002156 通富微电
已收盘 03-20 15:00:00
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迈为股份：已与长电科技、通富微电、华天科技等头部封装企业建立紧密合作
证券之星 · 03-16
迈为股份：已与长电科技、通富微电、华天科技等头部封装企业建立紧密合作
通富微电：二级市场股价受诸多因素影响
证券之星 · 03-12
通富微电：二级市场股价受诸多因素影响
通富微电：积极布局Chiplet、2D+等顶尖封装技术
证券之星 · 03-12
通富微电：积极布局Chiplet、2D+等顶尖封装技术
通富微电：积极布局Chiplet、2D+等顶尖封装技术
证券之星 · 02-26
通富微电：积极布局Chiplet、2D+等顶尖封装技术
研报掘金丨群益证券(香港)：予通富微电“买进”评级，AMD获Meta大单，公司间接受益
格隆汇 · 02-26
研报掘金丨群益证券(香港)：予通富微电“买进”评级，AMD获Meta大单，公司间接受益
盛合晶微科创板IPO过会，拟募资48亿元加码先进封装
维文信载板与封测 · 02-26
盛合晶微科创板IPO过会，拟募资48亿元加码先进封装
通富微电（002156）披露2026年度向特定对象发行A股股票募集说明书（申报稿），2月24日股价上涨1.34%
证券之星 · 02-24
通富微电（002156）披露2026年度向特定对象发行A股股票募集说明书（申报稿），2月24日股价上涨1.34%
通富微电(002156.SZ)定增股票申请获深交所受理
智通财经 · 02-23
通富微电(002156.SZ)定增股票申请获深交所受理
通富微电最新公告：副总裁胡文龙因退休原因离任
证券之星 · 02-13
通富微电最新公告：副总裁胡文龙因退休原因离任
通富微电：2025年，公司在光电合封（CPO）领域的技术研发取得突破性进展
证券之星 · 02-05
通富微电：2025年，公司在光电合封（CPO）领域的技术研发取得突破性进展
通富微电：公司已于2026年1月21日在巨潮资讯网披露《2025年度业绩预告》
证券之星 · 02-05
通富微电：公司已于2026年1月21日在巨潮资讯网披露《2025年度业绩预告》
通富微电：中大君悦、博衍基金等多家机构于1月29日调研我司
证券之星 · 01-30
通富微电：中大君悦、博衍基金等多家机构于1月29日调研我司
存储芯片涨价潮蔓延，半导体细分龙头业绩“水涨船高”
中金财经 · 01-27
存储芯片涨价潮蔓延，半导体细分龙头业绩“水涨船高”
通富微电最新公告：近期控股股东累计减持公司总股本的0.99%
证券之星 · 01-26
通富微电最新公告：近期控股股东累计减持公司总股本的0.99%
通富微电（002156）披露收到交易商协会《接受注册通知书》，1月22日股价下跌0.2%
证券之星 · 01-22
通富微电（002156）披露收到交易商协会《接受注册通知书》，1月22日股价下跌0.2%
通富微电最新公告：收到中国银行间市场交易商协会接受注册通知书
证券之星 · 01-22
通富微电最新公告：收到中国银行间市场交易商协会接受注册通知书
【机构调研记录】长城基金调研通富微电、昌红科技
证券之星 · 01-22
【机构调研记录】长城基金调研通富微电、昌红科技
通富微电：平安证券、长城基金等多家机构于1月21日调研我司
证券之星 · 01-21
通富微电：平安证券、长城基金等多家机构于1月21日调研我司
1月21日通富微电（002156）龙虎榜数据：机构净卖出1.25亿元，北向资金净买入3.26亿元
证券之星 · 01-21
1月21日通富微电（002156）龙虎榜数据：机构净卖出1.25亿元，北向资金净买入3.26亿元
A股午评 | 指数震荡反弹 科创50半日涨3%！贵金属、芯片股走强
智通财经 · 01-21
A股午评 | 指数震荡反弹 科创50半日涨3%！贵金属、芯片股走强
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公司概况
公司名称：
通富微电子股份有限公司
所属行业：
计算机、通信和其他电子设备制造业
上市日期：
2007-08-16
主营业务：
通富微电子股份有限公司的主营业务是集成电路封装测试服务提供，为全球客户提供设计仿真和封装测试一站式服务。公司的主要产品是设计仿真和封装测试一站式服务。截至2025年6月30日，集团累计专利申请量突破1,700件，其中发明专利占比近70%；累计授权专利超800项，形成了涵盖传统封装和先进封装的全方位知识产权保护网络，为公司高质量发展注入创新动能。
发行价格：
8.82
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21:18","pubTimestamp":1773667090,"startTime":"0","endTime":"0","summary":"证券之星消息，迈为股份03月16日在投资者关系平台上答复投资者关心的问题。现在国产替代进程加快，希望公司把握机遇，开拓半导体业务迈为股份回复：投资者您好，在半导体封装设备中，公司在晶圆切割、研磨、抛光、键合等高精度加工环节可提供成套工艺设备解决方案，已与长电科技、通富微电、华天科技、盛合晶微、甬硅电子等国内头部封装企业建立了紧密合作。","market":"hk","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://stock.stockstar.com/RB2026031600034647.shtml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"corporation","news_rank":0,"length":0,"strategy_id":0,"source":"stockstar","symbols":["LU1979443071.USD","LU2580892862.HKD","002156","LU2148510915.USD","BK0125","002185","BK0139","LU2580892789.USD","300751","BK0072","BK0132","600584","BK0251","LU1655091616.SGD","SG9999001226.SGD","LU1934453819.USD","BK0188","BK0028","LU1064131003.USD","LU1328615791.USD","BK0214","BK0198","LU1064130708.USD","BK0121"],"gpt_icon":0},{"id":"2618970986","title":"通富微电：二级市场股价受诸多因素影响","url":"https://stock-news.laohu8.com/highlight/detail?id=2618970986","media":"证券之星","labels":[],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/2618970986?lang=zh_cn&edition=full","pubTime":"2026-03-12 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08:46","pubTimestamp":1773276369,"startTime":"0","endTime":"0","summary":"证券之星消息，通富微电(002156)03月12日在投资者关系平台上答复投资者关心的问题。投资者提问：董秘你好，请问公司cowosL研发到什么程度了？是否已经投产？通富微电回复：尊敬的投资者，您好！公司紧跟行业技术发展趋势，抓住市场发展机遇，面向未来高附加值产品以及市场热点方向，立足长远，大力开发扇出型、圆片级、倒装焊等封装技术并扩充其产能；此外，积极布局Chiplet、2D+等顶尖封装技术，形成了差异化竞争优势。谢谢！以上内容为证券之星据公开信息整理，由AI算法生成（网信算备310104345710301240019号），不构成投资建议。","market":"sh","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://stock.stockstar.com/RB2026031200006330.shtml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"productRelease","news_rank":0,"length":0,"strategy_id":0,"source":"stockstar","symbols":["002156","BK0214","BK0121","BK0125"],"gpt_icon":0},{"id":"2614188350","title":"通富微电：积极布局Chiplet、2D+等顶尖封装技术","url":"https://stock-news.laohu8.com/highlight/detail?id=2614188350","media":"证券之星","labels":["productRelease"],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/2614188350?lang=zh_cn&edition=full","pubTime":"2026-02-26 16:00","pubTimestamp":1772092827,"startTime":"0","endTime":"0","summary":"证券之星消息，通富微电(002156)02月26日在投资者关系平台上答复投资者关心的问题。投资者提问：董秘，您好！请问公司的cowos先进封装研发到什么程度了？是否已经部署产线？通富微电回复：尊敬的投资者，您好！公司紧跟行业技术发展趋势，抓住市场发展机遇，面向未来高附加值产品以及市场热点方向，立足长远，大力开发扇出型、圆片级、倒装焊等封装技术并扩充其产能；此外，积极布局Chiplet、2D+等顶尖封装技术，形成了差异化竞争优势。谢谢！以上内容为证券之星据公开信息整理，由AI算法生成（网信算备310104345710301240019号），不构成投资建议。","market":"fut","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://stock.stockstar.com/RB2026022600021620.shtml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"productRelease","news_rank":0,"length":0,"strategy_id":0,"source":"stockstar","symbols":["002156","BK0214","BK0121","BK0125"],"gpt_icon":0},{"id":"2614099373","title":"研报掘金丨群益证券(香港)：予通富微电“买进”评级，AMD获Meta大单，公司间接受益","url":"https://stock-news.laohu8.com/highlight/detail?id=2614099373","media":"格隆汇","labels":[],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/2614099373?lang=zh_cn&edition=full","pubTime":"2026-02-26 14:08","pubTimestamp":1772086126,"startTime":"0","endTime":"0","summary":"群益证券(香港)研报指出，Meta与AMD宣布合作，将部署总计六千兆瓦AMD的芯片。预计未来数年内将为AMD带来超千亿美元规模的收入。通富微电作为AMD的核心封测厂商，有望深度受益于大客户业务规模的提升，上调2027年盈利预测5%。此次合作利好通富微电，通富微电是AMD的核心封装厂，通富微电槟城及苏州厂AMD均参股15%，因此公司收入端有录得较多增量，长期影响正面。目前股价对应2026-2027年PE分别为40倍和26倍，予以“买进”评级。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20260226140852a4ca2b06&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, 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10:01","pubTimestamp":1772071280,"startTime":"0","endTime":"0","summary":"△广告与正文无关2月24日，上海证券交易所披露，盛合晶微半导体有限公司科创板首次公开发行股票申请已通过上市审核委员会审议会议。招股书披露的数据显示，盛合晶微的客户集中度呈现逐年上升趋势。此次冲刺科创板，盛合晶微计划募集资金48亿元，投向\"三维多芯片集成封装项目\"和\"超高密度互联三维多芯片集成封装项目\"。若此次发行成功，盛合晶微将成为A股市场首家以晶圆级先进封装为核心业务的上市公司。","market":"hk","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20260226110415a4c99118&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, 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17:18","pubTimestamp":1771924698,"startTime":"0","endTime":"0","summary":"截至2026年2月24日收盘，通富微电报收于49.16元，较前一交易日上涨1.34%，最新总市值为746.05亿元。通富微电子股份有限公司于2026年2月24日披露《2026年度向特定对象发行A股股票募集说明书（申报稿）》。公告显示，公司拟向特定对象发行A股股票，募集资金总额不超过44亿元，用于存储芯片封测、汽车等新兴应用领域封测、晶圆级封测、高性能计算及通信领域封测产能提升项目，并补充流动资金及偿还银行贷款。","market":"hk","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://stock.stockstar.com/RB2026022400032170.shtml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"stockstar","symbols":["159982","BK0125","399300","002156","BK0121","BK0214"],"gpt_icon":0},{"id":"2613497200","title":"通富微电(002156.SZ)定增股票申请获深交所受理","url":"https://stock-news.laohu8.com/highlight/detail?id=2613497200","media":"智通财经","labels":["shareholding"],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/2613497200?lang=zh_cn&edition=full","pubTime":"2026-02-23 16:46","pubTimestamp":1771836395,"startTime":"0","endTime":"0","summary":"智通财经APP讯，通富微电(002156.SZ)公告，公司近日收到深圳证券交易所出具的《关于受理通富微电子股份有限公司向特定对象发行股票申请文件的通知》。深交所根据相关规定对公司报送的向特定对象发行股票的申请文件进行了核对，认为申请文件齐备，决定予以受理。","market":"hk","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"http://www.zhitongcaijing.com/content/detail/1406318.html","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"shareholding","news_rank":0,"length":0,"strategy_id":0,"source":"stock_zhitongcaijing","symbols":["BK0214","BK0125","002156","BK0121"],"gpt_icon":0},{"id":"2611158491","title":"通富微电最新公告：副总裁胡文龙因退休原因离任","url":"https://stock-news.laohu8.com/highlight/detail?id=2611158491","media":"证券之星","labels":["executive"],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/2611158491?lang=zh_cn&edition=full","pubTime":"2026-02-13 18:11","pubTimestamp":1770977471,"startTime":"0","endTime":"0","summary":"通富微电(002156.SZ)公告称，公司董事会近日收到副总裁胡文龙的离职报告，胡文龙因退休原因不再担任公司副总裁，离职后不再担任公司及下属子公司其他职务。以上内容为证券之星据公开信息整理，由AI算法生成（网信算备310104345710301240019号），不构成投资建议。","market":"sh","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://stock.stockstar.com/RB2026021300029213.shtml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"executive","news_rank":0,"length":0,"strategy_id":0,"source":"stockstar","symbols":["BK0121","BK0214","BK0125","002156"],"gpt_icon":0},{"id":"2609348631","title":"通富微电：2025年，公司在光电合封（CPO）领域的技术研发取得突破性进展","url":"https://stock-news.laohu8.com/highlight/detail?id=2609348631","media":"证券之星","labels":["dataReport"],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/2609348631?lang=zh_cn&edition=full","pubTime":"2026-02-05 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18:21","pubTimestamp":1769077281,"startTime":"0","endTime":"0","summary":"通富微电(002156.SZ)公告称，公司近日收到中国银行间市场交易商协会出具的两份《接受注册通知书》，同意接受公司超短期融资券和中期票据的注册。其中，超短期融资券注册金额为10亿元，中期票据注册金额为20亿元，注册额度自通知书落款之日起2年内有效。公司将根据通知要求，在注册额度及有效期内择机发行并及时履行信息披露义务。以上内容为证券之星据公开信息整理，由AI算法生成（网信算备310104345710301240019号），不构成投资建议。","market":"sh","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://stock.stockstar.com/RB2026012200030790.shtml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"shareholding","news_rank":0,"length":0,"strategy_id":0,"source":"stockstar","symbols":["LU0072462343.USD","LU0307460666.USD","SG9999006597.SGD","BK1521","03143","BK1231","BK0125","LU2097828805.USD","LU0651947912.USD","LU1634259391.SGD","IE00BWDBJ730.SGD","LU2097828474.EUR","BK0188","BK0183","LU1497733557.USD","LU1522347837.USD","03988","LU1497734951.SGD","LU1634259557.SGD","LU2097828714.EUR","LU1048588211.SGD","601988","BK0015","LU0293314216.USD","BK0012","BK1560","LU1224444064.USD","LU0348805143.USD","LU1051768304.USD","LU1497733631.SGD","IE00BQJZWZ67.USD","LU1282651121.HKD","IE00B19Z5X02.USD","SG9999001093.SGD","LU2097828557.USD","BK0214","LU1282651048.USD","LU2097828631.EUR","LU1515016050.SGD","BK0278","002156","BK0121","LU0651946864.USD","LU0588546209.SGD","BK0028","LU1051769294.HKD"],"gpt_icon":0},{"id":"2605434941","title":"【机构调研记录】长城基金调研通富微电、昌红科技","url":"https://stock-news.laohu8.com/highlight/detail?id=2605434941","media":"证券之星","labels":[],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/2605434941?lang=zh_cn&edition=full","pubTime":"2026-01-22 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