨询:预计CoWoS-L至2028年仍将是AI芯片的主流封装方案
智通财经 · 09-18
集邦咨询:预计CoWoS-L至2028年仍将是AI芯片的主流封装方案
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公司概况
公司名称:
GX中国半导
所属市场:
SEHK
上市日期:
--
主营业务:
子基金的投资目标是提供在扣除费用及支出前与指数表现紧密相关的投资业绩。
发行价格:
--
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腾讯已与甲骨文签署其最大海外租赁协议,腾讯控股同意租赁甲骨文在东南亚的多家数据中心,租期为五年。该交易让腾讯能够使用约10万片高端AI芯片,协议价值估计约70亿美元,预付款比例约为30%。","market":"fut","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"http://www.zhitongcaijing.com/content/detail/1503464.html","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"corporation","news_rank":0,"length":0,"strategy_id":0,"source":"stock_zhitongcaijing","symbols":["AIFD","AVGC","BK1610","FAI","AIS","AVGG","AVGX","WISE","AVGW","EPAI","AIVC","AIBU","03191","AVGU","GPTZ","ALAI","AVL","LRNZ","AVS"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2672887752","title":"SpaceX即将把谷歌AI芯片送入轨道,推进太空数据中心构想","url":"https://stock-news.laohu8.com/highlight/detail?id=2672887752","media":"环球市场播报","labels":["corporation"],"top":-1,"itemType":null,"share":"https://www.laohunote.com/m/news/2672887752?lang=zh_cn&edition=full","pubTime":"2026-10-01 20:04","pubTimestamp":1790856240,"startTime":"0","endTime":"0","summary":"谷歌母公司 Alphabet 计划周四将自研 AI 芯片搭乘 SpaceX 猎鹰 9 号火箭送入太空,向着实现太空数据中心迈出关键一步。SpaceX 今年 6 月完成史上规模空前的 IPO,尽管两家企业的 AI 部门互为竞争对手,但双方保持深度合作关系。目前 Alphabet 持有的 SpaceX 股权估值超过 820 亿美元。马斯克执掌的 SpaceX 同样公布规划:自主研发轨道数据中心。本次 “运输者18” 是 SpaceX 单日第二场具备里程碑意义的发射。","market":"other","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://finance.sina.com.cn/stock/usstock/c/2026-10-01/doc-inittqxz1908771.shtml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"corporation","news_rank":0,"length":0,"strategy_id":0,"source":"sina","symbols":["CLDL","SKYY","SNPE","SNK","ILDR","FCLD","AIS","EPAI","EFIV","SGOOGmain","MARS","CNEQ","AIO","PBOT","CLOU","IDGT","SPCH","LRNZ","HPEL","AIVC","ALAI","XOVR","SPCU","03191","SPAL","GGLL","GPTZ","WDAI","GXPC","DXYZ","METV","AVGC","GGLS","SPCF","AVGX","DTCR","BLOK","OGIG","AIFD","JGRO","AIBU","FAI","WPAI","FMET","SPCX","CMAG","GOOGL","GOOG","WISE"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2671295760","title":"玻璃基板争夺战:AI芯片封装的下一个制高点","url":"https://stock-news.laohu8.com/highlight/detail?id=2671295760","media":"证券之星","labels":[],"top":-1,"itemType":null,"share":"https://www.laohunote.com/m/news/2671295760?lang=zh_cn&edition=full","pubTime":"2026-09-29 14:19","pubTimestamp":1790662775,"startTime":"0","endTime":"0","summary":"据外媒测算,采用玻璃基板后,芯片运行速度可提升约40%,功耗降低近一半。AI芯片的算力竞赛,正在把传统封装材料逼到墙角。当前主流的有机基板在芯片面积不断扩大、互连密度持续攀升的情况下,翘曲问题越来越难以控制,布线密度也逼近物理极限。玻璃基板还能提供510mm×515mm、600mm×600mm等大尺寸矩形面板,材料利用率可提升至75%以上,这对于承载AI大封装所需的异质集成至关重要。这场围绕一块玻璃的竞赛,本质上是对AI时代封装话语权的争夺。","market":"fut","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://stock.stockstar.com/SS2026092900019756.shtml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"stockstar","symbols":["BK1610","03191"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2670745094","title":"狂砸8.5万亿!中国AI算力扩容三倍、国产芯片占比要超70%","url":"https://stock-news.laohu8.com/highlight/detail?id=2670745094","media":"快科技2018","labels":[],"top":-1,"itemType":null,"share":"https://www.laohunote.com/m/news/2670745094?lang=zh_cn&edition=full","pubTime":"2026-09-26 22:41","pubTimestamp":1790433660,"startTime":"0","endTime":"0","summary":"报告预计,中国IT总容量将从2025年的26GW升至2030年的81GW,扩容超过三倍,其中AI新增电力需求将从2026年的5.6GW增至2030年的13GW。报告预计,国产AI芯片出货量将从2025年的110万颗增至2026年的240万颗、2027年的480万颗,2030年达1100万颗,市场规模从940亿元扩大至6460亿元。国产芯片在服务器中的部署占比将大幅提升。报告预测,服务器国产芯片部署占比将达到70%至85%,意味着国产GPU与ASIC将在本轮算力扩容中占据主导地位。","market":"other","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://finance.sina.com.cn/stock/bxjj/2026-09-26/doc-initemqy4018025.shtml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"sina","symbols":["WISE","03191","KSTR","WDAI","AIO","BK1610"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2669434880","title":"A股申购 | 粤芯半导体(301660.SZ)开启申购 为广东省首家进入量产的12英寸晶圆制造企业","url":"https://stock-news.laohu8.com/highlight/detail?id=2669434880","media":"智通财经","labels":["corporation"],"top":-1,"itemType":null,"share":"https://www.laohunote.com/m/news/2669434880?lang=zh_cn&edition=full","pubTime":"2026-09-24 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20:50","pubTimestamp":1790081440,"startTime":"0","endTime":"0","summary":"江丰电子(300666.SZ)公告称,公司全资子公司宁波江丰博鑫拟与关联方共同投资设立宁波涌光同行项目管理合伙企业,总出资额6亿元,其中宁波江丰博鑫拟出资4.17亿元,占比69.50%。该合伙企业将投向与主业具有协同效应的半导体产业链关键环节。本次交易构成关联交易,已获董事会审议通过,尚需提交股东会审议。以上内容为证券之星据公开信息整理,仅供参考不构成投资建议。","market":"sh","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://stock.stockstar.com/RB2026092200038750.shtml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"corporation","news_rank":0,"length":0,"strategy_id":0,"source":"stockstar","symbols":["BK0214","03191","300666","BK0125"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2669913149","title":"国产芯片巨头入局嵌入式,海光用技术和生态破局","url":"https://stock-news.laohu8.com/highlight/detail?id=2669913149","media":"智东西","labels":[],"top":-1,"itemType":null,"share":"https://www.laohunote.com/m/news/2669913149?lang=zh_cn&edition=full","pubTime":"2026-09-22 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