天域半导体(02658)_个股概要_股票价格_最新资讯_行情走势_历史数据 - 老虎社区

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02658 天域半导体

交易中 05-27 15:39:45

60.800

+6.200

+11.36%

最高62.650	最低55.550	成交量147.71万
今开55.550	昨收54.600	日振幅13.00%
总市值239.11亿	流通市值35.87亿	总股本3.93亿
成交额8,909万	换手率2.50%	流通股本5,899万
市净率--	ROE--	每股收益0.00
52周最高--	52周最低--	市盈率--
股息--	股息收益率--	ROA--

数据加载中...

北京优虎网络科技有限公司

免责声明:香港交易所资讯服务有限公司、其控股公司及／或该等控股公司的任何附属公司均竭力确保所提供信息的准确和可靠度，但不能保证其绝对准确和可靠，且亦不会承担因任何不准确或遗漏而引起的任何损失或损害的责任（不管是否侵权法下的责任或合约责任又或其它责任）

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碳化硅概念爆发，天域半导体盘中大涨10.35%","url":"https://stock-news.laohu8.com/highlight/detail?id=1143517509","media":"异动解读","labels":["movement"],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/1143517509?lang=zh_cn&edition=full","pubTime":"2026-05-27 10:05","pubTimestamp":1779847559,"startTime":"0","endTime":"0","summary":"天域半导体今日盘中大涨10.35%，引起了市场的广泛关注。消息面上，碳化硅概念股全线爆发，产业景气度上行显著，上游SiC衬底厂均处于满产运行状态。有分析将碳化硅列为人工智能（AI）领域被严重忽略的核心主线，预计到2030年，AI电源将占SiC电源市场的50%，衬底和设备需求有望增长近10倍。此外，有券商研报指出，随着AI发展，SiC在AI相关领域的需求有明显增长，并且未来存在大量增长空间，相关需求远超车规等传统市场。预计到2030年，整体电源的SiC衬底需求有望接近700亿元，实现近8倍增长。","market":"sg","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":"","theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"movement","news_rank":0,"length":0,"strategy_id":0,"source":"ai_movement_cn","symbols":["02658"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2638952767","title":"港股异动 | 碳化硅概念股全线爆发 碳化硅重点受益于AI电源增量 产业景气度上行显著","url":"https://stock-news.laohu8.com/highlight/detail?id=2638952767","media":"智通财经","labels":["dataReport"],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/2638952767?lang=zh_cn&edition=full","pubTime":"2026-05-27 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据报三星重启SiC业务","url":"https://stock-news.laohu8.com/highlight/detail?id=2637393308","media":"智通财经","labels":[],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/2637393308?lang=zh_cn&edition=full","pubTime":"2026-05-22 13:56","pubTimestamp":1779429418,"startTime":"0","endTime":"0","summary":"智通财经APP获悉，天域半导体盘中涨超12%，截至发稿，涨10.97%，报53.2港元，成交额1334.42万港元。消息面上，据报道，三星电子已正式重启碳化硅 半导体业务，并与材料、设备及零部件厂商展开合作，推进8英寸SiC产线建设。华西证券指出，随着下游应用需求的快速增长，全球大厂加大对SiC的重视，进而增加对SiC芯片产线的投资，有望催化上游衬底、设备的新增需求。据悉，EYEQ Lab是韩国第三代半导体SiC功率半导体领域的领军企业。","market":"fut","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"http://www.zhitongcaijing.com/content/detail/1444958.html","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"stock_zhitongcaijing","symbols":["BK1169","VXUS","EMXC","BK4588","02658","BK4585"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"1178121731","title":"一周港股牛熊榜 |  金辉控股飙152%领跑，京西国际、天岳先进升逾六成强势爆发","url":"https://stock-news.laohu8.com/highlight/detail?id=1178121731","media":"老虎资讯综合","labels":["movement"],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/1178121731?lang=zh_cn&edition=full","pubTime":"2026-05-15 17:43","pubTimestamp":1778838189,"startTime":"0","endTime":"0","summary":"今日股价显著放量，收盘升205%，成交额超10亿港元。京西国际于5月10日晚间发布公告，披露控股股东京西智行集团告知，其与立讯精密订立买卖协议，立讯精密将收购京西智行集团全部股权，从而间接持有京西国际约59.50%股份，有望成为其最终控股股东。次日股价再升约13.60%，两个交易日累计升逾60%。受金价回软拖累，港股黄金股板块普遍走弱，灵宝黄金本周跌幅逾20%，领跌黄金板块。","market":"hk","thumbnail":"https://community-static.tradeup.com/news/549ed9c19f16d97443cb9ffadc6a6514","type":0,"news_type":0,"thumbnails":["https://community-static.tradeup.com/news/549ed9c19f16d97443cb9ffadc6a6514"],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":"b8ee1f948934007dbda4ac7ad69286fb","theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"","is_publish_highlight":true,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"movement","news_rank":0,"length":0,"strategy_id":0,"source":null,"symbols":["03330","09900","09993","00068","00326","02658","02631","09887","01236","02339"],"isVideo":false,"video":null,"gpt_icon":1},{"id":"1151356564","title":"异动解读 | 天域半导体盘中大涨19.05%，三星重启碳化硅布局及与韩国EYEQ Lab合作提振股价","url":"https://stock-news.laohu8.com/highlight/detail?id=1151356564","media":"异动解读","labels":["movement"],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/1151356564?lang=zh_cn&edition=full","pubTime":"2026-05-15 14:55","pubTimestamp":1778828140,"startTime":"0","endTime":"0","summary":"天域半导体今日盘中大涨19.05%，引起了市场的广泛关注。业内预计，三星将在2027年完成SiC试验线建设，并于2028年启动规模化量产。天域半导体作为中国最大、全球第三大自制碳化硅外延片制造商，其业务与这一趋势高度相关。市场认为，天域半导体有望从三星重启的SiC布局及与韩国伙伴的合作中受益，从而推动了股价的强劲表现。","market":"nz","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":"","theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"2","news_top_title":null,"news_tag":"movement","news_rank":0,"length":0,"strategy_id":0,"source":"ai_movement_cn","symbols":["02658"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2635777139","title":"港股异动 | 天域半导体(02658)逆市涨超18% 据报三星重启SiC布局 公司已与韩国EYEQ Lab达成合作","url":"https://stock-news.laohu8.com/highlight/detail?id=2635777139","media":"智通财经","labels":["corporation"],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/2635777139?lang=zh_cn&edition=full","pubTime":"2026-05-15 13:52","pubTimestamp":1778824373,"startTime":"0","endTime":"0","summary":"智通财经APP获悉，天域半导体逆市涨超18%，截至发稿，涨17.53%，报54.3港元，成交额9704.75万港元。业内预计，三星将在2027年完成SiC试验线建设，并于2028年启动规模化量产。公开资料显示，天域半导体是中国最大、全球第三大自制碳化硅外延片制造商，今年2月，天域半导体与韩国EYEQ Lab Inc.正式签署战略合作协议，聚焦碳化硅外延片供应与应用。据悉，EYEQ Lab是韩国第三代半导体SiC功率半导体领域的领军企业。","market":"sh","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"http://www.zhitongcaijing.com/content/detail/1442122.html","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"corporation","news_rank":0,"length":0,"strategy_id":0,"source":"stock_zhitongcaijing","symbols":["BK1169","VXUS","EMXC","BK4588","02658","BK4585"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"1100227984","title":"港股芯片股盘初走强！天域半导体涨超10%，中芯国际涨超6%","url":"https://stock-news.laohu8.com/highlight/detail?id=1100227984","media":"老虎资讯综合","labels":[],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/1100227984?lang=zh_cn&edition=full","pubTime":"2026-05-15 09:32","pubTimestamp":1778808768,"startTime":"0","endTime":"0","summary":"芯片股盘初走强，$天域半导体(02658)$涨超10%，$中芯国际(00981)$涨超6%，$华虹半导体(01347)$涨超3%，$澜起科技(06809)$、$国民技术(02701)$、$瀚天天成(02726)$涨超2%。","market":"us","thumbnail":"https://static.tigerbbs.com/03e38a3a3c63bd5a9d8d8ca2d384d1c5","type":0,"news_type":0,"thumbnails":["https://static.tigerbbs.com/03e38a3a3c63bd5a9d8d8ca2d384d1c5"],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":"712d880a7f76c16b985435458e8eab5e","theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"","is_publish_highlight":true,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":null,"symbols":["BK4588","01347","02658","BK4585","00981","VXUS"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"1165876278","title":"异动解读 | 天域半导体盘中大涨11.03%，与韩国EYEQ Lab达成战略合作聚焦碳化硅外延片","url":"https://stock-news.laohu8.com/highlight/detail?id=1165876278","media":"异动解读","labels":["movement"],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/1165876278?lang=zh_cn&edition=full","pubTime":"2026-05-11 11:07","pubTimestamp":1778468858,"startTime":"0","endTime":"0","summary":"天域半导体今日盘中大涨11.03%，引起了市场的广泛关注。消息面上，天域半导体与韩国第三代半导体领军企业EYEQ Lab Inc.正式签署战略合作协议。双方将聚焦碳化硅（SiC）外延片的供应与应用，建立长期稳定的战略合作伙伴关系，共同完善全球第三代半导体供应链布局。这一合作增强了市场对公司未来业务发展的信心。公开资料显示，EYEQ Lab是韩国第三代半导体SiC功率半导体领域的领军企业，该公司此前获三星子公司Patron投资，三星电子也在积极拓展其在SiC功率半导体领域的业务。这一战略合作有望提升天域半导体在第三代半导体领域的竞争力和市场地位。","market":"sg","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":"","theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"movement","news_rank":0,"length":0,"strategy_id":0,"source":"ai_movement_cn","symbols":["02658"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2634475410","title":"港股异动 | 天域半导体(02658)逆市涨超10% 此前与韩国EYEQ Lab达成战略合作 聚焦碳化硅外延片供应与应用","url":"https://stock-news.laohu8.com/highlight/detail?id=2634475410","media":"智通财经","labels":["corporation"],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/2634475410?lang=zh_cn&edition=full","pubTime":"2026-05-11 10:57","pubTimestamp":1778468231,"startTime":"0","endTime":"0","summary":"智通财经APP获悉，天域半导体逆市涨超10%，截至发稿，涨10.25%，报47.96港元，成交额388.29万港元。消息面上，今年2月，天域半导体与韩国第三代半导体领军企业EYEQ Lab Inc.正式签署战略合作协议。双方将聚焦碳化硅外延片的供应与应用，建立长期稳定的战略合作伙伴关系，共同完善全球第三代半导体供应链布局。公开资料显示，EYEQ Lab是韩国第三代半导体SiC功率半导体领域的领军企业。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"http://www.zhitongcaijing.com/content/detail/1440037.html","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"corporation","news_rank":0,"length":0,"strategy_id":0,"source":"stock_zhitongcaijing","symbols":["BK4588","BK4585","BK1169","02658","VXUS"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"1164062025","title":"天域半导体2026年4月无新增发行或股份变动","url":"https://stock-news.laohu8.com/highlight/detail?id=1164062025","media":"公告速递","labels":["SGX"],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/1164062025?lang=zh_cn&edition=full","pubTime":"2026-05-04 17:32","pubTimestamp":1777887135,"startTime":"0","endTime":"0","summary":"广东天域半导体股份有限公司（股票代码：02658）于2026年5月4日公布了2026年4月股份变动月报表。报告显示，截至2026年4月30日，公司普通股（H股和未上市股份）各类股本数量均未发生变化，已发行股份总数保持在58,990,426股H股与334,278,085股未上市股份，合计393,268,511股。\n报告期内，公司无新增发行、购回、注销或库存股调整，股本结构较上月底维持不变。此外，公告未显示任何股份期权或股权激励计划的授出、行使或到期失效记录，也无购回与注销行为。公司亦确认符合香港联交所上市规则所要求的最低公众持股量。\n公告由联席公司秘书李焯星签署。","market":"sh","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":"","theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"SGX","news_rank":0,"length":0,"strategy_id":0,"source":null,"symbols":["02658"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"1138567399","title":"天域半导体授予董事会购回最多一成股份","url":"https://stock-news.laohu8.com/highlight/detail?id=1138567399","media":"公告速递","labels":["shareholding","SGX"],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/1138567399?lang=zh_cn&edition=full","pubTime":"2026-04-27 18:16","pubTimestamp":1777284983,"startTime":"0","endTime":"0","summary":"天域半导体宣布，在即将于2026年5月19日举行的股东周年大会上，公司拟授予董事会一般授权，以不超过其已发行H股总数10%的规模，通过合法资金来源回购股份。根据公告，天域半导体目前已发行H股约58,990,426股，授权若获通过，董事会可在获得相关监管许可及公司章程允许的范围内，于适当时机于市场购回最多约5,899,042股H股。届时如无重大变化，董事会将执行股东所通过的决议。","market":"us","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":"","theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":"天域半导体授予董事会购回最多一成股份","news_tag":"shareholding,SGX","news_rank":0,"length":0,"strategy_id":0,"source":null,"symbols":["02658"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"1190301201","title":"天域半导体(02658)2025年收入稳步增长至7.09亿元 经营结构转型带动亏损大幅收窄","url":"https://stock-news.laohu8.com/highlight/detail?id=1190301201","media":"公告速递","labels":["dataReport","SGX"],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/1190301201?lang=zh_cn&edition=full","pubTime":"2026-04-27 18:02","pubTimestamp":1777284177,"startTime":"0","endTime":"0","summary":"天域半导体于2025年度收入达人民币7.09亿元，较2024年的人民币5.20亿元增长36.5%，主要得益于半导体材料与相关配套业务的持续拓展。报告期内年内亏损由上年度的人民币5.00亿元大幅收窄至人民币0.62亿元，毛利率则从2024年的-72.04%回升至18.81%。融资成本同比上升至人民币0.49亿元，整体经营亏损收窄至人民币0.25亿元，税前亏损减少至人民币0.74亿元。","market":"sh","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":"","theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":"天域半导体(02658)2025年收入稳步增长至7.09亿元 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17:57","pubTimestamp":1777283820,"startTime":"0","endTime":"0","summary":"南财智讯4月27日电，天域半导体（02658.HK）公告，截至2025年12月31日止年度，公司总收入为人民币7.09亿元，同比增长36.5%；年内亏损为人民币6220万元；每股基本亏损为人民币0.15元。","market":"sh","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"http://finance.eastmoney.com/a/202604273720299894.html","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"-1","news_top_title":null,"news_tag":"dataReport","news_rank":0,"length":0,"strategy_id":0,"source":"stock_eastmoney","symbols":["BK1169","02658"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2628851229","title":"港股异动 | 天域半导体(02658)涨超7% AI芯片需求将持续保持强劲 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10:27","pubTimestamp":1776392878,"startTime":"0","endTime":"0","summary":"智通财经APP获悉，天域半导体涨超7%，截至发稿，涨7.34%，报47.66港元，成交额541.5万港元。消息面上，4月16日，台积电发布2026年第一季度业绩并召开分析师会议，台积电表示，人工智能需求极为强劲，芯片需求将持续保持强劲。此前，天域半导体发布2025年业绩，25年公司实现营业收入7.09亿元，同比增加36.49%。在产能方面，公司位于东莞生态园的新生产基地已投入使用，使公司成为中国同时具备6英寸与8英寸外延片大规模产能的主要制造商之一。","market":"sh","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"http://www.zhitongcaijing.com/content/detail/1429778.html","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"dataReport","news_rank":0,"length":0,"strategy_id":0,"source":"stock_zhitongcaijing","symbols":["VXUS","BK1169","BK4585","02658","BK4588"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"1151843497","title":"天域半导体3月股份变动月报表，股本维持不变","url":"https://stock-news.laohu8.com/highlight/detail?id=1151843497","media":"公告速递","labels":["SGX"],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/1151843497?lang=zh_cn&edition=full","pubTime":"2026-04-02 17:35","pubTimestamp":1775122539,"startTime":"0","endTime":"0","summary":"广东天域半导体股份有限公司（股票代码：02658）于2026年4月2日发布截至2026年3月31日的股份变动月报。报告期内，公司总股本为393,268,511股，全部为每股面值人民币1元的普通股。其中，已在香港联合交易所有限公司上市的H股58,990,426股，未上市股份334,278,085股，各类股份均无增加或减少。\n根据公告，报告期内公司未发生新增发行、购回、注销或库藏股变动，也无股份期权及其他激励计划变动。截至2026年3月31日，公司确认符合适用的公众持股量要求，整体股本结构保持稳定。\n公告由联席公司秘书李焯星签署。公司表示，将继续遵守香港联交所《上市规则》及相关法律法规的规定。","market":"us","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":"9589a36a1b64e7c7d7a94166c3b09e9b","theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"SGX","news_rank":0,"length":0,"strategy_id":0,"source":null,"symbols":["02658"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2623316517","title":"天域半导体：2025年净亏损6220万元","url":"https://stock-news.laohu8.com/highlight/detail?id=2623316517","media":"南方财经网","labels":[],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/2623316517?lang=zh_cn&edition=full","pubTime":"2026-03-30 18:02","pubTimestamp":1774864927,"startTime":"0","endTime":"0","summary":"南财智讯3月30日电，天域半导体（02658.HK）公告，截至2025年12月31日止年度，公司总收入为7.09亿元人民币，同比增长36.5%；年内亏损为6220万元人民币；每股基本亏损为0.15元人民币。","market":"sh","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"http://finance.eastmoney.com/a/202603303688856047.html","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"-2","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"stock_eastmoney","symbols":["02658","BK1169"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2623752315","title":"天域半导体(02658)发布年度业绩，收入7.09亿元 同比增加36.49% 成为中国同时具备6英寸与8英寸外延片大规模产能的主要制造商之一","url":"https://stock-news.laohu8.com/highlight/detail?id=2623752315","media":"智通财经","labels":["dataReport"],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/2623752315?lang=zh_cn&edition=full","pubTime":"2026-03-30 17:52","pubTimestamp":1774864366,"startTime":"0","endTime":"0","summary":"智通财经APP讯，天域半导体 发布截至2025年12月31日止年度业绩，该集团取得收入人民币7.09亿元，同比增加36.49%;公司权益股东应占亏损5560.5万元，同比收窄88.71%;每股亏损0.15元。公告称，收入增加主要由于以量驱动的销售策略推动销量大幅增加，以及提供代工服务等业务产生的收入增加所致。在产能方面，公司位于东莞生态园的新生产基地已投入使用，使公司成为中国同时具备6英寸与8英寸外延片大规模产能的主要制造商之一。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"http://www.zhitongcaijing.com/content/detail/1421828.html","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":"天域半导体(02658)发布年度业绩，收入7.09亿元 同比增加36.49% 成为中国同时具备6英寸与8英寸外延片大规模产能的主要制造商之一","news_tag":"dataReport","news_rank":0,"length":0,"strategy_id":0,"source":"stock_zhitongcaijing","symbols":["02658","BK1169"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2620109415","title":"【公司盈警】天域半导体(02658)料2025财年大幅减亏至多89%","url":"https://stock-news.laohu8.com/highlight/detail?id=2620109415","media":"金吾财讯","labels":["dataReport"],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/2620109415?lang=zh_cn&edition=full","pubTime":"2026-03-17 08:49","pubTimestamp":1773708550,"startTime":"0","endTime":"0","summary":"金吾财讯 | 天域半导体(02658)公告公布，截至2025年12月31日止年度(“2025年财政年度”)，集团预期于2025年财政年度录得净亏损约人民币5500万元至人民币6500万元，较截至2024年12月31日止年度(“2024年财政年度”)的净亏损约人民币5.003亿元，亏损大幅减少约87%至89%。董事会认为，净亏损同比大幅减少主要由于2025年财政年度并无录得2024年财政年度确认的重大一次性存货撇减拨备约人民币3.151亿元，加上集团业务增长导致整体收入同比增加约人民币1.90亿元。","market":"us","thumbnail":"https://static.szfiu.com/news/20241108/ZjQ2YTc2OWU5OTg2NTUyNTg4MTk4NA==.jpg","type":0,"news_type":0,"thumbnails":["https://static.szfiu.com/news/20241108/ZjQ2YTc2OWU5OTg2NTUyNTg4MTk4NA==.jpg"],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"1976593","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"dataReport","news_rank":0,"length":0,"strategy_id":0,"source":null,"symbols":["BK1169","02658"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"1102278544","title":"天域半导体(02658)：预计2025年度净亏0.55亿至0.65亿元，同比减亏约87%至89%","url":"https://stock-news.laohu8.com/highlight/detail?id=1102278544","media":"公告速递","labels":["SGX"],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/1102278544?lang=zh_cn&edition=full","pubTime":"2026-03-17 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06:18","pubTimestamp":1773699522,"startTime":"0","endTime":"0","summary":"天域半导体（02658.HK）近日发布盈利预警，预计本财年将录得净亏损。公司指出，亏损主要源于报告期内未对存货计提跌价准备，以及其他相关因素的综合影响。","market":"us","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":"","theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"-2","news_top_title":null,"news_tag":"dataReport","news_rank":0,"length":0,"strategy_id":0,"source":null,"symbols":["BK1169","02658"],"isVideo":false,"video":null,"gpt_icon":0}],"profile":{"websiteUrl":"http://www.sicty.com/","stockEarnings":[{"period":"1week","weight":-0.0162},{"period":"1month","weight":0.1979},{"period":"3month","weight":0.042},{"period":"6month","weight":-0.0586},{"period":"ytd","weight":0.1375}],"compareEarnings":[{"period":"1week","weight":-0.0077},{"period":"1month","weight":-0.0146},{"period":"3month","weight":-0.0436},{"period":"6month","weight":-0.0134},{"period":"1year","weight":0.0995},{"period":"ytd","weight":-0.0012}],"compareStock":{"symbol":"HSI","name":"恒生指数"},"description":"我们是中国碳化硅外延片制造商中最大的碳化硅外延片制造商,以收入及销量计的市场份额分别为30.6%及32.5%。外延片是生产功率半导体器件的关键原材料。与硅等传统半导体材料比较,碳化硅(作为第三代半导体材料之一)具有显著的性能优势,更适用于高压、高温及高频率环境。透过切割、研磨及抛光碳化硅衬底(我们产品的主要原材料),即可获得用于生长外延层、同时具备特定晶面以及适当电学、光学和机械性能的单个外延片。通过外延工艺,可在外延片上生长出特定的单晶薄膜。","exchange":"SEHK","name":"天域半导体","nameEN":"TIANYU 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