晶合集成(02249)_个股概要_股票价格_最新资讯_行情走势_历史数据 - 老虎社区

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02249 晶合集成

休市中 09-04 16:08:01

27.300

-1.000

-3.53%

最高28.980	最低27.020	成交量204.96万
今开28.380	昨收28.300	日振幅6.93%
总市值610.16亿	流通市值61.97亿	总股本22.35亿
成交额5,692万	换手率0.90%	流通股本2.27亿
市净率--	ROE--	每股收益0.00
52周最高--	52周最低--	市盈率--
股息--	股息收益率--	ROA--

数据加载中...

北京优虎网络科技有限公司

免责声明:香港交易所资讯服务有限公司、其控股公司及／或该等控股公司的任何附属公司均竭力确保所提供信息的准确和可靠度，但不能保证其绝对准确和可靠，且亦不会承担因任何不准确或遗漏而引起的任何损失或损害的责任（不管是否侵权法下的责任或合约责任又或其它责任）

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22:07","pubTimestamp":1788358036,"startTime":"0","endTime":"0","summary":"截至2026年9月2日收盘，晶合集成报收于36.02元，较前一交易日下跌3.3%，最新总市值为804.92亿元。公告显示，公司将于2026年9月10日15:00-17:00通过上证路演中心以网络文字互动方式参加科创板2026年半年度半导体制造、设备及材料行业集体业绩说明会。投资者可于2026年9月3日至9月9日16:00前通过上证路演中心“提问预征集”栏目或公司邮箱提交问题。本次说明会主要围绕公司2026年半年度经营成果及财务状况进行互动交流。","market":"hk","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://stock.stockstar.com/RB2026090200042647.shtml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"-1","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"stockstar","symbols":["BK0214","02249","688249","BK1163"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"1124609683","title":"晶合集成（02249）将于9月10日参加科创板半年度半导体行业业绩说明会","url":"https://stock-news.laohu8.com/highlight/detail?id=1124609683","media":"公告速递","labels":["conferences","SGX"],"top":-1,"itemType":null,"share":"https://www.laohunote.com/m/news/1124609683?lang=zh_cn&edition=full","pubTime":"2026-09-02 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17:21","pubTimestamp":1788254460,"startTime":"0","endTime":"0","summary":"南财智讯9月1日电，香港交易所披露信息显示，MorganStanley（摩根士丹利）在晶合集成的H股好仓（L）比例于8月26日从6.64%上升至7.15%。同时淡仓（S）比例从0.05%降至0.02%。","market":"sh","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"stock_eastmoney","url":"http://finance.eastmoney.com/a/202609013861552291.html","rn_cache_url":null,"directOrigin":true},"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"http://finance.eastmoney.com/a/202609013861552291.html","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"stock_eastmoney","symbols":["BK1163","688249","02249","BK0214"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2663807717","title":"晶合集成(02249.HK)拟以持有的合肥瑞昱科技100%股权向安徽瑞晶半导体增资","url":"https://stock-news.laohu8.com/highlight/detail?id=2663807717","media":"智通财经","labels":[],"top":-1,"itemType":null,"share":"https://www.laohunote.com/m/news/2663807717?lang=zh_cn&edition=full","pubTime":"2026-08-31 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19:11","pubTimestamp":1788174697,"startTime":"0","endTime":"0","summary":"2026年8月31日，晶合集成公告称，公司已与安徽瑞晶半导体有限公司、现有股东及其他增资方签署《增资及股东协议》，拟通过股权出资及现金方式共同向目标公司增资4.11亿元。根据协议，晶合集成将以合肥瑞昱科技100%股权作价2.41亿元出资，认购目标公司等额新增注册资本；其他增资方合计以现金1.70亿元认购目标公司新增注册资本。增资完成后，目标公司注册资本将由5.01亿元增至9.11亿元，晶合集成将直接持有目标公司约26.43%股权。","market":"us","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"corporation,SGX","news_rank":0,"length":0,"strategy_id":0,"source":null,"symbols":["02249"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2663042439","title":"股市必读：晶合集成新发布《H股公告-2026年中期报告》","url":"https://stock-news.laohu8.com/highlight/detail?id=2663042439","media":"证券之星","labels":[],"top":-1,"itemType":null,"share":"https://www.laohunote.com/m/news/2663042439?lang=zh_cn&edition=full","pubTime":"2026-08-31 02:41","pubTimestamp":1788115268,"startTime":"0","endTime":"0","summary":"截至2026年8月28日收盘，晶合集成报收于39.1元，下跌4.7%，换手率1.1%，成交量22.07万手，成交额8.77亿元。机构调研要点：四期项目将建设5.5万片/月的12英寸晶圆代工生产线，布局40nm及28nm CIS、OLED、逻辑工艺。公司公告汇总H股公告-2026年中期报告合肥晶合集成电路股份有限公司发布2026年中期报告：报告期内实现收入57.66亿元，同比增长12.40%；归属于母公司股东的净利润为2.45亿元，同比下降26.12%；经营活动产生的现金流量净额为27.98亿元，同比增长64.10%。","market":"hk","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://stock.stockstar.com/RB2026083100000809.shtml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"stockstar","symbols":["BK1163","BK0214","688249","02249"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2663014243","title":"晶合集成2026年半年报：净利润下滑26%，显示驱动芯片占比收缩拖累盈利","url":"https://stock-news.laohu8.com/highlight/detail?id=2663014243","media":"蓝鲸财经","labels":["dataReport"],"top":-1,"itemType":null,"share":"https://www.laohunote.com/m/news/2663014243?lang=zh_cn&edition=full","pubTime":"2026-08-29 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19:59","pubTimestamp":1787745577,"startTime":"0","endTime":"0","summary":"山西证券股份有限公司张天,李明阳近期对晶合集成进行研究并发布了研究报告《制程节点及产品结构优化，国产替代空间广阔》，首次覆盖晶合集成给予买入评级。预计公司2026-2028年EPS分别为0.27\\0.44\\0.56，对应公司8月25日收盘价的2026-2028年PB分别为2.9\\2.8\\2.7，首次覆盖给予“买入-A”　　评级。本文数据来源于山西证券股份有限公司，仅供参考不构成投资建议。","market":"hk","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":["rate"],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://stock.stockstar.com/RB2026082600046652.shtml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"stockstar","symbols":["02249","688249","002500"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2662738625","title":"晶合集成(688249)6月30日股东户数5.22万户，较上期减少15.65%","url":"https://stock-news.laohu8.com/highlight/detail?id=2662738625","media":"证券之星","labels":["shareholding"],"top":-1,"itemType":null,"share":"https://www.laohunote.com/m/news/2662738625?lang=zh_cn&edition=full","pubTime":"2026-08-25 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