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02249 晶合集成
待上市 07-03 16:00:00
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北京优虎网络科技有限公司
免责声明:香港交易所资讯服务有限公司、其控股公司及/或该等控股公司的任何附属公司均竭力确保所提供信息的准确和可靠度,但不能保证其绝对准确和可靠,且亦不会承担因任何不准确或遗漏而引起的任何损失或损害的责任(不管是否侵权法下的责任或合约责任又或其它责任)
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简况
A股MCU概念板块异动拉升
智通财经 · 07-03 13:01
A股MCU概念板块异动拉升
科创50日内涨幅达1.00%,成分股中,传音控股涨7.91%,国博电子涨7.17%,晶合集成涨6.67%,源杰科技涨5.
智通财经 · 07-03 10:53
科创50日内涨幅达1.00%,成分股中,传音控股涨7.91%,国博电子涨7.17%,晶合集成涨6.67%,源杰科技涨5.
科创50探底回升翻红
智通财经 · 07-03 09:44
科创50探底回升翻红
晶合集成招股:拟募资70亿 7月10日上市 奇瑞与高瓴加持 Q1净利降63%
雷递网 · 07-01
晶合集成招股:拟募资70亿 7月10日上市 奇瑞与高瓴加持 Q1净利降63%
新股招股 | 晶合集成今起招股,一手入场费3262.57港元
老虎资讯综合 · 06-30
新股招股 | 晶合集成今起招股,一手入场费3262.57港元
晶合集成(02249)6月30日至7月7日招股 拟全球发售2.16亿股H股 引入集创、璞新科技等基石投资者
智通财经 · 06-30
晶合集成(02249)6月30日至7月7日招股 拟全球发售2.16亿股H股 引入集创、璞新科技等基石投资者
晶合集成(688249.SH):H股发行价格最高不超过每股32.30港元
智通财经 · 06-30
晶合集成(688249.SH):H股发行价格最高不超过每股32.30港元
新股快讯:合肥晶合集成电路(02249)启动全球发售,最高发售价每股32.30港元
公告速递 · 06-30
新股快讯:合肥晶合集成电路(02249)启动全球发售,最高发售价每股32.30港元
晶合集成获得实用新型专利授权:“一种半导体薄膜沉积设备”
证券之星 · 06-16
晶合集成获得实用新型专利授权:“一种半导体薄膜沉积设备”
770亿合肥芯片“黑马”晶合集成冲刺港股IPO:增收不增利,净利润大幅下滑62.61%、净利率不足1%
市场资讯 · 06-11
770亿合肥芯片“黑马”晶合集成冲刺港股IPO:增收不增利,净利润大幅下滑62.61%、净利率不足1%
又一半导体巨头要登陆港交所了
华尔街见闻 · 06-09
又一半导体巨头要登陆港交所了
晶合集成通过聆讯:第一季营收29亿 净利同比降63% 华勤技术持股11%
雷递网 · 06-08
晶合集成通过聆讯:第一季营收29亿 净利同比降63% 华勤技术持股11%
新股消息 | 晶合集成(688249.SH)通过港交所聆讯 2025年12英寸晶圆的平均月产量为139千片
智通财经 · 06-08
新股消息 | 晶合集成(688249.SH)通过港交所聆讯 2025年12英寸晶圆的平均月产量为139千片
晶合集成赴港IPO,专注于12英寸晶圆代工,全球第九!
格隆汇 · 06-01
晶合集成赴港IPO,专注于12英寸晶圆代工,全球第九!
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公司概况
公司名称:
晶合集成
所属市场:
SEHK
上市日期:
--
主营业务:
公司前身系合肥晶合集成电路有限公司,2015年5月设立。主要从事12英寸晶圆代工业务,致力于研发及应用行业先进的工艺,为客户提供不同工艺平台、多种制程节点的晶圆代工服务。主要产品为显示驱动芯片(DDIC)、CMOS图像传感器芯片(CIS)、电源管理芯片(PMIC)、微控制器芯片(MCU)、逻辑芯片(Logic)等。
发行价格:
--
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12:55","pubTimestamp":1782881756,"startTime":"0","endTime":"0","summary":"合肥晶合集成电路股份有限公司(简称“晶合集成”,股票代码:“02249”)日前开启招股,准备2026年7月10日在港交所上市。","market":"sh","thumbnail":"https://leidinews-1256465536.cos.ap-chengdu.myqcloud.com/u_News/20260701/6391850735192303818204780.jpeg","type":0,"news_type":0,"thumbnails":["https://leidinews-1256465536.cos.ap-chengdu.myqcloud.com/u_News/20260701/6391850735192303818204780.jpeg"],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://www.leinews.com/n34237/detail.html","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"-1","news_top_title":null,"news_tag":"dataReport","news_rank":0,"length":0,"strategy_id":0,"source":"leinews_highlight","symbols":["BK0214","688249","IPOS","02249"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"1169199821","title":"新股招股 | 晶合集成今起招股,一手入场费3262.57港元","url":"https://stock-news.laohu8.com/highlight/detail?id=1169199821","media":"老虎资讯综合","labels":[],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/1169199821?lang=zh_cn&edition=full","pubTime":"2026-06-30 08:57","pubTimestamp":1782781066,"startTime":"0","endTime":"0","summary":"6月30日,晶合集成发布公告,公司拟全球发售约2.16亿股H股,中国香港发售2161.67万股H股,国际发售约1.95亿股H股;2026年6月30日至7月7日招股,预期定价日为7月8日;发售价将为每股发售股份30.00港元-32.30港元,H股的每手买卖单位将为100股,中金公司为独家保荐人;预期H股将于2026年7月10日开始于联交所买卖。假设发售价为每股发售股份31.15港元,并假设超额配股权未获行使,公司估计将从全球发售中收取所得款项净额约65.356亿港元。","market":"hk","thumbnail":"https://static.tigerbbs.com/0bc9411b92daca5fa6f9496d92394df3","type":0,"news_type":0,"thumbnails":["https://static.tigerbbs.com/0bc9411b92daca5fa6f9496d92394df3"],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":"新股招股 | 晶合集成今起招股,一手入场费3262.57港元","news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":null,"symbols":["02249"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2647683583","title":"晶合集成(02249)6月30日至7月7日招股 拟全球发售2.16亿股H股 引入集创、璞新科技等基石投资者","url":"https://stock-news.laohu8.com/highlight/detail?id=2647683583","media":"智通财经","labels":["shareholding"],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/2647683583?lang=zh_cn&edition=full","pubTime":"2026-06-30 08:23","pubTimestamp":1782779027,"startTime":"0","endTime":"0","summary":"智通财经APP讯,晶合集成 2026年6月30日至2026年7月7日招股,该公司拟全球发售2.16亿股H股,其中,香港公开发售占约10%,国际发售占约90%,另有15%超额配股权。每股发售价30-32.3港元。预期所得款项净额约23.1%将用于基于AI技术的智能研发及生产。于2023年、2024年及2025年,净利润分别为人民币1.19亿元、人民币4.82亿元及人民币4.67亿元,同年净利润率分别为1.7%、5.3%及4.5%。","market":"hk","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"http://www.zhitongcaijing.com/content/detail/1460877.html","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"shareholding","news_rank":0,"length":0,"strategy_id":0,"source":"stock_zhitongcaijing","symbols":["688249","BK0214","02249","IPOS"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2647588799","title":"晶合集成(688249.SH):H股发行价格最高不超过每股32.30港元","url":"https://stock-news.laohu8.com/highlight/detail?id=2647588799","media":"智通财经","labels":["shareholding"],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/2647588799?lang=zh_cn&edition=full","pubTime":"2026-06-30 08:10","pubTimestamp":1782778235,"startTime":"0","endTime":"0","summary":"智通财经APP讯,晶合集成 发布公告,公司本次全球发售H股基础发行股数为2.16亿股,其中,初步安排香港公开发售2161.67万股,约占全球发售总数的10%;国际发售1.95亿股,约占全球发售总数的90%。在超额配售权悉数行使的情况下,公司本次全球发售H股的最大发行股数为2.49亿股。公司本次H股发行的价格最高不超过每股32.30港元。公司本次发行的H股预计于2026年7月10日在香港联交所挂牌并开始上市交易。","market":"hk","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"http://www.zhitongcaijing.com/content/detail/1460863.html","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"shareholding","news_rank":0,"length":0,"strategy_id":0,"source":"stock_zhitongcaijing","symbols":["EWH","BK0214","02249","688249"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"1149704431","title":"新股快讯:合肥晶合集成电路(02249)启动全球发售,最高发售价每股32.30港元","url":"https://stock-news.laohu8.com/highlight/detail?id=1149704431","media":"公告速递","labels":["shareholding","SGX"],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/1149704431?lang=zh_cn&edition=full","pubTime":"2026-06-30 06:43","pubTimestamp":1782773014,"startTime":"0","endTime":"0","summary":"合肥晶合集成电路股份有限公司主要从事12英寸纯晶圆代工及相关技术服务,制程范围涵盖150nm至40nm,并逐步推进28nm等更先进制程。2023年至2025年,公司收入分别达71.83亿元、91.20亿元及103.88亿元人民币;同期毛利分别为14.61亿元、22.99亿元及23.58亿元人民币;研发费用分别为10.58亿元、12.84亿元及14.53亿元人民币;年内利润则分别为1.19亿元、4.82亿元及4.66亿元人民币。公司于境内A股已在科创板上市,本次计划在港交所进行H股发行,完成后将形成A股与H股并存的架构。","market":"us","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"shareholding,SGX","news_rank":0,"length":0,"strategy_id":0,"source":null,"symbols":["02249"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2643836397","title":"晶合集成获得实用新型专利授权:“一种半导体薄膜沉积设备”","url":"https://stock-news.laohu8.com/highlight/detail?id=2643836397","media":"证券之星","labels":["productRelease"],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/2643836397?lang=zh_cn&edition=full","pubTime":"2026-06-16 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