晶合集成(02249)_个股概要_股票价格_最新资讯_行情走势_历史数据 - 老虎社区

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02249 晶合集成

休市中 08-14 16:08:34

34.620

+0.620

+1.82%

最高35.180	最低33.700	成交量208.98万
今开34.900	昨收34.000	日振幅4.35%
总市值773.76亿	流通市值78.59亿	总股本22.35亿
成交额7,201万	换手率0.92%	流通股本2.27亿
市净率--	ROE--	每股收益0.00
52周最高--	52周最低--	市盈率--
股息--	股息收益率--	ROA--

数据加载中...

北京优虎网络科技有限公司

免责声明:香港交易所资讯服务有限公司、其控股公司及／或该等控股公司的任何附属公司均竭力确保所提供信息的准确和可靠度，但不能保证其绝对准确和可靠，且亦不会承担因任何不准确或遗漏而引起的任何损失或损害的责任（不管是否侵权法下的责任或合约责任又或其它责任）

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13:39","pubTimestamp":1786685964,"startTime":"0","endTime":"0","summary":"8月14日，晶合集成盘中上涨3.41%，报35.16港元/股，成交额5674.59万港元。消息面上，公司董事会定于8月24日召开会议，审议截至6月30日止六个月的中期业绩并考虑派发中期股息，业绩窗口临近催化市场情绪。同业中芯国际当日涨6.66%，半导体板块龙头持续走强带动行业热度。此外，公司8月7日纳入港股通标的后，叠加GIC增持至5.30%、华勤技术增持至11.03%等机构资金持续入场，为股价提供资金面支撑。（以上内容均基于市场公开消息，由程序或算法智能生成，仅作为股价异动提醒，不作为投资建议或交易依据。）","market":"hk","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":null,"symbols":["02249"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"1153608159","title":"异动解读｜晶合集成盘中上涨3.33%，半导体板块持续反弹叠加港股通资金承接","url":"https://stock-news.laohu8.com/highlight/detail?id=1153608159","media":"行情直击","labels":["dataReport"],"top":-1,"itemType":null,"share":"https://www.laohunote.com/m/news/1153608159?lang=zh_cn&edition=full","pubTime":"2026-08-13 09:36","pubTimestamp":1786584970,"startTime":"0","endTime":"0","summary":"8月13日，晶合集成盘中上涨3.33%，报33.86港元/股，成交额291.5万港元。消息面上，半导体板块连续第三日集体走强，华虹宏力涨4.13%、澜起科技涨4.66%、兆易创新涨4.08%、中芯国际涨3.12%，行业系统性反弹延续。此外，公司超额配售的10,886,900股H股于8月11日上市后持续站稳发行价32.30港元上方，新增供给消化顺利。公司已于8月7日被纳入港股通标的，叠加GIC、华勤技术等机构近期持续增持，为股价提供资金面支撑。（以上内容均基于市场公开消息，由程序或算法智能生成，仅作为股价异动提醒，不作为投资建议或交易依据。）","market":"us","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"dataReport","news_rank":0,"length":0,"strategy_id":0,"source":null,"symbols":["02249"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2658903420","title":"晶合集成（688249）披露董事会会议安排，8月12日股价上涨1.28%","url":"https://stock-news.laohu8.com/highlight/detail?id=2658903420","media":"证券之星","labels":[],"top":-1,"itemType":null,"share":"https://www.laohunote.com/m/news/2658903420?lang=zh_cn&edition=full","pubTime":"2026-08-12 22:13","pubTimestamp":1786543996,"startTime":"0","endTime":"0","summary":"截至2026年8月12日收盘，晶合集成报收于40.21元，较前一交易日上涨1.28%，最新总市值为898.55亿元。该股当日开盘40.49元，最高40.66元，最低39.53元，成交额达5.45亿元，换手率为0.68%。近日，合肥晶合集成电路股份有限公司发布公告称，公司董事会将于2026年8月24日举行会议，审议及批准公司及其附属公司截至2026年6月30日止六个月之中期业绩及其发布事项，考虑建议派发中期股息（如有），并处理其他事宜。","market":"hk","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://stock.stockstar.com/RB2026081200040074.shtml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"stockstar","symbols":["688249","BK0214","02249","BK1163"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"1104669720","title":"晶合集成（02249）拟于8月24日召开董事会 审议2026年中期业绩及分红事宜","url":"https://stock-news.laohu8.com/highlight/detail?id=1104669720","media":"公告速递","labels":["SGX"],"top":-1,"itemType":null,"share":"https://www.laohunote.com/m/news/1104669720?lang=zh_cn&edition=full","pubTime":"2026-08-12 16:43","pubTimestamp":1786524206,"startTime":"0","endTime":"0","summary":"晶合集成（02249）8月12日在港交所公告，公司董事会已订于2026年8月24日（星期一）召开会议。会议将审议并批准公司及其附属公司截至2026年6月30日止六个月的中期业绩及其发布事宜，并考虑建议派发中期股息（如有），同时处理其他相关事项。\n此次董事会成员包括：执行董事蔡国智先生、朱才伟先生；非执行董事陆勤航先生、陈小蓓女士、郭兆志先生及邱文生先生；独立非执行董事安广实教授、藺智挺教授及陈鋌先生。","market":"us","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"SGX","news_rank":0,"length":0,"strategy_id":0,"source":null,"symbols":["02249"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"1146748023","title":"异动解读｜晶合集成盘中上涨3.43%，半导体板块集体反弹叠加超额配售消化顺利","url":"https://stock-news.laohu8.com/highlight/detail?id=1146748023","media":"行情直击","labels":[],"top":-1,"itemType":null,"share":"https://www.laohunote.com/m/news/1146748023?lang=zh_cn&edition=full","pubTime":"2026-08-12 09:38","pubTimestamp":1786498681,"startTime":"0","endTime":"0","summary":"8月12日，晶合集成盘中上涨3.43%，报33.24港元/股，成交额318.05万港元。消息面上，半导体板块集体走强，华虹宏力涨2.1%、中芯国际涨1.53%、兆易创新涨2.86%、澜起科技涨2.74%，行业系统性反弹带动公司股价。同时，公司超额配售的10,886,900股H股于8月11日上市首日即站稳发行价32.30港元上方，显示市场对新增供给消化顺利。此外，公司已于8月7日被纳入港股通标的，GIC、华勤技术等机构近期持续增持，为股价提供资金面支撑。（以上内容均基于市场公开消息，由程序或算法智能生成，仅作为股价异动提醒，不作为投资建议或交易依据。）","market":"us","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":null,"symbols":["02249"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2658691693","title":"晶合集成（688249）披露翌日披露报表：因部分行使超额配股权限发行10,886,900股H股，8月11日股价下跌1.19%","url":"https://stock-news.laohu8.com/highlight/detail?id=2658691693","media":"证券之星","labels":[],"top":-1,"itemType":null,"share":"https://www.laohunote.com/m/news/2658691693?lang=zh_cn&edition=full","pubTime":"2026-08-11 22:08","pubTimestamp":1786457333,"startTime":"0","endTime":"0","summary":"截至2026年8月11日收盘，晶合集成报收于39.7元，较前一交易日下跌1.19%，最新总市值为887.15亿元。近日，合肥晶合集成电路股份有限公司提交翌日披露报表，因部分行使超额配股权限而发行及配发10,886,900股H股股份，每股发行价为32.3港元。本次发行后，已发行股份总数由2026年7月31日的216,167,000股增至227,053,900股，占发行前已发行股份的5.04%。有关股份发行已获董事会批准，并符合相关上市规则及法律规定。","market":"sh","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://stock.stockstar.com/RB2026081100037972.shtml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"-1","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"stockstar","symbols":["BK1163","02249","BK0214","688249"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"1163289955","title":"晶合集成(02249)超额配售稀释华勤系持股比例至10.98%","url":"https://stock-news.laohu8.com/highlight/detail?id=1163289955","media":"公告速递","labels":["shareholding","SGX"],"top":-1,"itemType":null,"share":"https://www.laohunote.com/m/news/1163289955?lang=zh_cn&edition=full","pubTime":"2026-08-11 20:45","pubTimestamp":1786452335,"startTime":"0","endTime":"0","summary":"2026年8月12日，合肥晶合集成电路股份有限公司披露，被动稀释导致华勤技术股份有限公司及其一致行动人合计持股比例下降至10.98%。\\n\\n根据公告，晶合集成于2026年7月10日在香港联合交易所主板挂牌上市后，整体协调人于2026年8月6日部分行使超额配售权，涉及10,886,900股H股。华勤技术股份有限公司及其一致行动人合肥勤合电子科技有限公司、华勤通讯香港有限公司所持股份数保持24,526.4594万股不变，但持股比例由11.03%被动稀释至10.98%，触及1%的变动刻度。","market":"us","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"shareholding,SGX","news_rank":0,"length":0,"strategy_id":0,"source":null,"symbols":["02249"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"1112287189","title":"晶合集成部分行使超额配股权发行约1088.69万股H股","url":"https://stock-news.laohu8.com/highlight/detail?id=1112287189","media":"公告速递","labels":["shareholding","SGX"],"top":-1,"itemType":null,"share":"https://www.laohunote.com/m/news/1112287189?lang=zh_cn&edition=full","pubTime":"2026-08-11 18:52","pubTimestamp":1786445532,"startTime":"0","endTime":"0","summary":"2026年8月11日，晶合集成（股票代码：02249）发布翌日披露报表显示，公司于当日根据部分行使超额配股权发行并配发H股合计约1088.69万股（即10,886,900股），占发行前已发行股份（不含库存股份）约5.04%。\n本次发行的每股价格为32.3港元。发行完成后，晶合集成已发行股份总数（不含库存股份）由原先的2.16亿股（216,167,000股）增至2.27亿股（227,053,900股）。\n公司在公告中强调，本次股份发行已获得董事会正式授权，并遵守香港联合交易所有限公司证券上市规则及相关法律法规。公告由联席公司秘书朱才伟签署。","market":"sh","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":"晶合集成部分行使超额配股权发行约1088.69万股H股","news_tag":"shareholding,SGX","news_rank":0,"length":0,"strategy_id":0,"source":null,"symbols":["02249"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2658499459","title":"晶合集成(02249.HK)因超额配股权获部分行使而发行1088.69万股","url":"https://stock-news.laohu8.com/highlight/detail?id=2658499459","media":"智通财经","labels":[],"top":-1,"itemType":null,"share":"https://www.laohunote.com/m/news/2658499459?lang=zh_cn&edition=full","pubTime":"2026-08-11 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